The Virtex-4 features, such as the programmable IDELAY and built-in FIFO support, simplifythe bridging of a high-speed, PCI-X core to large amounts of DDR-SDRAM memory. Onechallenge is meeting the PCI-X target initial latency specification. PCI-X Protocol Addendum tothe PCI Local Bus Specification Revision 2.0a ([Ref 6]) dictates that when a target signals adata transfer, "the target must do so within 16 clocks of the assertion of FRAME#." PCItermination transactions, such as Split Response/Complete, are commonly used to meet thelatency specifications. This method adds complexity to the design, as well as additional systemlatency. Another solution is to increase the ratio of the memory frequency to the PCI-X busfrequency. However, this solution increases the required power and clock resource usage.
標(biāo)簽：
PCI-X
XAPP
DIMM
708
上傳時間：
2013-11-24
上傳用戶：18707733937
The LogiCORE™ GTP Wizard automates the task of creating HDL wrappers to configure the high-speed serial GTP transceivers in Virtex™-5 LXT and SXT devices. The menu-driven interface allows one or more GTP transceivers to be configured using pre-definedtemplates for popular industry standards, or from scratch, to support a wide variety of custom protocols.The Wizard produces a wrapper, an example design, and a testbench for rapid integration and verification of the serial interface with your custom function
Features• Creates customized HDL wrappers to configureVirtex-5 RocketIO™ GTP transceivers• Users can configure Virtex-5 GTP transceivers toconform to industry standard protocols usingpredefined templates, or tailor the templates forcustom protocols• Included protocol templates provide support for thefollowing specifications: Aurora, CPRI, FibreChannel 1x, Gigabit Ethernet, HD-SDI, OBSAI,OC3, OC12, OC48, PCI Express® (PCIe®), SATA,SATA II, and XAUI• Automatically configures analog settings• Each custom wrapper includes example design, testbench; and both implementation and simulation scripts
標(biāo)簽：
Transceiver
Virtex
Wizar
GTP
上傳時間：
2013-10-20
上傳用戶：dave520l
This document provides practical, common guidelines for incorporating PCI Express interconnect
layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10-
layer or more server baseboard designs. Guidelines and constraints in this document are intended
for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI
Express devices located on the same baseboard (chip-to-chip routing) and interconnects between
a PCI Express device located “down” on the baseboard and a device located “up” on an add-in
card attached through a connector.
This document is intended to cover all major components of the physical interconnect including
design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card
edge-finger and connector considerations. The intent of the guidelines and examples is to help
ensure that good high-speed signal design practices are used and that the timing/jitter and
loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect.
However, while general physical guidelines and suggestions are given, they may not necessarily
guarantee adequate performance of the interconnect for all layouts and implementations.
Therefore, designers should consider modeling and simulation of the interconnect in order to
ensure compliance to all applicable specifications.
The document is composed of two main sections. The first section provides an overview of
general topology and interconnect guidelines. The second section concentrates on physical layout
constraints where bulleted items at the beginning of a topic highlight important constraints, while
the narrative that follows offers additional insight.
標(biāo)簽：
pci
PCB
設(shè)計(jì)規(guī)范
上傳時間：
2014-01-24
上傳用戶：s363994250
