為了在CDMA系統中更好地應用QDPSK數字調制方式，在分析四相相對移相（QDPSK)信號調制解調原理的基礎上，設計了一種QDPSK調制解調電路，它包括串并轉換、差分編碼、四相載波產生和選相、相干解調、差分譯碼和并串轉換電路。在MAX+PLUSⅡ軟件平臺上，進行了編譯和波形仿真。綜合后下載到復雜可編程邏輯器件EPM7128SLC84-15中，測試結果表明，調制電路能正確選相，解調電路輸出數據與QDPSK調制輸入數據完全一致，達到了預期的設計要求。 Abstract: In order to realize the better application of digital modulation mode QDPSK in the CDMA system， a sort of QDPSK modulation-demodulation circuit was designed based on the analysis of QDPSK signal modulation-demodulation principles. It included serial/parallel conversion circuit, differential encoding circuit, four-phase carrier wave produced and phase chosen circuit, coherent demodulation circuit, difference decoding circuit and parallel/serial conversion circuit. And it was compiled and simulated on the MAX+PLUSⅡ software platform,and downloaded into the CPLD of EPM7128SLC84-15.The test result shows that the modulation circuit can exactly choose the phase，and the output data of the demodulator circuit is the same as the input data of the QDPSK modulate. The circuit achieves the prospective requirement of the design.
上傳時間： 2013-10-28
上傳用戶：jyycc
波長信號的解調是實現光纖光柵傳感網絡的關鍵，基于現有的光纖光柵傳感器解調方法，提出一種基于FPGA的雙匹配光纖光柵解調方法，此系統是一種高速率、高精度、低成本的解調系統，并且通過引入雙匹配光柵有效地克服了雙值問題同時擴大了檢測范圍。分析了光纖光柵的測溫原理并給出了該方案軟硬件設計，綜合考慮系統的解調精度和FPGA的處理速度給出了基于拉格朗日的曲線擬合算法。 Abstract: Sensor is one of the most important application of the fiber grating. Wavelength signal demodulating is the key techniques to carry out fiber grating sensing network， based on several existing methods of fiber grating sensor demodulation inadequate， a two-match fiber grating demodulation method was presented. This system is a high-speed， high precision， low-cost demodulation system. And by introducing a two-match grating effectively overcomes the problem of double value while expands the scope of testing. This paper analyzes the principle of fiber Bragg grating temperature and gives the software and hardware design of the program. Considering the system of demodulation accuracy and processing speed of FPGA，this paper gives the curve fitting algorithm based on Lagrange.
上傳時間： 2013-10-10
上傳用戶：zxc23456789
第一部分 信號完整性知識基礎.................................................................................5第一章 高速數字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設計流程剖析...............................................................61.3 相關的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質.................................................................................142.3.2 特征阻抗相關計算.............................................................................152.3.3 特性阻抗對信號完整性的影響.........................................................172.4 傳輸線電報方程及推導.............................................................................182.5 趨膚效應和集束效應.................................................................................232.6 信號的反射.................................................................................................252.6.1 反射機理和電報方程.........................................................................252.6.2 反射導致信號的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負載的匹配.................................................................................41第三章 串擾的分析...............................................................................................423.1 串擾的基本概念.........................................................................................423.2 前向串擾和后向串擾.................................................................................433.3 后向串擾的反射.........................................................................................463.4 后向串擾的飽和.........................................................................................463.5 共模和差模電流對串擾的影響.................................................................483.6 連接器的串擾問題.....................................................................................513.7 串擾的具體計算.........................................................................................543.8 避免串擾的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場屏蔽.........................................................................................654.3.1.2 磁場屏蔽.........................................................................................674.3.1.3 電磁場屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設計中的EMI.......................................................................................754.4.1 傳輸線RLC 參數和EMI ........................................................................764.4.2 疊層設計抑制EMI ..............................................................................774.4.3 電容和接地過孔對回流的作用.........................................................784.4.4 布局和走線規則.................................................................................79第五章 電源完整性理論基礎...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設計.............................................................................................855.3 同步開關噪聲分析.....................................................................................875.3.1 芯片內部開關噪聲.............................................................................885.3.2 芯片外部開關噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質和封裝影響.....................................................................955.4.3 電容并聯特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統時序.................................................................................................1006.1 普通時序系統...........................................................................................1006.1.1 時序參數的確定...............................................................................1016.1.2 時序約束條件...................................................................................1063.2 高速設計的問題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動布線器.......................................................2303.4 高速設計的大致流程...............................................................................2303.4.1 拓撲結構的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓撲模板驅動設計...................................................................2313.4.4 時序驅動布局...................................................................................2323.4.5 