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The TRS232E is a dual driver/receiver that includes a capacitive voltage generator to supply TIA/RS-232-Fvoltage levels from a single 5-V supply. Each receiver converts TIA/RS-232-F inputs to 5-V TTL/CMOS levels.This receiver has a Typical threshold of 1.3 V, a Typical hysteresis of 0.5 V, and can accept ±30-V inputs. Eachdriver converts TTL/CMOS input levels into TIA/RS-232-F levels. The driver, receiver, and voltage-generatorfunctions are available as cells in the Texas Instruments LinASIC™ library.
標(biāo)簽：
RECEIVER
DRIVER
DUAL
232
上傳時(shí)間：
2013-10-07
上傳用戶：waitingfy
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The MAX3243E device consists of three line drivers, five line receivers, and a dual charge-pump circuit with±15-kV ESD (HBM and IEC61000-4-2, Air-Gap Discharge) and ±8-kV ESD (IEC61000-4-2, Contact Discharge)protection on serial-port connection pins. The device meets the requirements of TIA/EIA-232-F and provides theelectrical interface between an asynchronous communication controller and the serial-port connector. Thiscombination of drivers and receivers matches that needed for the Typical serial port used in an IBM PC/AT, orcompatible. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-Vsupply. In addition, the device includes an always-active noninverting output (ROUT2B), which allowsapplications using the ring indicator to transmit data while the device is powered down. The device operates atdata signaling rates up to 250 kbit/s and a maximum of 30-V/ms driver output slew rate.
標(biāo)簽：
MULTICHANNEL
5.5
TO
RS
上傳時(shí)間：
2013-10-19
上傳用戶：ddddddd
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PCA9511, PCA9512, PCA9513, PCA9514, PCA9515, PCA9516, PCA9518,P82B96, P82B715Abstract - Philips Semiconductors family of Repeaters, Hubs and Expanders are detailed in this application notethat discusses device operation, maximum cable length and frequency calculations and Typical applications.
標(biāo)簽：
REPEATERS
SMBus
255
AN
上傳時(shí)間：
2013-11-21
上傳用戶：wlcaption
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摘 要 瞬態(tài)仿真領(lǐng)域的許多工作需要獲得可視化數(shù)據(jù), 仿真電路不能將輸出參數(shù)繪制成圖形時(shí)研究工作將受到很大影響. 而權(quán)威電路仿真軟件PSpice 在這個(gè)方面不盡如人意. 本文提出了一種有效的解決辦法: 通過MATLAB 編程搭建一個(gè)PSpice 與MATLAB 的數(shù)據(jù)接口,使PSpice輸出數(shù)據(jù)文件可以導(dǎo)入到MATLAB中繪制圖形. 這令我們能夠很方便地獲得數(shù)據(jù)的規(guī)律以有效地分析仿真結(jié)果, 這項(xiàng)技術(shù)對(duì)于教學(xué)和工程實(shí)踐都有比較實(shí)際的幫助.關(guān)鍵詞: 瞬態(tài)仿真 仿真程序 PSpice MATLAB 可視化數(shù)據(jù)The Data Transfer from Pspice to MATLABWu hao Ning yuanzhong Liang yingAbstract Many works in the area of transient simulation has shown how a emulator such asPSpice can be interfaced to an control analysis package such as MATLAB to get viewdata. Thepaper describes how such interfaces can be made using the MATLAB programming. The platformas a Typical platform will solve the problem that PSpice software sometimes can not draw the datato a picture. It can make us find the rule from numerous data very expediently, so we can analyzethe outcome of the simulation. And it also can be used in the field of education.Keywords Transient Simulation Emulator PSpice MATLAB Viewdata1 引言科學(xué)研究和工程應(yīng)用常需要進(jìn)行電路仿真 PSpice可進(jìn)行直流 交流 瞬態(tài)等基本電路特性分析 也可進(jìn)行蒙托卡諾 MC 統(tǒng)計(jì)分析 最壞情況 Wcase 分析 優(yōu)化設(shè)計(jì)等復(fù)雜電路特性分析 它是國(guó)際上仿真電路的權(quán)威軟件 而MATLAB的主要特點(diǎn)有 高效方便的矩陣和數(shù)組運(yùn)算 編程效率高 結(jié)構(gòu)化面向?qū)ο?方便的繪圖功能 用戶使用方便 工具箱功能強(qiáng)大 兩者各有著重點(diǎn) 兩種軟件結(jié)合應(yīng)用 對(duì)研究工作有很重要的意義香港理工大學(xué)Y. S. LEE 等人首先將PSpice和MATLAB結(jié)合 開發(fā)了電力電子電路優(yōu)化用的CAD 程序MATSPICE[6] 將兩者相結(jié)合的關(guān)鍵在于 如何用MATLAB 獲取PSpice的仿真數(shù)據(jù) 對(duì)此參考文獻(xiàn) 6 里沒有詳細(xì)敘述 本文著重說(shuō)明用MATLAB 讀取PSpice仿真數(shù)據(jù)的具體方法本論文利用MATLAB對(duì)PSpice仿真出的數(shù)據(jù)處理繪制出后者無(wú)法得到或是效果不好的仿真圖形 下面就兩者結(jié)合使用的例子 進(jìn)行具體說(shuō)明
標(biāo)簽：
MATLAB
PSpice
數(shù)據(jù)
接口技術(shù)
上傳時(shí)間：
2013-10-20
上傳用戶：wuchunzhong
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中文版詳情瀏覽：http://www.elecfans.com/emb/fpga/20130715324029.html
Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture
The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications.
