Advances in low power electronics now allow placementof battery-powered sensors and other devices in locationsfar from the power grid. Ideally, for true grid independence,the batteries should not need replacement, but instead berecharged using locally available renewable energy, suchas solar power. This Design Note shows how to producea compact battery charger that operates from a small2-cell solar panel. A unique feature of this design is thatthe DC/DC converter uses power point control to extractmaximum power from the solar panel.
The LTC®4151 is a high side power monitor that includesa 12-bit ADC for measuring current and voltage, as wellas the voltage on an auxiliary input. Data is read throughthe widely used I2C interface. An unusual feature in thisdevice is its 7V to 80V operating range, allowing it to coverapplications from 12V automotive to 48V telecom.
The SN65LBC170 and SN75LBC170 aremonolithic integrated circuits designed forbidirectional data communication on multipointbus-transmission lines. Potential applicationsinclude serial or parallel data transmission, cabledperipheral buses with twin axial, ribbon, ortwisted-pair cabling. These devices are suitablefor FAST-20 SCSI and can transmit or receivedata pulses as short as 25 ns, with skew lessthan 3 ns.These devices combine three 3-state differentialline drivers and three differential input linereceivers, all of which operate from a single 5-Vpower supply.The driver differential outputs and the receiverdifferential inputs are connected internally to formthree differential input/output (I/O) bus ports thatare designed to offer minimum loading to the buswhenever the driver is disabled or VCC = 0. Theseports feature a wide common-mode voltage rangemaking the device suitable for party-lineapplications over long cable runs.
NXP Semiconductor designed the LPC2400 microcontrollers around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded Trace. The LPC2400 microcontrollers have 512 kB of on-chip high-speedFlash memory. This Flash memory includes a special 128-bit wide memory interface andaccelerator architecture that enables the CPU to execute sequential instructions fromFlash memory at the maximum 72 MHz system clock rate. This feature is available onlyon the LPC2000 ARM Microcontroller family of products. The LPC2400 can execute both32-bit ARM and 16-bit Thumb instructions. Support for the two Instruction Sets meansEngineers can choose to optimize their application for either performance or code size atthe sub-routine level. When the core executes instructions in Thumb state it can reducecode size by more than 30 % with only a small loss in performance while executinginstructions in ARM state maximizes core performance.
MPLAB C30用戶指南(英文)
HIGHLIGHTSThe information covered in this chapter is as follows:• About this Guide• Recommended Reading• Troubleshooting• The Microchip Web Site• Development Systems Customer Notification Service• Customer Support
Document LayoutThe document layout is as follows:• Chapter 1: Compiler Overview – describes MPLAB C30, development tools andfeature set.• Chapter 2: Differences between MPLAB C30 and ANSI C – describes thedifferences between the C language supported by MPLAB C30 syntax and thestandard ANSI-89 C.• Chapter 3: Using MPLAB C30 – describes how to use the MPLAB C30 compilerfrom the command line.• Chapter 4: MPLAB C30 Runtime Environment – describes the MPLAB C30runtime model, including information on sections, initialization, memory models, thesoftware stack and much more.• Chapter 5: Data Types – describes MPLAB C30 integer, floating point and pointerdata types.• Chapter 6: Device Support Files – describes the MPLAB C30 header and registerdefinition files, as well as how to use with SFR’s.• Chapter 7: Interrupts – describes how to use interrupts.• Chapter 8: Mixing Assembly Language and C Modules – provides guidelines tousing MPLAB C30 with MPLAB ASM30 assembly language modules.
The HCS12X family is the successor to the HCS12family, with many additional features. One new feature isthe increased memory available to the CPU and themethods available to access it. This document focuses onthe improved memory map configuration.
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
The C8051F020/1/2/3 devices are fully integrated mixed-signal System-on-a-Chip MCUs with 64 digital I/O pins (C8051F020/2) or 32 digital I/O pins (C8051F021/3). Highlighted features are listed below; refer to Table 1.1 for specific product feature selection.
With the Altera Nios II embedded processor, you as the system designercan accelerate time-critical software algorithms by adding custominstructions to the Nios II processor instruction set. Using custominstructions, you can reduce a complex sequence of standard instructionsto a single instruction implemented in hardware. You can use this featurefor a variety of applications, for example, to optimize software innerloops for digital signal processing (DSP), packet header processing, andcomputation-intensive applications. The Nios II configuration wizard,part of the Quartus® II software’s SOPC Builder, provides a graphicaluser interface (GUI) used to add up to 256 custom instructions to theNios II processor
