PLC TM卡開發系統匯編程序(ATM8051)
;***************** 定義管腳*************************SCL BIT P1.0SDA BIT P1.1GC BIT P1.2BZ BIT P3.6LEDI BIT P1.4LEDII BIT P1.5OK BIT 20H.1OUT1 BIT P1.3OUT2 BIT P1.0OUT3 BIT P1.1RXD BIT P3.0TXD BIT P3.1PCV BIT P3.2WPC BIT P3.3RPC BIT P3.5LEDR BIT P3.4LEDL BIT P3.6TM BIT P3.7;********************定義寄存器***********************ROMDTA EQU 30H;NUMBY EQU 61H;SLA EQU 60H;MTD EQU 2FH;MRD EQU 40H;TEMP EQU 50H;;ORG 00H;;INDEX:MOV P1, #00H;MOV P2, #0FFHMOV MTD ,#00HCALL REEMOV R0,40HCJNE R0,#01,NO;MOV P2,#1CHLJMP VIMEN MOV P2,#79HACALL TOUCHRESET ;JNC NO ;CALL READTM ;CJNE A,#01H,NO;NOPMOV MTD, #00HCALL WEENOPMOV P2,#4AHSETB BZCALL TIMECLR BZMOV PCON, #0FFHVIME:CALL TIME1CALL TOUCHRESETJNC VIMECALL READTMCJNE A, #01H,VIME;NOPNOPNOPIII: MOV MTD,#00HCALL REECALL BBJNB OK,NO1LJMP ZHUNO1:MOV MTD,#10H
用單片機配置FPGA—PLD設計技巧
Configuration/Program Method for Altera Device
Configure the FLEX Device
You can use any Micro-Controller to configure the FLEX device–the main idea is clocking in ONE BITof configuration data per CLOCK–start from the BIT 0The total Configuration time–e.g. 10K10 need 15K byte configuration file•calculation equation–10K10* 1.5= 15Kbyte–configuration time for the file itself•15*1024*8*clock = 122,880Clock•assume the CLOCK is 4MHz•122,880*1/4Mhz=30.72msec
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their productsor to discontinue any product or service without notice, and advise customers to obtain the latestversion of relevant information to verify, before placing orders, that information being relied onis current and complete. All products are sold subject to the terms and conditions of sale suppliedat the time of order acknowledgement, including those pertaining to warranty, patentinfringement, and limitation of liability
This white paper discusses how market trends, the need for increased productivity, and new legislation have
accelerated the use of safety systems in industrial machinery. This TÜV-qualified FPGA design methodology is
changing the paradigms of safety designs and will greatly reduce development effort, system complexity, and time to
market. This allows FPGA users to design their own customized safety controllers and provides a significant
competitive advantage over traditional microcontroller or ASIC-based designs.
Introduction
The basic motivation of deploying functional safety systems is to ensure safe operation as well as safe behavior in
cases of failure. Examples of functional safety systems include train brakes, proximity sensors for hazardous areas
around machines such as fast-moving robots, and distributed control systems in process automation equipment such
as those used in petrochemical plants.
The International Electrotechnical Commission’s standard, IEC 61508: “Functional safety of
electrical/electronic/programmable electronic safety-related systems,” is understood as the standard for designing
safety systems for electrical, electronic, and programmable electronic (E/E/PE) equipment. This standard was
developed in the mid-1980s and has been revised several times to cover the technical advances in various industries.
In addition, derivative standards have been developed for specific markets and applications that prescribe the
particular requirements on functional safety systems in these industry applications. Example applications include
process automation (IEC 61511), machine automation (IEC 62061), transportation (railway EN 50128), medical (IEC
62304), automotive (ISO 26262), power generation, distribution, and transportation.
圖Figure 1. Local Safety System
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
In the past decade, the size and complexity of manyFPGA designs exceeds the time and resourcesavailable to most design teams, making the use andreuse of Intellectual Property (IP) imperative.However, integrating numerous IP blocks acquiredfrom both internal and external sources can be adaunting challenge that often extends, rather thanshortens, design time. As today's designs integrateincreasing amounts of functionality, it is vital thatdesigners have access to proven, up-to-date IP fromreliable sources.
Design techniques for electronic systems areconstantly changing. In industries at the heart of thedigital revolution, this change is especially acute.Functional integration, dramatic increases incomplexity, new standards and protocols, costconstraints, and increased time-to-market pressureshave bolstered both the design challenges and theopportunities to develop modern electronic systems.One trend driving these changes is the increasedintegration of core logic with previously discretefunctions to achieve higher performance and morecompact board designs.
This application note describes how the existing dual-port block memories in the Spartan™-IIand Virtex™ families can be used as Quad-Port memories. This essentially involves a dataaccess time (halved) versus functionality (doubled) trade-off. The overall bandwidth of the blockmemory in terms of bits per second will remain the same.
