Abstract: A sliding mode observer and fractional-order phase-locked loop (FO-PLL) method is proposed for the sensorless speed control of a permanent magnet synchronous motor (PMSM).The saturation function is adopted in order to reduce the chattering phenomenon caused by the sliding mode observer. In this proposed FO-PLL, method, a regulable fractional order r is involved, which means that the FO-PLL provides an extra degree of freedom. In fact, the conventional phase-locked loop (PLL) applied in sensorless PMSM control can be seen as a special case of the proposed FO-PLL. By selecting a proper fractional order r a better performance may be achieved. The computer simulation results demonstrate the effectiveness of the proposed method.Key words: fractional calculus; fractional order phase-locked loop; sensorless control; sliding mode observer; permanent magnet synchronous motor; speed controll
上傳時間： 2022-06-18
上傳用戶：
電力電子技術的發展使電機驅動系統擺脫了常規兩電平逆變器拓撲的限制，電機驅動系統與多電平逆變器的結合成了新的思路。多電平逆變器的輸出電平數多，因此其輸出波形更好，在大容量交流調速系統中優勢明顯。作為多電平逆變器的研究基礎，三電平逆變器應用最為廣泛，而其中首選的是二極管鉗位型三電平逆變器。因此采用二極管鉗位型三電平逆變器驅動PMSM的模型預測控制系統作為研究對象。在PMSM驅動系統中，位置與轉速的檢測是非常重要的，一般采用的方法是通過機械傳感器來進行測量，但這種測量方法在實際應用中有很多缺陷，會降低電機系統的穩定性和可靠性，同時會增加成本。而無速度傳感器技術是通過檢測電機中的電流或電壓，來對電機的實際轉速和位置信息進行估計，這種技術省略了常規使用的機械傳感器，能夠實現電機系統的高精度、高動態性能的控制。因此PMSM的無速度傳感器控制技術成為了近些年的研究熱點。主要研究內容分為以下幾個方面：（1）基于同一Pl轉速調節器，設計三電平逆變器驅動PMSM模型預測轉矩控制系統，與兩電平逆變器驅動PMSMMPTC系統對比，并對兩個系統的運行性能進行對比分析。（2）為進一步提高系統響應性能，克服未知負載轉矩擾動、增強系統魯棒性，設計擴張狀態負載轉矩觀測器，進而得到將負載轉矩觀測器和基于冪函數滑模轉速調節器相結合的復合控制器。（3）設計基于分數階滑模觀測器的PMSMMPCC系統，實現對電機轉速的快速準確估計。
上傳時間： 2022-06-24
上傳用戶：xsr1983
eeworm.com VIP專區 單片機源碼系列 55資源包含以下內容：1. 初學單片機幾個不易掌握的概念.pdf2. 單片機應用編程技巧(FAQ).pdf3. 單片機課程設計的項目選取與教學改革.pdf4. 采用XC164CS的CAN系統解決方案.pdf5. DS18B20中文手冊.pdf6. 《單片機原理與應用》教學大綱--周美娟.pdf7. 采用TMS320F2812的CAN系統解決方案.pdf8. 基于ATmega8515L的舞蹈機器人控制系統設計與研究.pdf9. 單片機原理與應用（李精華）.pdf10. 基于AT89C2051單片機的防盜自動報警電子密碼鎖系統的設.pdf11. 基于80C196KC的直流電機PWM調速控制器的設計與應用.pdf12. 《單片機及可編程控制器》課程實驗教學大綱.pdf13. 觸摸屏的基本指令演示.pdf14. 單片機實現的LED點陣圖文顯示系統設計.pdf15. 普通單片機讀寫U盤使用指南.pdf16. 基于單片機高速高精度步進電機控制系統的設計.pdf17. 單片機電話遠程通信系統.pdf18. 單片機程序掩膜.pdf19. 多CPU單片機系統設計在社區安防系統中的應用.pdf20. MCS-51單片機的系統擴展技術（一）.pdf21. 倚天版編程試驗一體化自學8051單片機開發套件.pdf22. 基于PIC16F877單片機的空調車檢測儀設計.pdf23. 交流伺服電機的單片機控制及其應用.pdf24. uC/GUI在單片機系統上的移植.pdf25. 應用PCI 9656的數據接收卡設計.pdf26. 特殊功能集成電路.pdf27. 基于MC8051軟核的星載智能1394終端.pdf28. 單片機快速進階-C8051F02X系列單片機基本應用指導系統.pdf29. 應用8098單片機實現直流伺服電機PWM調速控制.pdf30. 單片機演示實驗.pdf31. 單片機在木材干燥中的應用.pdf32. 可編程控制器應用.PPT33. LG-32K單片機仿真機使用說明.pdf34. 多功能51系列實驗板.pdf35. USB全自動在線編程STC單片機實驗板簡介.pdf36. 單片機開發板使用手冊.pdf37. SH69P8XX系列單片機定時/計數器使用指南.pdf38. 《單片機原理與應用》實訓教學大綱.pdf39. SUPER-08三星單片機學習板介紹.pdf40. Study 51單片機仿真機說明書.pdf41. 宏晶STC90C58AD系列單片機器件手冊.pdf42. HT48RA0-3/HT48CA0-3遙控型八位單片機.pdf43. STC89C52芯片的編程.pdf44. 手把手教你學單片機的C語言程序設計--編譯預算處理.pdf45. 基于MC9S12NE64型單片機的嵌入式以太網連接.pdf46. STC8051系列單片機器件手冊.pdf47. 單片機原理與應用（曾屹）.pdf48. ISD1420/ISD1110高級語音合成編程拷貝機-QL1.pdf49. STC12C5A60AD/STC12C5201AD系列單片機.pdf50. SPCE061A單片機在USB通訊中的應用.pdf51. QL310多功能識別主人電話遙控報警芯片用戶手冊.pdf52. SPMC65P2404A在電動自行車中的應用.pdf53. 基于STM32微控制器的MP3播放器設計.pdf54. ISD系列語音錄放芯片的內容復制.pdf55. 普通單片機讀寫U盤開發板.pdf56. 基于單片機控制的智能搬運機器人設計與開發.pdf57. 基于ispPAC和單片機的熱電偶實驗儀.pdf58. AVR高檔性能低檔價格的單片機ATmega8的開發與應用.pdf59. 用HC08GR8單片機實現的網絡家電控制器.pdf60. 鍵盤顯示驅動芯片HD7279A及其應用.pdf61. SL-AVRL AVR單片機下載線使用說明.pdf62. SUNPLUSIT編程工具Q-Writer使用說明書.pdf63. 無線收發模塊nRF401在礦山中的應用.pdf64. SinoWealth 4-bit單片機基本介紹.pdf65. SPMC65系列單片機編程工具Q-Writer使用說明書.pdf66. ADS7852在雙目測距中的應用.pdf67. QTH單片機仿真開發系統V2003.1概述.pdf68. 基于NRF9E5射頻無線遙控系統的設計.pdf69. ATR2406在無線音頻傳輸系統中的應用.pdf70. 來電解碼器及其在客戶關系管理中的應用.pdf71. 會議芯片M34116聲音產生功能的應用.pdf72. 基于ADE7753的電力機車能耗監測終端設計.pdf73. V6155的原理和應用.pdf74. P87LPC762/P87LPC764 OTP單片機原理.pdf75. 基于DS18B20的自動調溫光療系統設計.pdf76. P87C51RA2/P87C51RB2/P87C51RC2/.pdf77. 基于SPCE061A的SPLC501液晶顯示模塊的應用設計.pdf78. 基于單片機多譜勒效應實驗儀的設計.pdf79. 瑞薩QzROM單片機應用于家電及消費類電子的解決方案.pdf80. NS8C15步進電機驅動器.pdf81. PIC系列單片機簡介.pdf82. 單片機通過CH375讀寫U盤時的注意事項.pdf83. Microchip PIC18家族指令集.doc84. MICROCONTROL MSP430系列單片機的指令系統.pdf85. P87LPC768 OTP單片機原理.pdf86. MPTZ100-24E1無線單片機標準模組.pdf87. PC機與多單片機之間串口通訊的設計方法.pdf88. MPTZ100-9E5無線單片機標準模組.pdf89. Mini Isp Box單片機下載盒產品使用說明書.pdf90. ME-3200單片機仿真器使用手冊.pdf91. MDT20xx系列OTP單片機.pdf92. AGV及其滑模變結構控制器設計.pdf93. MDT10P21A OTP單片機.pdf94. 單片機的發展暨SPCE061A單片機的介紹.ppt95. 基于單片機的注塑機節能控制技術研究.pdf96. 單片機基礎知識.ppt97. 凌陽單片機應用實驗教學大綱.pdf98. ADuC831/MCS-51單片機實驗--擴展存儲器讀寫實驗.pdf99. 單片機應用“做中學”--“單片機應用”課程教學方式探討.pdf100. 單片機與PC機通信中的糾錯編碼.pdf
上傳時間： 2013-04-15
上傳用戶：eeworm
