This toolbox implements the same methods on small dadta sets and imlements a trimming method using a random uniform distribution to quickly process large data sets.
Wi-Fi pollution, or an excessive number of access points in the area, especially on the same or neighboring channel, can prevent access and interfere with the use of other access points by others, caused by overlapping channels in the 802.11g/b spectrum
These Fourier routines were originally based on the Fourier
routines of the same names from the NETLIB bihar and fftpack
fortran libraries developed by Paul N. Swarztrauber at the National
Center for Atmospheric Research in Boulder, CO USA. They have been
reimplemented in C and optimized in a few ways for OggSquish.
Digital convergence, in recent history, has been prevalentin the consumer equipment domain and the designengineers in this area have been struggling with a plethoraof emerging standards and protocols. What lessons can welearn from their struggle? The same dilemmas now existin in-vehicle telematics and infotainment systems but withthe added issues of extremes of temperature, safety,security, and time in market.
Differential Nonlinearity: Ideally, any two adjacent digitalcodes correspond to output analog voltages that are exactlyone LSB apart. Differential non-linearity is a measure of theworst case deviation from the ideal 1 LSB step. For example,a DAC with a 1.5 LSB output change for a 1 LSB digital codechange exhibits 1⁄2 LSB differential non-linearity. Differentialnon-linearity may be expressed in fractional bits or as a percentageof full scale. A differential non-linearity greater than1 LSB will lead to a non-monotonic transfer function in aDAC.Gain Error (Full Scale Error): The difference between theoutput voltage (or current) with full scale input code and theideal voltage (or current) that should exist with a full scale inputcode.Gain Temperature Coefficient (Full Scale TemperatureCoefficient): Change in gain error divided by change in temperature.Usually expressed in parts per million per degreeCelsius (ppm/°C).Integral Nonlinearity (Linearity Error): Worst case deviationfrom the line between the endpoints (zero and full scale).Can be expressed as a percentage of full scale or in fractionof an LSB.LSB (Lease-Significant Bit): In a binary coded system thisis the bit that carries the smallest value or weight. Its value isthe full scale voltage (or current) divided by 2n, where n is theresolution of the converter.Monotonicity: A monotonic function has a slope whose signdoes not change. A monotonic DAC has an output thatchanges in the same direction (or remains constant) for eachincrease in the input code. the converse is true for decreasing codes.
This document provides practical, common guidelines for incorporating PCI Express interconnect
layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10-
layer or more server baseboard designs. Guidelines and constraints in this document are intended
for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI
Express devices located on the same baseboard (chip-to-chip routing) and interconnects between
a PCI Express device located “down” on the baseboard and a device located “up” on an add-in
card attached through a connector.
This document is intended to cover all major components of the physical interconnect including
design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card
edge-finger and connector considerations. The intent of the guidelines and examples is to help
ensure that good high-speed signal design practices are used and that the timing/jitter and
loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect.
However, while general physical guidelines and suggestions are given, they may not necessarily
guarantee adequate performance of the interconnect for all layouts and implementations.
Therefore, designers should consider modeling and simulation of the interconnect in order to
ensure compliance to all applicable specifications.
The document is composed of two main sections. The first section provides an overview of
general topology and interconnect guidelines. The second section concentrates on physical layout
constraints where bulleted items at the beginning of a topic highlight important constraints, while
the narrative that follows offers additional insight.
Advancements in board assembly, PCB layout anddigital IC integration have produced a new generationof densely populated, high performance systems. Theboard-mounted point-of-load (POL) DC/DC power suppliesin these systems are subject to the same demandingsize, high power and performance requirements asother subsystems. The rigorous new POL demands aredifficult to meet with traditional controller or regulatorICs, or power modules.
As the performance of many handheld devices approachesthat of laptop computers, design complexity also increases.Chief among them is thermal management—how doyou meet increasing performance demands while keepinga compact and small product cool in the user’s hand?For instance, as battery capacities inevitably increase,charge currents will also increase to maintain or improvetheir charge times. Traditional linear regulator-based batterychargers will not be able to meet the charge currentand effi ciency demands necessary to allow a product torun cool. What is needed is a switching-based chargerthat takes just about the same amount of space as a linearsolution—but without the heat.
