-
The ISO7220 and ISO7221 are dual-channel digital isolators. To facilitate PCB layout, the channels are orientedin the same direction in the ISO7220 and in opposite directions in the ISO7221. These devices have a logic inputand output buffer separated by TI’s silicon-dioxide (SiO2) isolation barrier, providing galvanic isolation of up to4000 V. Used in conjunction with isolated power supplies, these devices block high voltage, isolate grounds, andprevent noise currents on a data bus or other circuits from entering the local ground and interfering with ordamaging sensitive circuitry.
標(biāo)簽：
ISOLATORS
DIGITAL
DUAL
上傳時(shí)間：
2013-10-24
上傳用戶：hbsunhui
-
Abstract: This application note explains the hardware of different types of 1-Wire® interfaces and software examples adapted to this hardware with a focus on serial ports. Depending on the types of iButtons required for a project and the type of computer to be used, the most economical interface is easily found. The hardware examples shown are basically two different types: 5V general interface and 12V RS-232 interface. Within the 5V group a common printed circuit board could be used for all circuits described. The variations can be achieved by different populations of components. The same principal is used for the 12V RS-232 interface. The population determines if it is a Read all or a Read/Write all type of interface.
There are other possible circuit implementations to create a 1-Wire interface. The circuits described in this application note cover many different configurations. For a custom application, one of the described options can be adapted to meet individual needs.
標(biāo)簽：
iButtons
Reading
Writing
and
上傳時(shí)間：
2013-10-29
上傳用戶：long14578
-
The MC68HC05K0 is a low cost, low pin countsingle chip microcomputer with 504 bytes of userROM and 32 bytes of RAM. The MC68HC05K0 isa member of the 68HC05K series of devices whichare available in 16-pin DIL or SOIC packages.It uses the same CPU as the other devices in the68HC05 family and has the same instructions andregisters. Additionally, the device has a 15-stagemulti-function timer and 10 general purposebi-directional I/0 lines. A mask option is availablefor software programmable pull-downs on all ofthe I/O pins and four of the pins are capable ofgenerating interrupts.The device is ideally suited for remote-controlkeyboard applications because the pull-downs andthe interrupt drivers on the port pins allowkeyboards to be built without any externalcomponents except the keys themselves. There isno need for external pull-up or pull-down resistors,or diodes for wired-OR interrupts, as these featuresare already designed into the device.
標(biāo)簽：
Infra-red
Remote
Cont
05K
上傳時(shí)間：
2014-01-24
上傳用戶：zl5712176
-
winCE msdn講座 XP Embedded Now and the future
Windows XP Embedded Developmentand Deployment Model OverviewWindows XP Embedded Component ModelWindows XP Embedded Studio Tools
Microsoft WindowsXP Embedded Product Highlights
Componentized version of Windows XP Professional~ 12,000 components and updates as of Service Pack 2Flexible localizationsame binaries and API as Windows XP ProfessionalHotfixes and service packsEmbedded Enabling FeaturesRuns on standard PC hardwareSupports boot on hard drives, compact flash, DiskOnChipand read-only mediaSupport for remote install and remote bootHeadless device and remote management supportIntegration with Microsoft management tools
標(biāo)簽：
winCE
msdn
講座
上傳時(shí)間：
2013-10-31
上傳用戶：jrsoft
-
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
標(biāo)簽：
封裝
器件
用戶
賽靈思
上傳時(shí)間：
2013-10-22
上傳用戶：ztj182002
-
This application note describes how to retrieve user-defined data from Xilinx configurationPROMs (XC18V00 and Platform Flash devices) after the same PROM has configured theFPGA. The method to add user-defined data to the configuration PROM file is also discussed.The reference design described in this application note can be used in any of the followingXilinx FPGA architectures: Spartan™-II, Spartan-IIE, Spartan-3, Virtex™, Virtex-E, Virtex-II,and Virtex-II Pro.
標(biāo)簽：
XAPP
PROM
694
讀取
上傳時(shí)間：
2013-11-11
上傳用戶：zhouli
-
This application note describes how the existing dual-port block memories in the Spartan™-IIand Virtex™ families can be used as Quad-Port memories. This essentially involves a dataaccess time (halved) versus functionality (doubled) trade-off. The overall bandwidth of the blockmemory in terms of bits per second will remain the same.
標(biāo)簽：
Virtex
XAPP
228
器件
上傳時(shí)間：
2013-11-08
上傳用戶：lou45566
-
為了在CDMA系統(tǒng)中更好地應(yīng)用QDPSK數(shù)字調(diào)制方式，在分析四相相對移相（QDPSK)信號調(diào)制解調(diào)原理的基礎(chǔ)上，設(shè)計(jì)了一種QDPSK調(diào)制解調(diào)電路，它包括串并轉(zhuǎn)換、差分編碼、四相載波產(chǎn)生和選相、相干解調(diào)、差分譯碼和并串轉(zhuǎn)換電路。在MAX+PLUSⅡ軟件平臺上，進(jìn)行了編譯和波形仿真。綜合后下載到復(fù)雜可編程邏輯器件EPM7128SLC84-15中，測試結(jié)果表明，調(diào)制電路能正確選相，解調(diào)電路輸出數(shù)據(jù)與QDPSK調(diào)制輸入數(shù)據(jù)完全一致，達(dá)到了預(yù)期的設(shè)計(jì)要求。
Abstract:
In order to realize the better application of digital modulation mode QDPSK in the CDMA system， a sort of QDPSK modulation-demodulation circuit was designed based on the analysis of QDPSK signal modulation-demodulation principles. It included serial/parallel conversion circuit, differential encoding circuit, four-phase carrier wave produced and phase chosen circuit, coherent demodulation circuit, difference decoding circuit and parallel/serial conversion circuit. And it was compiled and simulated on the MAX+PLUSⅡ software platform,and downloaded into the CPLD of EPM7128SLC84-15.The test result shows that the modulation circuit can exactly choose the phase，and the output data of the demodulator circuit is the same as the input data of the QDPSK modulate. The circuit achieves the prospective requirement of the design.
標(biāo)簽：
QDPSK
CPLD
調(diào)制解調(diào)
電路設(shè)計(jì)
上傳時(shí)間：
2014-01-13
上傳用戶：qoovoop
-
When I started writing the first edition of RF Power Amplifiers for Wireless Communications,some time back in 1997, it seemed that I was roaming a largely uninhabitedlandscape. For reasons still not clear to me there were few, if any, otherbooks dedicated to the subject of RF power amplifiers. Right at the same time, however,hundreds of engineers were being assigned projects to design PAs for wirelesscommunications products. It was not, therefore, especially difficult to be successfulwith a book that was fortuitously at the right place and the right time.
標(biāo)簽：
Communications
Amplifiers
Wireless
Edition
上傳時(shí)間：
2013-11-12
上傳用戶：YYRR
-
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
標(biāo)簽：
封裝
器件
用戶
賽靈思
上傳時(shí)間：
2013-11-21
上傳用戶：不懂夜的黑