The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving Typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation.
Some of the UltraScale architecture breakthroughs include:
• Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50%
• Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability
• Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization
• 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard
• Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets
• Greatly enhanced DSP and packet handling
The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
標(biāo)簽：
UltraScale
Xilinx
架構(gòu)
上傳時(shí)間：
2013-11-13
上傳用戶：瓦力瓦力hong
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The NCV7356 is a physical layer device for a single wire data linkcapable of operating with various Carrier Sense Multiple Accesswith Collision Resolution (CSMA/CR) protocols such as the BoschController Area Network (CAN) version 2.0. This serial data linknetwork is intended for use in applications where high data rate is notrequired and a lower data rate can achieve cost reductions in both thephysical media components and in the microprocessor and/ordedicated logic devices which use the network.The network shall be able to operate in either the normal data ratemode or a high-speed data download mode for assembly line andservice data transfer operations. The high-speed mode is onlyintended to be operational when the bus is attached to an off-boardservice node. This node shall provide temporary bus electrical loadswhich facilitate higher speed operation. Such temporary loads shouldbe removed when not performing download operations.The bit rate for normal communications is Typically 33 kbit/s, forhigh-speed transmissions like described above a Typical bit rate of83 kbit/s is recommended. The NCV7356 features undervoltagelockout, timeout for faulty blocked input signals, output blankingtime in case of bus ringing and a very low sleep mode current.
標(biāo)簽：
CANBUS
7356
NCV
單線
上傳時(shí)間：
2013-10-24
上傳用戶：s藍(lán)莓汁
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Abstract: This article explains the recent trend in heart-rate and fitness monitors to go wireless toeliminate cables to allow free movement, and allow convenient data collection without the need to plug intheir devices. It details a Typical wireless system, using the MAX1472 crystal-referenced phase-lockedloop (PLL) VHF/UHF transmitter.
標(biāo)簽：
Heart-RateFitness
Monitors
Wireless
Go
上傳時(shí)間：
2013-11-11
上傳用戶：xiaowei314
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Radio Frequency Identifi cation (RFID) technology usesradiated and refl ected RF power to identify and track avariety of objects. A Typical RFID system consists of areader and a transponder (or tag). An RFID reader containsan RF transmitter, one or more antennas and an RFreceiver. An RFID tag is simply an uniquely identifi ed ICwith an antenna.
標(biāo)簽：
RFID
381
DN
接收器
上傳時(shí)間：
2013-10-17
上傳用戶：lepoke
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通過比較各種隔離數(shù)字通信的特點(diǎn)和應(yīng)用范圍，指出塑料光纖在隔離數(shù)字通信中的優(yōu)勢(shì)。使用已經(jīng)標(biāo)準(zhǔn)化的TOSLINK接口，有利于節(jié)省硬件開發(fā)成本和簡(jiǎn)化設(shè)計(jì)難度。給出了塑料光纖的硬件驅(qū)動(dòng)電路，說(shuō)明設(shè)計(jì)過程中的注意事項(xiàng)，對(duì)光收發(fā)模塊的電壓特性和頻率特性進(jìn)行全面試驗(yàn)，并給出SPI口使用塑料光纖隔離通信的典型應(yīng)用電路圖。試驗(yàn)結(jié)果表明，該設(shè)計(jì)可為電力現(xiàn)場(chǎng)、電力電子及儀器儀表的設(shè)計(jì)提供參考。
Abstract:
y comparing characteristics and applications area of various isolated digital communications， this article indicates advantages of plastic optical fiber in isolated digital communications. Using the standardized TOSLINK interface， it helps to control costs and difficulty in hardware development and design. Then it gives the hardware driver circuit of plastic optical fiber module， explains the noticed details in design process， gives results on the basis of the optical transceiver module voltage characteristics and frequency characteristics tests. Finally，it gives Typical application circuit of the SPI communication port by using plastic optical fiber isolation .The results show that this design can be referenced for the power field， power electronics and instrumentation design.
標(biāo)簽：
塑料光纖
高壓隔離
通信
接口設(shè)計(jì)
上傳時(shí)間：
2014-01-10
上傳用戶：gundan
-
中文版詳情瀏覽：http://www.elecfans.com/emb/fpga/20130715324029.html
Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture
The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications.
The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving Typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation.
Some of the UltraScale architecture breakthroughs include:
• Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50%
• Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability
• Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization
• 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard
• Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets
• Greatly enhanced DSP and packet handling
The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
標(biāo)簽：
UltraScale
Xilinx
架構(gòu)
上傳時(shí)間：
2013-11-21
上傳用戶：wxqman