現代的電子設計和芯片制造技術正在飛速發展，電子產品的復雜度、時鐘和總線頻率等等都呈快速上升趨勢，但系統的電壓卻不斷在減小，所有的這一切加上產品投放市場的時間要求給設計師帶來了前所未有的巨大壓力。要想保證產品的一次性成功就必須能預見設計中可能出現的各種問題，并及時給出合理的解決方案，對于高速的數字電路來說，最令人頭大的莫過于如何確保瞬時跳變的數字信號通過較長的一段傳輸線，還能完整地被接收，并保證良好的電磁兼容性，這就是目前頗受關注的信號完整性（SI）問題。本章就是圍繞信號完整性的問題，讓大家對高速電路有個基本的認識，并介紹一些相關的基本概念。 第一章 高速數字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設計流程剖析...............................................................61.3 相關的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質.................................................................................142.3.2 特征阻抗相關計算.............................................................................152.3.3 特性阻抗對信號完整性的影響.........................................................172.4 傳輸線電報方程及推導.............................................................................182.5 趨膚效應和集束效應.................................................................................232.6 信號的反射.................................................................................................252.6.1 反射機理和電報方程.........................................................................252.6.2 反射導致信號的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負載的匹配.................................................................................41第三章 串擾的分析...............................................................................................423.1 串擾的基本概念.........................................................................................423.2 前向串擾和后向串擾.................................................................................433.3 后向串擾的反射.........................................................................................463.4 后向串擾的飽和.........................................................................................463.5 共模和差模電流對串擾的影響.................................................................483.6 連接器的串擾問題.....................................................................................513.7 串擾的具體計算.........................................................................................543.8 避免串擾的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場屏蔽.........................................................................................654.3.1.2 磁場屏蔽.........................................................................................674.3.1.3 電磁場屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設計中的EMI.......................................................................................754.4.1 傳輸線RLC 參數和EMI ........................................................................764.4.2 疊層設計抑制EMI ..............................................................................774.4.3 電容和接地過孔對回流的作用.........................................................784.4.4 布局和走線規則.................................................................................79第五章 電源完整性理論基礎...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設計.............................................................................................855.3 同步開關噪聲分析.....................................................................................875.3.1 芯片內部開關噪聲.............................................................................885.3.2 芯片外部開關噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質和封裝影響.....................................................................955.4.3 電容并聯特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統時序.................................................................................................1006.1 普通時序系統...........................................................................................1006.1.1 時序參數的確定...............................................................................1016.1.2 時序約束條件...................................................................................1066.2 源同步時序系統.......................................................................................1086.2.1 源同步系統的基本結構...................................................................1096.2.2 源同步時序要求...............................................................................110第七章 IBIS 模型................................................................................................1137.1 IBIS 模型的由來...................................................................................... 1137.2 IBIS 與SPICE 的比較.............................................................................. 1137.3 IBIS 模型的構成...................................................................................... 1157.4 建立IBIS 模型......................................................................................... 1187.4 使用IBIS 模型......................................................................................... 1197.5 IBIS 相關工具及鏈接..............................................................................120第八章 高速設計理論在實際中的運用.............................................................1228.1 疊層設計方案...........................................................................................1228.2 過孔對信號傳輸的影響...........................................................................1278.3 一般布局規則...........................................................................................1298.4 接地技術...................................................................................................1308.5 PCB 走線策略............................................................................................134
