Second-generation telecommunication systems, such as the Global System for Mobile Communications (GSM), enabled voice traffic to go wireless: the number of mobile phones exceeds the number of landline phones and the mobile phone penetration is approaching 100% in several markets. The data-handling capabilities of second-generation systems are limited, however, and third-generation systems are needed to provide the high bit-rate services that enable high-quality images and video to be transmitted and received, and to provide access to the Web with higher data rates.
標(biāo)簽： Evolution WCDMA UMTS HSPA LTE for and
上傳時(shí)間： 2020-06-01
上傳用戶：shancjb
The advent of modern wireless devices, such as smart phones and MID 1 terminals, has revolutionized the way people think of personal connectivity. Such devices encompass multiple applications ranging from voice and video to high-speed data transfer via wireless networks. The voracious appetite of twenty-first century users for supporting more wireless applications on a single device is ever increasing. These devices employ multiple radios and modems that cover multiple frequency bands and multiple standards with a manifold of wireless applications often running simultaneously.
標(biāo)簽： Architectures Wireless Receiver Design and
上傳時(shí)間： 2020-06-01
上傳用戶：shancjb
Wireless Mesh Networks (WMN) are believed to be a highly promising technology and will play an increasingly important role in future generation wireless mobile networks. WMN is characterized by dynamic self-organization, self-configuration and self-healing to enable quick deployment, easy maintenance, low cost, high scalability and reliable services, as well as enhancing network capacity, connect- ivity and resilience.
標(biāo)簽： Networking Wireless Mesh
上傳時(shí)間： 2020-06-01
上傳用戶：shancjb
Electrostatic discharge (ESD) is one of the most prevalent threats to the reliability of electronic components. It is an event in which a finite amount of charge is trans- ferred from one object (i.e., human body) to another (i.e., microchip). This process can result in a very high current passing through the microchip within a very short period of time, and, hence, more than 35% of chip damages can be attributed to an ESD-related event. As such, designing on-chip ESD structures to protect integrated circuits against the ESD stresses is a high priority in the semiconductor industry.
標(biāo)簽： Electrostatic Protection Discharge
上傳時(shí)間： 2020-06-05
上傳用戶：shancjb
Electrostatic discharge (ESD) events can have serious detrimental effects on the manufacture and performance of microelectronic devices, the systems that contain them, and the manufacturing facilities used to produce them. Submicron device technologies, high system operating speeds, and factory automation are making ESD control programs a critical factor in the quality and reliability of ESD-sensitive products.
標(biāo)簽： Management Program ESD
上傳時(shí)間： 2020-06-05
上傳用戶：shancjb
The goal of this book is to introduce the simulation methods necessary to describe the behaviour of semiconductor devices during an electrostatic discharge (ESD). The challenge of this task is the correct description of semiconductor devices under very high current density and high temperature transients. As it stands, the book can be no more than a snapshot and a summary of the research in this field during the past few years. The authors hope that the book will provide the basis for further development of simulation methods at this current frontier of device physics.
標(biāo)簽： Development Protection ESD
上傳時(shí)間： 2020-06-05
上傳用戶：shancjb
The challenges associated with the design and implementation of Electro- static Discharge (ESD) protection circuits become increasingly complex as technology is scaled well into nano-metric regime. One must understand the behavior of semiconductor devices under very high current densities, high temperature transients in order to surmount the nano-meter ESD challenge. As a consequence, the quest for suitable ESD solution in a given technology must start from the device level. Traditional approaches of ESD design may not be adequate as the ESD damages occur at successively lower voltages in nano-metric dimensions.
標(biāo)簽： Protection Circuit Device Design ESD and
上傳時(shí)間： 2020-06-05
上傳用戶：shancjb
Guideline Suggestion for High-Speed I/O ESD Protection
標(biāo)簽： ESD_Suggestion_for_HighSpeed_IO_K er
上傳時(shí)間： 2020-06-05
上傳用戶：shancjb
The planarization technology of Chemical-Mechanical-Polishing (CMP), used for the manufacturing of multi- level metal interconnects for high-density Integrated Circuits (IC), is also readily adaptable as an enabling technology in MicroElectroMechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining. CMP not only eases the design and manufacturability of MEMS devices by eliminating several photolithographic and film issues generated by severe topography, but also enables far greater flexibility with process complexity and associated designs. T
標(biāo)簽： mechanical polishing Chemical
上傳時(shí)間： 2020-06-06
上傳用戶：shancjb
Thanks to the advances in micromachining fabrication technologies and significant cost reduction due to mass production, miniature sensors of angular rate, or gyroscopes, found their way into the everyday life of every user of modern gadgets, such as smart phones, tablets or even wristwatches. Often without realising, many of us are carrying in our pockets fully equipped with all necessary sensors complete inertial navigation systems that not so long ago were available only for advanced vehicles in sea, land, air or space. Accelerometers and gyroscopes are found in specifications of any gadget supposed to react to user movements. And one of the most commonly used type of gyroscopes used to developed these systems is Coriolis vibratory gyroscope (CVG).
標(biāo)簽： Gyroscopes Vibratory Coriolis
上傳時(shí)間： 2020-06-06
上傳用戶：shancjb
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