Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時間： 2013-10-22
上傳用戶：ztj182002
FPGAs have changed dramatically since Xilinx first introduced them just 15 years ago. In thepast, FPGA were primarily used for prototyping and lower volume applications; custom ASICswere used for high volume, cost sensitive designs. FPGAs had also been too expensive and tooslow for many applications, let alone for System Level Integration (SLI). Plus, the development
標簽： Methodology Design Reuse FPGA
上傳時間： 2013-10-23
上傳用戶：旗魚旗魚
Abstract: This reference design provides design ideas for a cost-effective, low-power liquid-level measurement dataacquisition system (DAS) using a compensated silicon pressure sensor and a high-precision delta-sigma ADC. Thisdocument discusses how to select the compensated silicon pressure sensor, suggest system algorithms, and providenoise analyses. It also describes calibration ideas to improve system performance while also reducing complexity andcost.
上傳時間： 2013-10-08
上傳用戶：sjy1991
針對UHF讀寫器設(shè)計中，在符合EPC Gen2標準的情況下，對標簽返回的高速數(shù)據(jù)進行正確解碼以達到正確讀取標簽的要求，提出了一種新的在ARM平臺下采用邊沿捕獲統(tǒng)計定時器數(shù)判斷數(shù)據(jù)的方法，并對FM0編碼進行解碼。與傳統(tǒng)的使用定時器定時采樣高低電平的FM0解碼方法相比，該解碼方法可以減少定時器定時誤差累積的影響；可以將捕獲定時器數(shù)中斷與數(shù)據(jù)判斷解碼相對分隔開，使得中斷對解碼影響很小，實現(xiàn)捕獲與解碼的同步。通過實驗表明，這種方法提高了解碼的效率，在160 Kb/s的接收速度下，讀取一張標簽的時間約為30次/s。 Abstract: Aiming at the requirement of receiving correctly decoded data from the tag under high-speed communication which complied with EPC Gen2 standard in the design of UHF interrogator， the article introduced a new technology for FM0 decoding which counted the timer counter to judge data by using the edge interval of signal capture based on the ARM7 platform. Compared with the traditional FM0 decoding method which used the timer timed to sample the high and low level， the method could reduce the accumulation of timing error and could relatively separate capture timer interrupt and the data judgment for decoding， so that the disruption effect on the decoding was small and realizd synchronization of capture and decoding. Testing result shows that the method improves the efficiency of decoding， at 160 Kb/s receiving speed， the time of the interrogator to read a tag is about 30 times/s.
上傳時間： 2013-11-10
上傳用戶：liufei
The LPC1850/30/20/10 are ARM Cortex-M3 based microcontrollers for embeddedapplications. The ARM Cortex-M3 is a next generation core that offers systemenhancements such as low power consumption, enhanced debug features, and a highlevel of support block integration.The LPC1850/30/20/10 operate at CPU frequencies of up to 150 MHz. The ARMCortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture withseparate local instruction and data buses as well as a third bus for peripherals. The ARMCortex-M3 CPU also includes an internal prefetch unit that supports speculativebranching.The LPC1850/30/20/10 include up to 200 kB of on-chip SRAM data memory, a quad SPIFlash Interface (SPIFI), a State Configuration Timer (SCT) subsystem, two High-speedUSB controllers, Ethernet, LCD, an external memory controller, and multiple digital andanalog peripherals.
標簽： Cortex-M 1850 LPC 內(nèi)核微控制器
上傳時間： 2014-12-31
上傳用戶：zhuoying119
The LPC4350/30/20/10 are ARM Cortex-M4 based microcontrollers for embeddedapplications. The ARM Cortex-M4 is a next generation core that offers systemenhancements such as low power consumption, enhanced debug features, and a highlevel of support block integration.The LPC4350/30/20/10 operate at CPU frequencies of up to 150 MHz. The ARMCortex-M4 CPU incorporates a 3-stage pipeline, uses a Harvard architecture withseparate local instruction and data buses as well as a third bus for peripherals, andincludes an internal prefetch unit that supports speculative branching. The ARMCortex-M4 supports single-cycle digital signal processing and SIMD instructions. Ahardware floating-point processor is integrated in the core.The LPC4350/30/20/10 include an ARM Cortex-M0 coprocessor, up to 264 kB of datamemory, advanced configurable peripherals such as the State Configurable Timer (SCT)and the Serial General Purpose I/O (SGPIO) interface, two High-speed USB controllers,Ethernet, LCD, an external memory controller, and multiple digital and analog peripherals
上傳時間： 2013-10-28
上傳用戶：15501536189
中文版詳情瀏覽：http://www.elecfans.com/emb/fpga/20130715324029.html Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications. The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation. Some of the UltraScale architecture breakthroughs include: • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50% • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets • Greatly enhanced DSP and packet handling The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
標簽： UltraScale Xilinx 架構(gòu)
上傳時間： 2013-11-21
上傳用戶：wxqman
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時間： 2013-11-21
上傳用戶：不懂夜的黑
FPGAs have changed dramatically since Xilinx first introduced them just 15 years ago. In thepast, FPGA were primarily used for prototyping and lower volume applications; custom ASICswere used for high volume, cost sensitive designs. FPGAs had also been too expensive and tooslow for many applications, let alone for System Level Integration (SLI). Plus, the development
標簽： Methodology Design Reuse FPGA
上傳時間： 2013-11-01
上傳用戶：shawvi
The revolution of automation on factory floors is a key driver for the seemingly insatiable demand for higher productivity， lower total cost of ownership，and high safety. As a result， industrial applications drive an insatiable demand of higher data bandwidth and higher system-level performance. This white paper describes the trends and challenges seen by designers and how FPGAs enable solutions to meet their stringent design goals.
標簽： xilinx FPGAs 工業(yè) 中的應(yīng)用
上傳時間： 2013-11-08
上傳用戶：yan2267246
蟲蟲下載站版權(quán)所有 京ICP備2021023401號-1
