The 87C576 includes two separate methods of programming theEPROM array, the traditional modified Quick-Pulse method, and anew On-Board Programming technique (OBP).Quick Pulse programming is a method using a number of devicepins in parallel (see Figure 1) and is the traditional way in which87C51 family members have been programmed. The Quick-Pulsemethod supports the following programming functions:– program USER EPROM– verify USER EPROM– program KEY EPROM– program security bits– verify security bits– read signature bytesThe Quick-Pulse method is quite easily suited to standardprogramming equipment as evidenced by the numerous vendors of87C51 compatible programmers on the market today. Onedisadvantage is that this method is not well suited to programming inthe embedded application because of the large number of signallines that must be isolated from the application. In addition, parallelsignals from a programmer would need to be cabled to theapplication’s circuit board, or the application circuit board wouldneed to have logic built-in to perform the programming functions.These requirements have generally made in-circuit programmingusing the modified Quick Pulse method impractical in almost all87C51 family applications.
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
針對飛行模擬器座艙數據采集的復雜性，設計了一種基于以太網分布式的數據采集控制系統，該系統是RCM5700微處理器模塊上的以太網應用。在系統的基礎上具體討論了PoE技術的應用，在傳輸數據的網線上同時提供電流，提出并實現了一種包括輔助電源在內的完整可靠的PoE供電方案。設計采用美國國家半導體的LM5073和LM5576并根據不同的負載情況，進行穩定可靠的電壓轉換，以滿足數據采集電路的要求。實驗結果表明：該設計穩定可靠，滿足低于13 W的采集節點供電要求，提高了模擬器信號采集系統的通用性和標準化程度，避免了以往數據采集節點單獨繁瑣的電源設計。
Abstract:
Aiming at the complexity of large avion simulation and controlling，the simulator cabin distribute data collecting and control system was designed. This system is the application of RCM5700 on Ethernet. Based on this system，PoE technique that makes Ethernet can also provide power were expounded with emphasis and included FAUX design the PoE resolution was realized. To achieve the requirement of this system，LM5073 and LM5576 were used to DC-DC switch. From the data of experiment，the design filled the requirement of power-need of node whose power was lower than 13W. The application of the technique can advance the degree of simulation data collections currency and standardization and avoid designing additional power system.
為滿足無線網絡技術具有低功耗、節點體積小、網絡容量大、網絡傳輸可靠等技術要求，設計了一種以MSP430單片機和CC2420射頻收發器組成的無線傳感節點。通過分析其節點組成，提出了ZigBee技術中的幾種網絡拓撲形式，并研究了ZigBee路由算法。針對不同的傳輸要求形式選用不同的網絡拓撲形式可以盡大可能地減少系統成本。同時針對不同網絡選用正確的ZigBee路由算法有效地減少了網絡能量消耗，提高了系統的可靠性。應用試驗表明，采用ZigBee方式通信可以提高傳輸速率且覆蓋范圍大，與傳統的有線通信方式相比可以節約40%左右的成本。
Abstract:
To improve the proposed technical requirements such as low-ower， small nodes， large capacity and reliable network transmission， wireless sensor nodes based on MSP430 MCU and CC2420 RF transceiver were designed. This paper provided network topology of ZigBee technology by analysing the component of the nodes and researched ZigBee routing algorithm. Aiming at different requirements of transmission mode to choose the different network topologies form can most likely reduce the system cost. And aiming at different network to choose the correct ZigBee routing algorithm can effectively reduced the network energy consumption and improved the reliability of the system. Results show that the communication which used ZigBee mode can improve the transmission rate， cover more area and reduce 40% cost compared with traditional wired communications mode.
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
The Virtex-4 features, such as the programmable IDELAY and built-in FIFO support, simplifythe bridging of a high-speed, PCI-X core to large amounts of DDR-SDRAM memory. Onechallenge is meeting the PCI-X target initial latency specification. PCI-X Protocol Addendum tothe PCI Local Bus Specification Revision 2.0a ([Ref 6]) dictates that when a target signals adata transfer, "the target must do so within 16 clocks of the assertion of FRAME#." PCItermination transactions, such as Split Response/Complete, are commonly used to meet thelatency specifications. This method adds complexity to the design, as well as additional systemlatency. Another solution is to increase the ratio of the memory frequency to the PCI-X busfrequency. However, this solution increases the required power and clock resource usage.
Abstract: How can an interface change a happy face to a sad face? Engineers have happy faces when an interface works properly.Sad faces indicate failure somewhere. Because interfaces between microprocessors and ICs are simple—even easy—they are oftenignored until interface failure causes sad faces all around. In this article, we discuss a common SPI error that can be almostimpossible to find in a large system. Links to interface tutorial information are provided for complete information. Noise as a systemissue and ICs to minimize its effects are also described.
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