標簽： 信號完整性
上傳時間： 2014-05-15
上傳用戶：dudu1210004
第一部分 信號完整性知識基礎.................................................................................5第一章 高速數字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設計流程剖析...............................................................61.3 相關的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質.................................................................................142.3.2 特征阻抗相關計算.............................................................................152.3.3 特性阻抗對信號完整性的影響.........................................................172.4 傳輸線電報方程及推導.............................................................................182.5 趨膚效應和集束效應.................................................................................232.6 信號的反射.................................................................................................252.6.1 反射機理和電報方程.........................................................................252.6.2 反射導致信號的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負載的匹配.................................................................................41第三章 串擾的分析...............................................................................................423.1 串擾的基本概念.........................................................................................423.2 前向串擾和后向串擾.................................................................................433.3 后向串擾的反射.........................................................................................463.4 后向串擾的飽和.........................................................................................463.5 共模和差模電流對串擾的影響.................................................................483.6 連接器的串擾問題.....................................................................................513.7 串擾的具體計算.........................................................................................543.8 避免串擾的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場屏蔽.........................................................................................654.3.1.2 磁場屏蔽.........................................................................................674.3.1.3 電磁場屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設計中的EMI.......................................................................................754.4.1 傳輸線RLC 參數和EMI ........................................................................764.4.2 疊層設計抑制EMI ..............................................................................774.4.3 電容和接地過孔對回流的作用.........................................................784.4.4 布局和走線規則.................................................................................79第五章 電源完整性理論基礎...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設計.............................................................................................855.3 同步開關噪聲分析.....................................................................................875.3.1 芯片內部開關噪聲.............................................................................885.3.2 芯片外部開關噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質和封裝影響.....................................................................955.4.3 電容并聯特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統時序.................................................................................................1006.1 普通時序系統...........................................................................................1006.1.1 時序參數的確定...............................................................................1016.1.2 時序約束條件...................................................................................1063.2 高速設計的問題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動布線器.......................................................2303.4 高速設計的大致流程...............................................................................2303.4.1 拓撲結構的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓撲模板驅動設計...................................................................2313.4.4 時序驅動布局...................................................................................2323.4.5 