Abstract: Transimpedance amplifiers (TIAs) are widely used to translate the current output of sensors like photodiode-to-voltagesignals, since several circuits and instruments can only accept voltage input. An operational amplifier with a feedback resistor fromoutput to the inverting input is the most straightforward implementation of such a TIA. However, even this simple TIA circuit requirescareful trade-offs among NOISE gain, offset voltage, bandwidth, and stability. Clearly stability in a TIA is essential for good, reliableperformance. This application note explains the empirical calculations for assessing stability and then shows how to fine-tune theselection of the feedback phase-compensation capacitor.
Photodiodes can be broken into two categories: largearea photodiodes with their attendant high capacitance(30pF to 3000pF) and smaller area photodiodes withrelatively low capacitance (10pF or less). For optimalsignal-to-NOISE performance, a transimpedance amplifi erconsisting of an inverting op amp and a feedback resistoris most commonly used to convert the photodiode currentinto voltage. In low NOISE amplifi er design, large areaphotodiode amplifi ers require more attention to reducingop amp input voltage NOISE, while small area photodiodeamplifi ers require more attention to reducing op amp inputcurrent NOISE and parasitic capacitances.
Designers of signal receiver systems often need to performcascaded chain analysis of system performancefrom the antenna all the way to the ADC. NOISE is a criticalparameter in the chain analysis because it limits theoverall sensitivity of the receiver. An application’s NOISErequirement has a signifi cant infl uence on the systemtopology, since the choice of topology strives to optimizethe overall signal-to-NOISE ratio, dynamic range andseveral other parameters. One problem in NOISE calculationsis translating between the various units used by thecomponents in the chain: namely the RF, IF/baseband,and digital (ADC) sections of the circuit.
ANALOG INPUT BANDWIDTH is a measure of the frequencyat which the reconstructed output fundamental drops3 dB below its low frequency value for a full scale input. Thetest is performed with fIN equal to 100 kHz plus integer multiplesof fCLK. The input frequency at which the output is −3dB relative to the low frequency input signal is the full powerbandwidth.APERTURE JITTER is the variation in aperture delay fromsample to sample. Aperture jitter shows up as input NOISE.APERTURE DELAY See Sampling Delay.BOTTOM OFFSET is the difference between the input voltagethat just causes the output code to transition to the firstcode and the negative reference voltage. Bottom Offset isdefined as EOB = VZT–VRB, where VZT is the first code transitioninput voltage and VRB is the lower reference voltage.Note that this is different from the normal Zero Scale Error.CONVERSION LATENCY See PIPELINE DELAY.CONVERSION TIME is the time required for a completemeasurement by an analog-to-digital converter. Since theConversion Time does not include acquisition time, multiplexerset up time, or other elements of a complete conversioncycle, the conversion time may be less than theThroughput Time.DC COMMON-MODE ERROR is a specification which appliesto ADCs with differential inputs. It is the change in theoutput code that occurs when the analog voltages on the twoinputs are changed by an equal amount. It is usually expressed in LSBs.
Radio Frequency Integrated Circuit Design
I enjoyed reading this book for a number of reasons. One reason is that itaddresses high-speed analog design in the context of microwave issues. This isan advanced-level book, which should follow courses in basic circuits andtransmission lines. Most analog integrated circuit designers in the past workedon applications at low enough frequency that microwave issues did not arise.As a consequence, they were adept at lumped parameter circuits and often notcomfortable with circuits where waves travel in space. However, in order todesign radio frequency (RF) communications integrated circuits (IC) in thegigahertz range, one must deal with transmission lines at chip interfaces andwhere interconnections on chip are far apart. Also, impedance matching isaddressed, which is a topic that arises most often in microwave circuits. In mycareer, there has been a gap in comprehension between analog low-frequencydesigners and microwave designers. Often, similar issues were dealt with in twodifferent languages. Although this book is more firmly based in lumped-elementanalog circuit design, it is nice to see that microwave knowledge is brought inwhere necessary.Too many analog circuit books in the past have concentrated first on thecircuit side rather than on basic theory behind their application in communications.The circuits usually used have evolved through experience, without asatisfying intellectual theme in describing them. Why a given circuit works bestcan be subtle, and often these circuits are chosen only through experience. Forthis reason, I am happy that the book begins first with topics that require anintellectual approach—NOISE, linearity and filtering, and technology issues. Iam particularly happy with how linearity is introduced (power series). In therest of the book it is then shown, with specific circuits and numerical examples,how linearity and NOISE issues arise.
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of
Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI NOISE prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
