The AT89C52 is a low-power, high-performance CMOS 8-bit microcomputer with 8Kbytes of Flash programmable and erasable read only memory (PEROM). The deviceis manufactured using Atmel’s high-density nonvolatile memory technology and iscompatible with the industry-standard 80C51 and 80C52 instruction set and pinout.The on-chip Flash allows the program memory to be reprogrammed in-system or by aconventional nonvolatile memory programmer. By combining a versatile 8-bit CPUwith Flash on a monolithic chip, the Atmel AT89C52 is a powerful microcomputerwhich provides a highly-flexible and cost-effective solution to many embedded controlapplications.
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
Designing withProgrammable Logicin an Analog WorldProgrammable logic devices revolutionizeddigital design over 25 years ago,promising designers a blank chip todesign literally any function and programit in the field. PLDs can be low-logicdensity devices that use nonvolatilesea-of-gates cells called complexprogrammable logic devices (CPLDs)or they can be high-density devicesbased on SRAM look-up tables (LUTs)
The Xilinx Zynq-7000 Extensible Processing Platform (EPP) redefines the possibilities for embedded systems, giving system and software architects and developers a flexible platform to launch their new solutions and traditional ASIC and ASSP users an alternative that aligns with today’s programmable imperative. The new class of product elegantly combines an industrystandard ARMprocessor-based system with Xilinx 28nm programmable logic—in a single device. The processor boots first, prior to configuration of the programmable logic. This, along with a streamlined workflow, saves time and effort and lets software developers and hardware designers start development simultaneously.
This application note covers the design considerations of a system using the performance
features of the LogiCORE™ IP Advanced eXtensible Interface (AXI) Interconnect core. The
design focuses on high system throughput through the AXI Interconnect core with F
MAX
and
area optimizations in certain portions of the design.
The design uses five AXI video direct memory access (VDMA) engines to simultaneously move
10 streams (five transmit video streams and five receive video streams), each in 1920 x 1080p
format, 60 Hz refresh rate, and up to 32 data bits per pixel. Each VDMA is driven from a video
test pattern generator (TPG) with a video timing controller (VTC) block to set up the necessary
video timing signals. Data read by each AXI VDMA is sent to a common on-screen display
(OSD) core capable of multiplexing or overlaying multiple video streams to a single output video
stream. The output of the OSD core drives the DVI video display interface on the board.
Performance monitor blocks are added to capture performance data. All 10 video streams
moved by the AXI VDMA blocks are buffered through a shared DDR3 SDRAM memory and are
controlled by a MicroBlaze™ processor.
The reference system is targeted for the Virtex-6 XC6VLX240TFF1156-1 FPGA on the
Xilinx® ML605 Rev D evaluation board
The Tri-Mode Ethernet MAC (TEMAC) UltraController-II module is a minimal footprint,embedded network processing engine based on the PowerPC™ 405 (PPC405) processor coreand the TEMAC core embedded within a Virtex™-4 FX Platform FPGA. The TEMACUltraController-II module connects to an external PHY through Gigabit Media IndependentInterface (GMII) and Management Data Input/Output (MDIO) interfaces and supports tri-mode(10/100/1000 Mb/s) Ethernet. Software running from the processor cache reads and writesthrough an On-Chip Memory (OCM) interface to two FIFOs that act as buffers between thedifferent clock domains of the PPC405 OCM and the TEMAC.
多遠程二極管溫度傳感器-Design Considerations for pc thermal management
Multiple RDTS (remote diode temperature sensing) provides the most accurate method of sensing an IC’s junction temperature. It overcomes thermal gradient and placement issues encountered when trying to place external sensors. PCB component count decreases when using a device that provides multiple inputs.Better temperature sensing improves product performance and reliability. Disk drive data integrity suffers at elevated temperatures. IBM published an article stating that a 5°C rise in operating temperature causes a 15% increase in the drive’s failure rate. The overall performance of a system can be improved by providing a more accurate temperature measurement of the most critical devices allowing them to run just a few degrees hotter.The LM83 directly senses its own temperature and the temperature of three external PN junctions. One is dedicated to the CPU of choice, the other two go to other parts of your system that need thermal monitoring such as the disk drive or graphics chip. The SMBus-compatible LM83 supports SMBus timeout and logic levels. The LM83 has two interrupt outputs; one for user-programmable limits and WATCHDOG capability (INT), the other is a Critical Temperature Alarm output (T_CRIT_A) for system power supply shutdown.
A Computer-On-Module, or COM, is a Module with all components necessary for a bootable host computer, packaged as a super component. A COM requires a Carrier Board to bring out I/O and to power up. COMs are used to build single board computer solutions and offer OEMs fast time-to-market with reduced development cost. Like integrated circuits, they provide OEMs with significant freedom in meeting form-fit-function requirements. For all these reasons the COM methodology has gained much popularity with OEMs in the embedded industry. COM Express® is an open industry standard for Computer-On-Modules. It is designed to be future proof and to provide a smooth transition path from legacy parallel interfaces to LVDS (Low Voltage Differential Signaling) interfaces. These include the PCI bus and parallel ATA on the one hand and PCI Express and Serial ATA on the other hand.
