Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsiderations and general recommendations for choosing a 0.4mm- or 0.5mm-pitch WLP for yourapplication.
使用Nios II軟件構建工具
This chapter describes the Nios® II Software Build Tools (SBT), a set of utilities and
scripts that creates and builds embedded C/C++ application projects, user library
projects, and board support packages (BSPs). The Nios II SBT supports a repeatable,
scriptable, and archivable process for creating your software product.
You can invoke the Nios II SBT through either of the following user interfaces:
■ The Eclipse™ GUI
■ The Nios II Command Shell
The purpose of this chapter is to make you familiar with the internal functionality of
the Nios II SBT, independent of the user interface employed.
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
This application note shows how to achieve low-cost, efficient serial configuration for Spartan FPGA designs. The approachrecommended here takes advantage of unused resources in a design, thereby reducing the cost, part count, memory size,and board space associated with the serial configuration circuitry. As a result, neither processor nor PROM needs to be fullydedicated to performing Spartan configuration.In particular, information is provided on how the idle processing time of an on-board controller can be used to loadconfiguration data from an off-board source. As a result, it is possible to upgrade a Spartan design in the field by sending thebitstream over a network.
Design techniques for electronic systems areconstantly changing. In industries at the heart of thedigital revolution, this change is especially acute.Functional integration, dramatic increases incomplexity, new standards and protocols, costconstraints, and increased time-to-market pressureshave bolstered both the design challenges and theopportunities to develop modern electronic systems.One trend driving these changes is the increasedintegration of core logic with previously discretefunctions to achieve higher performance and morecompact board designs.
This application note covers the design considerations of a system using the performance
features of the LogiCORE™ IP Advanced eXtensible Interface (AXI) Interconnect core. The
design focuses on high system throughput through the AXI Interconnect core with F
MAX
and
area optimizations in certain portions of the design.
The design uses five AXI video direct memory access (VDMA) engines to simultaneously move
10 streams (five transmit video streams and five receive video streams), each in 1920 x 1080p
format, 60 Hz refresh rate, and up to 32 data bits per pixel. Each VDMA is driven from a video
test pattern generator (TPG) with a video timing controller (VTC) block to set up the necessary
video timing signals. Data read by each AXI VDMA is sent to a common on-screen display
(OSD) core capable of multiplexing or overlaying multiple video streams to a single output video
stream. The output of the OSD core drives the DVI video display interface on the board.
Performance monitor blocks are added to capture performance data. All 10 video streams
moved by the AXI VDMA blocks are buffered through a shared DDR3 SDRAM memory and are
controlled by a MicroBlaze™ processor.
The reference system is targeted for the Virtex-6 XC6VLX240TFF1156-1 FPGA on the
Xilinx® ML605 Rev D evaluation board
針對傳統集成電路（ASIC）功能固定、升級困難等缺點，利用FPGA實現了擴頻通信芯片STEL-2000A的核心功能。使用ISE提供的DDS IP核實現NCO模塊，在下變頻模塊調用了硬核乘法器并引入CIC濾波器進行低通濾波，給出了DQPSK解調的原理和實現方法，推導出一種簡便的引入?仔/4固定相移的實現方法。采用模塊化的設計方法使用VHDL語言編寫出源程序，在Virtex-II Pro 開發板上成功實現了整個系統。測試結果表明該系統正確實現了STEL-2000A的核心功能。
Abstract:
To overcome drawbacks of ASIC such as fixed functionality and upgrade difficulty, FPGA was used to realize the core functions of STEL-2000A. This paper used the DDS IP core provided by ISE to realize the NCO module, called hard core multiplier and implemented CIC filter in the down converter, described the principle and implementation detail of the demodulation of DQPSK, and derived a simple method to introduce a fixed phase shift of ?仔/4. The VHDL source code was designed by modularity method , and the complete system was successfully implemented on Virtex-II Pro development board. Test results indicate that this system successfully realize the core function of the STEL-2000A.
