Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
This application note describes how the existing dual-port block memories in the Spartan™-IIand Virtex™ families can be used as Quad-Port memories. This essentially involves a dataaccess time (halved) versus functionality (doubled) trade-off. The overall bandwidth of the blockmemory in terms of bits per second will remain the same.
The introduction of Spartan-3™ devices has createdmultiple changes in the evolution of embedded controldesigns and pushed processing capabilities to the “almostfreestage.” With these new FPGAs falling under $20, involume, with over 1 million system gates, and under $5for 100K gate-level units, any design with programmablelogic has a readily available 8- or 16-bit processor costingless than 75 cents and 32-bit processor for less than $1.50.
In this paper, we discuss efficient coding and design styles using verilog. This can beimmensely helpful for any digital designer initiating designs. Here, we address different problems rangingfrom RTL-Gate Level simulation mismatch to race conditions in writing behavioral models. All theseproblems are accompanied by an example to have a better idea, and these can be taken care off if thesecoding guidelines are followed. Discussion of all the techniques is beyond the scope of this paper, however,here we try to cover a few of them.
This document was developed under the Standard Hardware and Reliability Program (SHARP) TechnologyIndependent Representation of Electronic Products (TIREP) project. It is intended for use by VHSIC HardwareDescription Language (VHDL) design engineers and is offered as guidance for the development of VHDL modelswhich are compliant with the VHDL Data Item Description (DID DI-EGDS-80811) and which can be providedto manufacturing engineering personnel for the development of production data and the subsequent productionof hardware. Most VHDL modeling performed to date has been concentrated at either the component level orat the conceptual system level. The assembly and sub-assembly levels have been largely disregarded. Under theSHARP TIREP project, an attempt has been made to help close this gap. The TIREP models are based upon lowcomplexity Standard Electronic Modules (SEM) of the format A configuration. Although these modules are quitesimple, it is felt that the lessons learned offer guidance which can readily be applied to a wide range of assemblytypes and complexities.
FPGAs have changed dramatically since Xilinx first introduced them just 15 years ago. In thepast, FPGA were primarily used for prototyping and lower volume applications; custom ASICswere used for high volume, cost sensitive designs. FPGAs had also been too expensive and tooslow for many applications, let alone for System Level Integration (SLI). Plus, the development
UART 4 UART參考設計，Xilinx提供VHDL代碼 uart_vhdl
This zip file contains the following folders:
\vhdl_source -- Source VHDL files:
uart.vhd - top level file
txmit.vhd - transmit portion of uart
rcvr.vhd - - receive portion of uart
\vhdl_testfixture -- VHDL Testbench files. This files only include the testbench behavior, they
do not instantiate the DUT. This can easily be done in a top-level VHDL
file or a schematic. This folder contains the following files:
txmit_tb.vhd -- Test bench for txmit.vhd.
rcvr_tf.vhd -- Test bench for rcvr.vhd.
