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Surface

Surface是美國(guó)微軟公司推出的全新硬件品牌,微軟公司于2012年6月19日發(fā)布了Surface系列平板電腦。這款平板電腦采用鎂合金機(jī)身10.6英寸顯示屏,配備USB2.0或3.0接口,使用Windows8操作系統(tǒng)。微軟官網(wǎng)將其稱(chēng)為“全高清顯示屏”,屏幕比例為16:9。這款產(chǎn)品分為兩個(gè)版本:一個(gè)使用Windows8專(zhuān)為ARM設(shè)計(jì)的版本W(wǎng)indowsRT;另一個(gè)使用英特爾Corei5IvyBridge處理器,使用Windows8Pro。2012年10月26日,中國(guó)市場(chǎng)由蘇寧全球同步首發(fā)微軟Surface
  • wangluo ppt

    最小二乘法曲面擬合,包括C程序及說(shuō)明文件。對(duì)于搞三維重建的有一定幫助-Least squares Surface fitting, including the C procedures and documentation. For engaging in three-dimensional reconstruction to some extent help the

    標(biāo)簽: 通信網(wǎng)

    上傳時(shí)間: 2015-11-28

    上傳用戶(hù):schhqq

  • DDS 8IP

    Photoshop dds 插件photoshop dds插件是DirectDraw Surface的縮寫(xiě),實(shí)際上,它是DirectX紋理壓縮(DirectX Texture Compression,簡(jiǎn)稱(chēng)DXTC)的產(chǎn)物。DXTC減少了紋理內(nèi)存消耗的50%甚至更多,有3種DXTC的格式可供使用,它們分別是DXT1,DXT3和DXT5。 在OrigoEngine的材質(zhì)系統(tǒng)中,可以看到很多的dds文件。可以簡(jiǎn)單地認(rèn)為這些dds文件同bmp、tga等常見(jiàn)的圖片格式一樣,記錄了一張圖片的信息,如果我們?cè)趐hotoshop中使用dds的插件,就可以在photoshop中打開(kāi)這些文件。有個(gè)插件安裝了就可以查看看DDS格式圖片,好像一般是游戲的。

    標(biāo)簽: DDS 8IP

    上傳時(shí)間: 2015-12-17

    上傳用戶(hù):dummer

  • 鋰硫電池隔膜

    Lithium–sulfur batteries are a promising energy-storage technology due to their relatively low cost and high theoretical energy density. However, one of their major technical problems is the shuttling of soluble polysulfides between electrodes, resulting in rapid capacity fading. Here, we present a metal–organic framework (MOF)-based battery separator to mitigate the shuttling problem. We show that the MOF-based separator acts as an ionic sieve in lithium–sulfur batteries, which selectively sieves Li+ ions while e ciently suppressing undesired polysulfides migrating to the anode side. When a sulfur-containing mesoporous carbon material (approximately 70 wt% sulfur content) is used as a cathode composite without elaborate synthesis or Surface modification, a lithium–sulfur battery with a MOF-based separator exhibits a low capacity decay rate (0.019% per cycle over 1,500 cycles). Moreover, there is almost no capacity fading after the initial 100 cycles. Our approach demonstrates the potential for MOF-based materials as separators for energy-storage applications.

    標(biāo)簽: 鋰硫電池 隔膜

    上傳時(shí)間: 2017-11-23

    上傳用戶(hù):653357637

  • 貼片鋁電解電容封裝庫(kù)

    貼片鋁電解電容封裝庫(kù) SMD Aluminum Electrolytic Capacitors VE Features ? 3 ~ 16φ, 85℃, 2,000 hours assured ? Chip type large capacitance capacitors ? Designed for Surface mounting on high density PC board. ? RoHS Compliance

    標(biāo)簽: 貼片 封裝庫(kù) 鋁電解電容

    上傳時(shí)間: 2018-05-09

    上傳用戶(hù):angel20041401

  • SDN Software Defined Networks

    The first question most readers of an O’Reilly book might ask is about the choice of the cover animal. In this case, “why a duck?” Well, for the record, our first choice was a unicorn decked out in glitter and a rainbow sash. That response always gets a laugh (we are sure you just giggled a little), but it also brings to the Surface a common perception of software-defined networks among many expe‐ rienced network professionals. Although we think there is some truth to this perception, there is certainly more meat than myth to this unicorn.

