Link & system-level Wireless OFDM System Simulator Version，仿真了OFDM
標(biāo)簽： system-level Simulator Wireless Version
上傳時(shí)間： 2013-12-18
上傳用戶：xg262122
Digital Signal Processing System Level Design Using LabVIEW，基于LabViEW的數(shù)字信號處理系統(tǒng)設(shè)計(jì)參考書。
標(biāo)簽： Processing Digital LabVIEW Design
上傳時(shí)間： 2016-03-03
上傳用戶：edisonfather
基于OFDM的無線寬帶系統(tǒng)仿真It contains mainly two parts, i.e. link-level simulator and system-level simulator. Link-level simulator focus on a single-cell single-user scenario, where signal is transmitted from tx, and estimated at rx. Comparing the difference in tx/rx signal, the error rate can be found out. The output of the link-level simulator is the BLER/BER vs. SNR mapping table, that can be used for the system-level simulation. system-level simulator focus on a multi-cell multi-user scenario. For the sake of simplicity, it takes the mapping table aquired in the link-level simulation, measure the actural SNR, and finds the corresponding error rate.
標(biāo)簽： simulator i.e. system-level link-level
上傳時(shí)間： 2016-03-15
上傳用戶：xsnjzljj
Newnes.Digital.Signal.Processing.System.Level.Design.Using.LabVIEW.Jun.2005.eBook-DDU labview信號處理教材。
標(biāo)簽： Processing eBook-DDU Digital LabVIEW
上傳時(shí)間： 2014-01-22
上傳用戶：gundan
This document was developed under the Standard Hardware and Reliability Program (SHARP) TechnologyIndependent Representation of Electronic Products (TIREP) project. It is intended for use by VHSIC HardwareDescription Language (VHDL) design engineers and is offered as guidance for the development of VHDL modelswhich are compliant with the VHDL Data Item Description (DID DI-EGDS-80811) and which can be providedto manufacturing engineering personnel for the development of production data and the subsequent productionof hardware. Most VHDL modeling performed to date has been concentrated at either the component level orat the conceptual system level. The assembly and sub-assembly levels have been largely disregarded. Under theSHARP TIREP project, an attempt has been made to help close this gap. The TIREP models are based upon lowcomplexity Standard Electronic Modules (SEM) of the format A configuration. Although these modules are quitesimple, it is felt that the lessons learned offer guidance which can readily be applied to a wide range of assemblytypes and complexities.
標(biāo)簽： Modelling Guide Navy VHDL
上傳時(shí)間： 2014-12-23
上傳用戶：xinhaoshan2016
The P89LPC912/913/914 are single-chip microcontrollers in low-cost 14-pin packages, based on a high performance processor architecture that executes instructions in two to four clocks, six times the rate of standard 80C51 devices. Many system level functions have been incorporated into the P89LPC912/913/914 in order to reduce component count, board space, and system cost.
上傳時(shí)間： 2013-10-12
上傳用戶：司令部正軍級
Virtex-5, Spartan-DSP FPGAs Application Note This application note demonstrates how efficient implementations of Digital Up Converters(DUC) and Digital Down Converters (DDC) can be done by leveraging the Xilinx DSP IPportfolio for increased productivity and reduced time to development. Step-by-step instruction is given on how to perform system-level trade off analysis and develop the most efficient FPGA implementation, thus allowing engineers a flexible, low-cost and low-power alternative to ASSP technologies.
標(biāo)簽： Spartan-DSP Virtex FPGAs Ap
上傳時(shí)間： 2013-10-23
上傳用戶：raron1989
中文版詳情瀏覽：http://www.elecfans.com/emb/fpga/20130715324029.html Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications. The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation. Some of the UltraScale architecture breakthroughs include: • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50% • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets • Greatly enhanced DSP and packet handling The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
標(biāo)簽： UltraScale Xilinx 架構(gòu)
上傳時(shí)間： 2013-11-13
上傳用戶：瓦力瓦力hong
FPGAs have changed dramatically since Xilinx first introduced them just 15 years ago. In thepast, FPGA were primarily used for prototyping and lower volume applications; custom ASICswere used for high volume, cost sensitive designs. FPGAs had also been too expensive and tooslow for many applications, let alone for System Level Integration (SLI). Plus, the development
標(biāo)簽： Methodology Design Reuse FPGA
上傳時(shí)間： 2013-10-23
上傳用戶：旗魚旗魚
Abstract: This application note describes system-level characterization and modeling techniques for radio frequency (RF) and microwavesubsystem components. It illustrates their use in a mixed-signal, mixed-mode system-level simulation. The simulation uses an RF transmitterwith digital predistortion (DPD) as an example system. Details of this complex system and performance data are presented.
標(biāo)簽： 射頻 仿真 微波系統(tǒng) 建模
上傳時(shí)間： 2013-12-18
上傳用戶：onewq
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