Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of
Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
This document provides practical, common guidelines for incorporating PCI Express interconnect
layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10-
layer or more server baseboard designs. Guidelines and constraints in this document are intended
for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI
Express devices located on the same baseboard (chip-to-chip routing) and interconnects between
a PCI Express device located “down” on the baseboard and a device located “up” on an add-in
card attached through a connector.
This document is intended to cover all major components of the physical interconnect including
design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card
edge-finger and connector considerations. The intent of the guidelines and examples is to help
ensure that good high-speed signal design practices are used and that the timing/jitter and
loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect.
However, while general physical guidelines and suggestions are given, they may not necessarily
guarantee adequate performance of the interconnect for all layouts and implementations.
Therefore, designers should consider modeling and simulation of the interconnect in order to
ensure compliance to all applicable specifications.
The document is composed of two main sections. The first section provides an overview of
general topology and interconnect guidelines. The second section concentrates on physical layout
constraints where bulleted items at the beginning of a topic highlight important constraints, while
the narrative that follows offers additional insight.
The revolution of automation on factory floors is a key driver for the seemingly insatiable demand for higher productivity， lower total cost of ownership，and high safety. As a result， industrial applications drive an insatiable demand of higher data bandwidth and higher system-level performance.
This white paper describes the trends and challenges seen by designers and how FPGAs enable solutions to meet their stringent design goals.
Abstract: Many modern industrial, medical, and commercial applications require temperature measurements in the extended temperature rangewith accuracies of ±0.3°C or better, performed with reasonable cost and often with low power consumption. This article explains how platinumresistance temperature detectors (PRTDs) can perform measurements over wide temperature ranges of -200°C to +850°C, with absolute accuracyand repeatability better than ±0.3°C, when used with modern processors capable of resolving nonlinear mathematical equation quickly and costeffectively. This article is the second installment of a series on PRTDs. For the first installment, please read application note 4875, "High-Accuracy Temperature Measurements Call for Platinum Resistance Temperature Detectors (PRTDs) and Precision Delta-Sigma ADCs."
基于通用集成運算放大器，利用MASON公式設計了一個多功能二階通用濾波器，能同時或分別實現低通、高通和帶通濾波，也能設計成一個正交振蕩器。電路的極點頻率和品質因數能夠獨立、精確地調節。電路使用4個集成運放、2個電容和11個電阻，所有集成運放的反相端虛地。利用計算機仿真電路的通用濾波功能、極點頻率和品質因數的獨立控制和正交正弦振蕩，從而證明該濾波器正確有效。
Abstract:
A new multifunctional second-order filter based on OPs was presented by MASON formula. Functions， such as high-pass， band-pass， low-pass filtering， can be realized respectively and simultaneously， and can become a quadrature oscillator by modifying resistance ratio. Its pole angular frequency and quality factor can be tuned accurately and independently. The circuit presented contains four OPs， two capacitors， and eleven resistances， and inverting input of all OPs is virtual ground. Its general filtering， the independent control of pole frequency and quality factor and quadrature sinusoidal oscillation were simulated by computer， and the result shows that the presented circuit is valid and effective.
Tug of War(A tug of war is to be arranged at the local office picnic. For the tug of war, the picnickers must be divided into two teams. Each person must be on one team or the other the number of people on the two teams must not differ by more than 1 the total weight of the people on each team should be as nearly equal as possible. The first line of input contains n the number of people at the picnic. n lines follow. The first line gives the weight of person 1 the second the weight of person 2 and so on. Each weight is an integer between 1 and 450. There are at most 100 people at the picnic. Your output will be a single line containing 2 numbers: the total weight of the people on one team, and the total weight of the people on the other team. If these numbers differ, give the lesser first. )