以約束條件驅動設計.......................................................................2323.4.6 設計后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進階運用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 圖形化的拓撲結構探索...........................................................................2344.3 全面的信號完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設計前和設計的拓撲結構提取.......................................................2354.6 仿真設置顧問...........................................................................................2354.7 改變設計的管理.......................................................................................2354.8 關鍵技術特點...........................................................................................2364.8.1 拓撲結構探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process Analysis) .236第五章 部分特殊的運用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進行前仿真.......................................................................2511.1 用LineSim 進行仿真工作的基本方法...................................................2511.2 處理信號完整性原理圖的具體問題.......................................................2591.3 在LineSim 中如何對傳輸線進行設置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進行串擾仿真...................................................................268第二章 使用BOARDSIM 進行后仿真......................................................................2732.1 用BOARDSIM 進行后仿真工作的基本方法...................................................2732.2 BoardSim 的進一步介紹..........................................................................2922.3 BoardSim 中的串擾仿真..........................................................................309
上傳時間： 2014-04-18
上傳用戶：wpt
現代的電子設計和芯片制造技術正在飛速發展，電子產品的復雜度、時鐘和總線頻率等等都呈快速上升趨勢，但系統的電壓卻不斷在減小，所有的這一切加上產品投放市場的時間要求給設計師帶來了前所未有的巨大壓力。要想保證產品的一次性成功就必須能預見設計中可能出現的各種問題，并及時給出合理的解決方案，對于高速的數字電路來說，最令人頭大的莫過于如何確保瞬時跳變的數字信號通過較長的一段傳輸線，還能完整地被接收，并保證良好的電磁兼容性，這就是目前頗受關注的信號完整性（SI）問題。本章就是圍繞信號完整性的問題，讓大家對高速電路有個基本的認識，并介紹一些相關的基本概念。 第一章 高速數字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設計流程剖析...............................................................61.3 相關的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質.................................................................................142.3.2 特征阻抗相關計算.............................................................................152.3.3 特性阻抗對信號完整性的影響.........................................................172.4 傳輸線電報方程及推導.............................................................................182.5 趨膚效應和集束效應.................................................................................232.6 信號的反射.................................................................................................252.6.1 反射機理和電報方程.........................................................................252.6.2 反射導致信號的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負載的匹配.................................................................................41第三章 串擾的分析...............................................................................................423.1 串擾的基本概念.........................................................................................423.2 前向串擾和后向串擾.................................................................................433.3 后向串擾的反射.........................................................................................463.4 后向串擾的飽和.........................................................................................463.5 共模和差模電流對串擾的影響.................................................................483.6 連接器的串擾問題.....................................................................................513.7 串擾的具體計算.........................................................................................543.8 避免串擾的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場屏蔽.........................................................................................654.3.1.2 磁場屏蔽.........................................................................................674.3.1.3 電磁場屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設計中的EMI.......................................................................................754.4.1 傳輸線RLC 參數和EMI ........................................................................764.4.2 疊層設計抑制EMI ..............................................................................774.4.3 電容和接地過孔對回流的作用.........................................................784.4.4 布局和走線規則.................................................................................79第五章 電源完整性理論基礎...