The latest generation of Texas Instruments (TI) boardmountedpower modules utilizes a pin interconnect technologythat improves surface-mount manufacturability.These modules are produced as a double-sided surfacemount(DSSMT) subassembly, yielding a case-less constructionwith subcomponents located on both sides of theprinted circuit board (PCB). Products produced in theDSSMT outline use the latest high-efficiency topologiesand magnetic-component packaging. This providescustomers with a high-efficiency, ready-to-use switchingpower module in a compact, space-saving package. Bothnonisolated point-of-load (POL) switching regulators andthe isolated dc/dc converter modules are being producedin the DSSMT outline.TI’s plug-in power product line offers power modules inboth through-hole and surface-mount packages. The surfacemountmodules produced in the DSSMT outline use asolid copper interconnect with an integral solder ball fortheir
上傳時間： 2013-10-10
上傳用戶：1184599859
摘要：采用表面組裝技術（surface mountt echnology,SMT）進行印制板級電子電路組裝是當代組裝技術發展的主流。典型的SMT生產線是由高速機和多功能機串聯而成，印制電路板（printed circuit board,PCB）上的元器件在貼片機之間的負荷均衡優化問題是SMT生產調度的關鍵問題。以使貼片時間與更換吸嘴時間之和最大的工作臺生產時間最小化為目標構建了負荷均衡模型，開發了相應的遺傳算法，并進行了數值實驗與算法評價。與生產時間理論下界和現場機器自帶軟件調度方案的對比表明了模型及其算法的有效性。關鍵詞：印制電路板；表面組裝生產線；負荷分配；生產線優化
上傳時間： 2013-10-09
上傳用戶：亞亞娟娟123
表面貼片膠(SMA,surface mount adhesives)用于波峰焊接和回流焊接，以保持組件在印刷電路板(PCB)上的位置，確保在裝配線上傳送過程中組件不會丟失。PCB裝配中使用的大多數表面貼片膠(SMA)都是環氧樹脂(epoxies)，雖然還有聚丙烯(acrylics)用于特殊的用途。在高速滴膠系統引入和電子工業掌握如何處理貨架壽命相對較短的產品之后，環氧樹脂已成為世界范圍內的更主流的膠劑技術。環氧樹脂一般對廣泛的電路板提供良好的附著力，并具有非常好的電氣性能。
上傳時間： 2013-10-12
上傳用戶：破曉sunshine
【摘要】本文結合作者多年的印制板設計經驗，著重印制板的電氣性能，從印制板穩定性、可靠性方面，來討論多層印制板設計的基本要求。【關鍵詞】印制電路板；表面貼裝器件；高密度互連；通孔【Key words】Printed Circuit Board；surface Mounting Device；High Density Interface；Via一．概述印制板（PCB－Printed Circuit Board）也叫印制電路板、印刷電路板。多層印制板，就是指兩層以上的印制板，它是由幾層絕緣基板上的連接導線和裝配焊接電子元件用的焊盤組成，既具有導通各層線路，又具有相互間絕緣的作用。隨著SMT（表面安裝技術）的不斷發展，以及新一代SMD（表面安裝器件）的不斷推出，如QFP、QFN、CSP、BGA（特別是MBGA），使電子產品更加智能化、小型化，因而推動了PCB工業技術的重大改革和進步。自1991年IBM公司首先成功開發出高密度多層板（SLC）以來，各國各大集團也相繼開發出各種各樣的高密度互連（HDI）微孔板。這些加工技術的迅猛發展，促使了PCB的設計已逐漸向多層、高密度布線的方向發展。多層印制板以其設計靈活、穩定可靠的電氣性能和優越的經濟性能，現已廣泛應用于電子產品的生產制造中。下面，作者以多年設計印制板的經驗，著重印制板的電氣性能，結合工藝要求，從印制板穩定性、可靠性方面，來談談多層制板設計的基本要領。
上傳時間： 2013-10-08
上傳用戶：zhishenglu
Calculation of the Differential Impedance of Tracks on FR4 substrates There is a discrepancy between calculated and measured values of impedance for differential transmission lineson FR4. This is especially noticeable in the case of surface microstrip configurations. The anomaly is shown tobe due to the nature of the substrate material. This needs to be considered as a layered structure of epoxy resinand glass fibre. Calculations, using Boundary Element field methods, show that the distribution of the electricfield within this layered structure determines the apparent dielectric constant and therefore affects theimpedance. Thus FR4 cannot be considered to be uniform dielectric when calculating differential impedance.
上傳時間： 2013-10-18
上傳用戶：masochism
國外游戲開發者雜志2000年第八期配套代碼，包括Brian Sharp的implicit-surface fluid的例子代碼，例子中使用了Lander的動畫庫
上傳時間： 2015-01-05
上傳用戶：wsf950131
東滕網站源碼，漂亮的界面，基本網頁功能設計，聊天室- East clears out the website source code, attractive contact surface, basic homepage functional design, chatroom ,ASP,編程網站/Program Web Site 【上載源碼成為會員下載此源碼】【成為VIP會員下載此源碼】
上傳時間： 2013-12-24
上傳用戶：changeboy
This was the public transportation inquiry system software engineering design documents, including the demand analysis, the outline design, the contact surface design and so on a series of designs documents, made the comprehensive analysis to the public transportation systems engineering to design ,Java,software engineering
標簽： transportation engineering documents including
上傳時間： 2015-08-15
上傳用戶：lixinxiang
This was the public transportation inquiry system software engineering design documents, including the demand analysis, the outline design, the contact surface design and so on a series of designs documents, made the comprehensive analysis to the public transportation systems engineering to design ,Java,software
標簽： transportation engineering documents including
上傳時間： 2013-12-26
上傳用戶：Zxcvbnm
This was the public transportation inquiry system software engineering design documents, including the demand analysis, the outline design, the contact surface design and so on a series of designs documents, made the comprehensive analysis to the public transportation systems engineering to design ,Java
標簽： transportation engineering documents including
上傳時間： 2015-08-15
上傳用戶：caixiaoxu26
