The latest generation of Texas Instruments (TI) boardmountedpower modules utilizes a pin interconnect technologythat improves surface-mount manufacturability.These modules are produced as a double-sided surfacemount(DSSMT) subassembly, yielding a case-less constructionwith subcomponents located on both sides of theprinted circuit board (PCB). Products produced in theDSSMT outline use the latest high-efficiency topologiesand magnetic-component packaging. This providescustomers with a high-efficiency, ready-to-use switchingpower module in a compact, space-saving package. Bothnonisolated point-of-load (POL) switching regulators andthe isolated dc/dc converter modules are being producedin the DSSMT outline.TI’s plug-in power product line offers power modules inboth through-hole and surface-mount packages. The surfacemountmodules produced in the DSSMT outline use asolid copper interconnect with an integral solder ball fortheir
表面貼片膠(SMA,surface mount adhesives)用于波峰焊接和回流焊接，以保持組件在印刷電路板(PCB)上的位置，確保在裝配線上傳送過(guò)程中組件不會(huì)丟失。PCB裝配中使用的大多數(shù)表面貼片膠(SMA)都是環(huán)氧樹脂(epoxies)，雖然還有聚丙烯(acrylics)用于特殊的用途。在高速滴膠系統(tǒng)引入和電子工業(yè)掌握如何處理貨架壽命相對(duì)較短的產(chǎn)品之后，環(huán)氧樹脂已成為世界范圍內(nèi)的更主流的膠劑技術(shù)。環(huán)氧樹脂一般對(duì)廣泛的電路板提供良好的附著力，并具有非常好的電氣性能。
Calculation of the Differential Impedance of Tracks on FR4 substrates
There is a discrepancy between calculated and measured values of impedance for differential transmission lineson FR4. This is especially noticeable in the case of surface microstrip configurations. The anomaly is shown tobe due to the nature of the substrate material. This needs to be considered as a layered structure of epoxy resinand glass fibre. Calculations, using Boundary Element field methods, show that the distribution of the electricfield within this layered structure determines the apparent dielectric constant and therefore affects theimpedance. Thus FR4 cannot be considered to be uniform dielectric when calculating differential impedance.
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This was the public transportation inquiry system software engineering design documents, including the demand analysis, the outline design, the contact surface design and so on a series of designs documents, made the comprehensive analysis to the public transportation systems engineering to design ,Java,software engineering
This was the public transportation inquiry system software engineering design documents, including the demand analysis, the outline design, the contact surface design and so on a series of designs documents, made the comprehensive analysis to the public transportation systems engineering to design ,Java,software
This was the public transportation inquiry system software engineering design documents, including the demand analysis, the outline design, the contact surface design and so on a series of designs documents, made the comprehensive analysis to the public transportation systems engineering to design ,Java