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設計.............................................................................................855.3 同步開關噪聲分析.....................................................................................875.3.1 芯片內部開關噪聲.............................................................................885.3.2 芯片外部開關噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質和封裝影響.....................................................................955.4.3 電容并聯特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統時序.................................................................................................1006.1 普通時序系統...........................................................................................1006.1.1 時序參數的確定...............................................................................1016.1.2 時序約束條件...................................................................................1066.2 源同步時序系統.......................................................................................1086.2.1 源同步系統的基本結構...................................................................1096.2.2 源同步時序要求...............................................................................110第七章 IBIS 模型................................................................................................1137.1 IBIS 模型的由來...................................................................................... 1137.2 IBIS 與SPICE 的比較.............................................................................. 1137.3 IBIS 模型的構成...................................................................................... 1157.4 建立IBIS 模型......................................................................................... 1187.4 使用IBIS 模型......................................................................................... 1197.5 IBIS 相關工具及鏈接..............................................................................120第八章 高速設計理論在實際中的運用.............................................................1228.1 疊層設計方案...........................................................................................1228.2 過孔對信號傳輸的影響...........................................................................1278.3 一般布局規則...........................................................................................1298.4 接地技術...................................................................................................1308.5 PCB 走線策略............................................................................................134
標簽： 信號完整性
上傳時間： 2013-11-01
上傳用戶：xitai
第一部分 信號完整性知識基礎.................................................................................5第一章 高速數字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設計流程剖析...............................................................61.3 相關的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質.................................................................................142.3.2 特征阻抗相關計算.............................................................................152.3.3 特性阻抗對信號完整性的影響.........................................................172.4 傳輸線電報方程及推導.............................................................................182.5 趨膚效應和集束效應.................................................................................232.6 信號的反射.................................................................................................252.6.1 反射機理和電報方程.........................................................................252.6.2 反射導致信號的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負載的匹配.................................................................................41第三章 串擾的分析...............................................................................................423.1 串擾的基本概念.........................................................................................423.2 前向串擾和后向串擾.................................................................................433.3 后向串擾的反射.........................................................................................463.4 后向串擾的飽和.........................................................................................463.5 共模和差模電流對串擾的影響.................................................................483.6 連接器的串擾問題.....................................................................................513.7 串擾的具體計算.........................................................................................543.8 避免串擾的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場屏蔽.........................................................................................654.3.1.2 磁場屏蔽.........................................................................................674.3.1.3 電磁場屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設計中的EMI.......................................................................................754.4.1 傳輸線RLC 參數和EMI ........................................................................764.4.2 疊層設計抑制EMI ..............................................................................774.4.3 電容和接地過孔對回流的作用.........................................................784.4.4 布局和走線規則.................................................................................79第五章 電源完整性理論基礎...