    標(biāo)簽: Networks Software Defined SDN

    上傳時(shí)間: 2020-06-01

    上傳用戶(hù):shancjb

  • Chemical mechanical polishing

    The planarization technology of Chemical-Mechanical-Polishing (CMP), used for the manufacturing of multi- level metal interconnects for high-density Integrated Circuits (IC), is also readily adaptable as an enabling technology in MicroElectroMechanical Systems (MEMS) fabrication, particularly polysilicon Surface micromachining. CMP not only eases the design and manufacturability of MEMS devices by eliminating several photolithographic and film issues generated by severe topography, but also enables far greater flexibility with process complexity and associated designs. T

    標(biāo)簽: mechanical polishing Chemical

    上傳時(shí)間: 2020-06-06

    上傳用戶(hù):shancjb

  • MICRO HDMI TF卡 USBTYPE-C USB-側(cè)立式 攝像頭FPC-24P OLED屏模

    MICRO HDMI TF卡 USBTYPE-C USB-側(cè)立式 攝像頭FPC-24P OLED屏模塊AD集成庫(kù)(原理圖庫(kù)+3D封裝庫(kù)),).IntLib后綴文件,拆分后文件為PcbLib+SchLib格式,Altium Designer原理圖庫(kù)+PCB封裝庫(kù),已驗(yàn)證使用,可以直接應(yīng)用到你的項(xiàng)目開(kāi)發(fā)。器件列表:ANT-Rainsun-AP5120AZ1045-04F          BSN20BKR            N-Channel 60 V 2.8 Ohm 310 mW 0.49 nC Surface Mount Trench MosFet - SOT-23ButtonTACT_3x4x2_180ButtonCP2102              USB轉(zhuǎn)TTLESD-0402            ESDHDR2x4_2.54         HeaderLED_0402            LEDLM4871LP2992              LDOMIC                 Micro-HDMI          Conn Micro HDMI RCP 19 POS 0.4mm Solder RA SMD 19 Terminal 1 Port Micro HDMI Embossed T/RNL27WZU04DF         OLED-6432           顯示屏OV2640              Header, 24-PinQuantum-Quark-Core  RJ45座              RJ45座RT9011              TF卡座              8腳自彈USB-Type-C-TOP      USB-WiFi-ANTUSB-側(cè)立式          USB A Skt, Upright/Flag, R/A GF, W/kinked shell stake, tray電容-0402           Capacitor電容-0603           Capacitor電阻-0402           Resistor二極管-5B5817WS     40V晶振-4Pin-無(wú)源      2520無(wú)源選擇跳線            Resistor

    標(biāo)簽: usb 攝像頭 fpc oled

    上傳時(shí)間: 2022-01-09

    上傳用戶(hù):

  • PW2053-2.0.pdf規(guī)格書(shū)

    The PW2053 is a high-efficiency monolithic synchronous buck regulator using a constantfrequency, current mode architecture. The device is available in an adjustable version. Supply currentwith no load is 40uA and drops to <1uA in shutdown. The 2.5V to 5.5V input voltage range makesthe PW2053 ideally suited for single Li-Ion battery powered applications. 100% duty cycle provideslow dropout operation, extending battery life in portable systems. PWM/PFM mode operationprovides very low output ripple voltage for noise sensitive applications. Switching frequency isinternally set at 1.2MHz, allowing the use of small Surface mount inductors and capacitors. Lowoutput voltages are easily supported with the 0.6V feedback reference voltage

    標(biāo)簽: pw2053

    上傳時(shí)間: 2022-02-14

    上傳用戶(hù):jason_vip1

  • 最新FPC生產(chǎn)流程介紹

    SMT(Surface mount technology)是可在“板面上”滿及焊牢棲多敷“表面黏裝零件的電子裝配技術(shù).侵貼:1.可在板上雨成同特焊接,封裝密度提高50~70%.WW2.l短,提高博輸速度3.可使用更高刪敷.4.自勤化,快速,成本低.1.表面貼裝零件SOIC(small outline integrate circle)RESISTANCE(電阻)CAPACITANCE(電容)AMPLCC(plastic leaded chip carriers)CONNECT etc.(結(jié)器)封裝材料1.)陶瓷(BeO):精度高,密封度高(CTE:5~7PPM/℃)封板子熟膨服要求高2.)聚硫胺醚(Polyetherimide):一可用玻璃逛行封合的耐高溫熟塑性塑廖,機(jī)械,電子性能侵良AwIR各波皆敏感,易分解,生“酸泡”現(xiàn)象.3.)熔融矽砂(Fused silica),暖氧橫脂

    標(biāo)簽: fpc

    上傳時(shí)間: 2022-07-27

    上傳用戶(hù):zhaiyawei

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