Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
This application note contains a reference design consisting of HDL IP and Xilinx AdvancedConfiguration Environment (ACE) software utilities that give designers great flexibility increating in-system programming (ISP) solutions. In-system programming support allowsdesigners to revise existing designs, package the new bitstream programming files with theprovided software utilities, and update the remote system through the JTAG interface using theEmbedded JTAG ACE Player.
The exacting technological demands created byincreasing bandwidth requirements have given riseto significant advances in FPGA technology thatenable engineers to successfully incorporate highspeedI/O interfaces in their designs. One aspect ofdesign that plays an increasingly important role isthat of the FPGA package. As the interfaces get fasterand wider, choosing the right package has becomeone of the key considerations for the systemdesigner.
The LPC2292/2294 microcontrollers are based on a 16/32-bit ARM7TDMI-S CPU with real-time emulation and embedded trace support, together with 256 kB of embedded high-speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at the maximum clock rate. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 pct with minimal performance penalty.
With their 144-pin package, low power consumption, various 32-bit timers, 8-channel 10-bit ADC, 2/4 (LPC2294) advanced CAN channels, PWM channels and up to nine external interrupt pins these microcontrollers are particularly suitable for automotive and industrial control applications as well as medical systems and fault-tolerant maintenance buses. The number of available fast GPIOs ranges from 76 (with external memory) through 112 (single-chip). With a wide range of additional serial communications interfaces, they are also suited for communication gateways and protocol converters as well as many other general-purpose applications.
Remark: Throughout the data sheet, the term LPC2292/2294 will apply to devices with and without the /00 or /01 suffix. The suffixes /00 and /01 will be used to differentiate from other devices only when necessary.
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PIC16C65B@QFP44 [SA245]
PIC16C65B: Part number
QFP44: Package in QFP44
SA245: Adapter purchase number
AM29DL320GT@FBGA48 [SA642+B026]
AM29DL320GT: Part number
FBGA48: Package in FBGA48
SA642: Adapter purchase number (Top board with socket)
B026: Adapter purchase number (Bottom board, exchangable for different parts)
87C196CA@PLCC68(universal adapter) [PEP+S414T]
87C196CA: Part number
PLCC68: Package in PLCC68
universal adapter: this adapter is valid for all parts in this package
PEP: The PEP (Pin-driver Expansion Pack necessary to work with the adapter S414T)
S414T: Adapter purchase number (Universal for all parts in this package)
S71PL127J80B@FBGA64(special adapter) [(SA642A-B079A-Y096AF001)]
S71PL127J80B: Part number
FBGA64: Package in FBGA64
special adapter: this adapter is valid for this
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsiderations and general recommendations for choosing a 0.4mm- or 0.5mm-pitch WLP for yourapplication.
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
This application note contains a reference design consisting of HDL IP and Xilinx AdvancedConfiguration Environment (ACE) software utilities that give designers great flexibility increating in-system programming (ISP) solutions. In-system programming support allowsdesigners to revise existing designs, package the new bitstream programming files with theprovided software utilities, and update the remote system through the JTAG interface using theEmbedded JTAG ACE Player.
The exacting technological demands created byincreasing bandwidth requirements have given riseto significant advances in FPGA technology thatenable engineers to successfully incorporate highspeedI/O interfaces in their designs. One aspect ofdesign that plays an increasingly important role isthat of the FPGA package. As the interfaces get fasterand wider, choosing the right package has becomeone of the key considerations for the systemdesigner.