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設計.............................................................................................855.3 同步開關噪聲分析.....................................................................................875.3.1 芯片內部開關噪聲.............................................................................885.3.2 芯片外部開關噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質和封裝影響.....................................................................955.4.3 電容并聯特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統時序.................................................................................................1006.1 普通時序系統...........................................................................................1006.1.1 時序參數的確定...............................................................................1016.1.2 時序約束條件...................................................................................1063.2 高速設計的問題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動布線器.......................................................2303.4 高速設計的大致流程...............................................................................2303.4.1 拓撲結構的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓撲模板驅動設計...................................................................2313.4.4 時序驅動布局...................................................................................2323.4.5 以約束條件驅動設計.......................................................................2323.4.6 設計后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進階運用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 圖形化的拓撲結構探索...........................................................................2344.3 全面的信號完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設計前和設計的拓撲結構提取.......................................................2354.6 仿真設置顧問...........................................................................................2354.7 改變設計的管理.......................................................................................2354.8 關鍵技術特點...........................................................................................2364.8.1 拓撲結構探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process Analysis) .236第五章 部分特殊的運用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進行前仿真.......................................................................2511.1 用LineSim 進行仿真工作的基本方法...................................................2511.2 處理信號完整性原理圖的具體問題.......................................................2591.3 在LineSim 中如何對傳輸線進行設置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進行串擾仿真...................................................................268第二章 使用BOARDSIM 進行后仿真......................................................................2732.1 用BOARDSIM 進行后仿真工作的基本方法...................................................2732.2 BoardSim 的進一步介紹..........................................................................2922.3 BoardSim 中的串擾仿真..........................................................................309
上傳時間： 2013-11-07
上傳用戶：aa7821634
網絡家電，利用61板作為控制板，配合DM9000以太網模組，完成一個Web服務器，并具有控制功能基于凌陽單片機！
標簽： 網絡家電
上傳時間： 2013-12-20
上傳用戶：maizezhen
本文主要論述了一種基于51單片機為核心控制器的數控直流電源的設計原理和實現方法。該電源具有電壓可預置、可步進調整、輸出的電壓信號和電流信號可同時顯示功能。文章介紹了系統的總體設計方案，其主要由微控制器模塊、穩壓控制模塊、電壓/電流采樣模塊、顯示模塊、鍵盤模塊、電源模塊五部分構成。該系統原理是以STC89C52單片機為控制單元，以數模轉換芯片DAC0832輸出參考電壓控制電壓轉換模塊LM317輸出電壓大小，同時輸出穩壓、恒流采用模數轉換芯片ADC0832對采樣的電壓、電流轉換為數字信號，再通過單片機實現閉環控制。文章最后對數控直流電源的主要性能參數進行了測定和總結，并對其發展前景進行了展望。關鍵詞單片機（MCU）：數模轉換器（DAC）；模數轉換器（ADC）：閉環控制電源技術尤其是數控電源技術是一門實踐性很強的工程技術，服務于各行各業。當今電源技術融合了電氣、電子、系統集成、控制理論、材料等諸多學科領域。直流穩壓電源是電子技術常用的儀器設備之一，廣泛的應用于教學、科研等領域，是電子實驗員、電子設計人員及電路開發部門進行實驗操作和科學研究所不可缺少的電子儀器。在電子電路中，通常都需要電壓穩定的直流電源來供電。而整個穩壓過程是由電源變壓器、整流、濾波、穩壓等四部分組成。然而這種傳統的直流穩壓電源功能簡單、不好控制、可靠性低、干擾大、精度低且體積大、復雜度高。普通的直流穩壓電源品種有很多，但均存在以下二個問題：輸出電壓是通過粗調（波段開關）及細調（電位器）來調節。這樣，當輸出電壓需要精確輸出，或需要在一個小范圍內改變時，困難就較大。另外，隨著使用時間的增加，波段開關及電位器難免接觸不良，對輸出會有影響。穩壓方式均是采用串聯型穩壓電路，對過載進行限流或截流型保護，電路構成復雜，穩壓精度也不高。
上傳時間： 2022-04-05
上傳用戶：wangshoupeng199
量測可變電阻的類比電壓值，並將10位元的良測結果轉換成ASCII編碼，並輸出到個人電腦上的終端機
標簽：
上傳時間： 2014-01-19
上傳用戶：hzy5825468