以約束條件驅動設計.......................................................................2323.4.6 設計后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進階運用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 圖形化的拓撲結構探索...........................................................................2344.3 全面的信號完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設計前和設計的拓撲結構提取.......................................................2354.6 仿真設置顧問...........................................................................................2354.7 改變設計的管理.......................................................................................2354.8 關鍵技術特點...........................................................................................2364.8.1 拓撲結構探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process Analysis) .236第五章 部分特殊的運用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進行前仿真.......................................................................2511.1 用LineSim 進行仿真工作的基本方法...................................................2511.2 處理信號完整性原理圖的具體問題.......................................................2591.3 在LineSim 中如何對傳輸線進行設置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進行串擾仿真...................................................................268第二章 使用BOARDSIM 進行后仿真......................................................................2732.1 用BOARDSIM 進行后仿真工作的基本方法...................................................2732.2 BoardSim 的進一步介紹..........................................................................2922.3 BoardSim 中的串擾仿真..........................................................................309
上傳時間： 2013-11-07
上傳用戶：aa7821634
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上傳時間： 2014-01-24
上傳用戶：s363994250
研究一種基于TMS320F28335 DSP（Digital Signal Processor）的全數字飛行器控制系統的硬件設計，分析了其結構組成：主控制器電路、舵面位置檢測電路和通訊等硬件電路設計。經過多次試驗調試，所設計的硬件系統可以滿足飛行器性能要求。
上傳時間： 2013-10-10
上傳用戶：z1191176801
The power of programmability gives industrial automation designers a highly efficient， cost-effective alternative to traditional motor control units （MCUs）。 The parallel-processing power， fast computational speeds， and connectivity versatility of Xilinx® FPGAs can accelerate the implementation of advanced motor control algorithms such as Field Oriented Control （FOC）。 Additionally， Xilinx devices lower costs with greater on-chip integration of system components and shorten latencies with high-performance digital signal processing （DSP） that can tackle compute-intensive functions such as PID Controller， Clark/Park transforms， and Space Vector PWM. The Xilinx Spartan®-6 FPGA Motor Control Development Kit gives designers an ideal starting point for evaluating time-saving， proven， motor-control reference designs. The kit also shortens the process of developing custom control capabilities， with integrated peripheral functions （Ethernet， PowerLink， and PCI® Express）， a motor-control FPGA mezzanine card （FMC） with built-in Texas Instruments motor drivers and high-precision Delta-Sigma modulators， and prototyping support for evaluating alternative front-end circuitry.
上傳時間： 2013-10-28
上傳用戶：wujijunshi
Delta-sigma ADCs, with their high accuracy and high noiseimmunity, are ideal for directly measuring many typesof sensors. Nevertheless, input sampling currents canoverwhelm high source impedances or low-bandwidth,micropower signal conditioning circuits. The LTC®2484family of delta sigma converters solves this problem bybalancing the input currents, thussimplifying or eliminatingthe need for signal conditioning circuits.
上傳時間： 2015-01-03
上傳用戶：潛水的三貢
在Multisim 10軟件環境下，設計一種由運算放大器構成的精確可控矩形波信號發生器，結合系統電路原理圖重點闡述了各參數指標的實現與測試方法。通過改變RC電路的電容充、放電路徑和時間常數實現了占空比和頻率的調節，通過多路開關投入不同數值的電容實現了頻段的調節，通過電壓取樣和同相放大電路實現了輸出電壓幅值的調節并提高了電路的帶負載能力，可作為頻率和幅值可調的方波信號發生器。Multisim 10仿真分析及應用電路測試結果表明，電路性能指標達到了設計要求。 Abstract: Based on Multisim 10， this paper designed a kind of rectangular-wave signal generator which could be controlled exactly composed of operational amplifier， the key point was how to implement and test the parameter indicators based on the circuit diagram. The duty and the frequency were adjusted by changing the time constant and the way of charging and discharging of the capacitor， the width of frequency was adjusted by using different capacitors provided with multiple switch， the amplitude of output voltage was adjusted by sampling voltage and using in-phase amplifier circuit，the ability of driving loads was raised， the circuit can be used as squarewave signal generator whose frequency and amplitude can be adjusted. The final simulation results of Multisim 10 and the tests of applicable circuit show that the performance indicators of the circuit meets the design requirements.
上傳時間： 2014-01-21
上傳用戶：shen007yue
利用EZ-USB接口芯片AN2131Q實現了基于TMS320C5409的水聲信號采集及混沌特性研究系統中的高速數據通信，提出了一種采用FIFO緩存芯片實現AN2131Q與TMS320C5409的連接方法，深入研究了EZ-USB序列接口芯片的固件、設備驅動和用戶程序開發過程。關鍵詞：AN2131Q; TMS320C5409; IDT72V02；數據通信ABSTRACT: Using AN2131Q as the control chip, the communication between DSP and PC in the underwater acoustic signal acquisition and chaotic characteristics study system is realized. The method is proposed that using FIFO to realize the connectivity between AN2131Q and TMS320C5409. The development of programming Firmware、device driver and user application are thoroughly researched.Key words: AN2131Q; TMS320C5409; IDT72V02; data communication
上傳時間： 2014-04-03
上傳用戶：hahayou
項目描述: Env_audit is a program that ferrets out everything it can about the environment. It looks for process IDs, UID, GID, signal masks, umask, priority, file descriptors, and environmental variables. It comes with test configurations for anacron, apache, atd, crond, GDB, inittab, logrotate, PHP, pppd, procmail, rsh, rxvt, sendmail, SSH, stunnel, sudo, xinetd, and xterm. env_audit是一個搜索有關環境的所有東西的程序。它查詢進程IDs，UID, GID,信號掩碼，umask,優先權，文件描述符，和環境變量。它提供了用于anacron, apache, atd, crond, GDB, inittab, logrotate, PHP, pppd, procmail, rsh, rxvt, sendmail, SSH, stunnel, sudo, xinetd, 和xterm的測試配置。 類別: Development Status: 5 - Production/Stable Environment: Console (Text Based) Intended Audience: System Administrators License: GNU General Public License (GPL) Operating System: POSIX Topic: Security
標簽： environment everything Env_audit ferrets
上傳時間： 2013-12-02
上傳用戶：qweqweqwe
