Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
This application note shows how a Xilinx CoolRunnerTM-II CPLD can be used as a simplelogical switch that can quickly and reliably select between different MPEG video sources. Thesource code for the design is available on the Xilinx website, and is linked from the “VHDLCode” section. The code can be expanded by the user to perform additional operations usingthe remaining CPLD resources
XAPP520將符合2.5V和3.3V I/O標準的7系列FPGA高性能I/O Bank進行連接
The I/Os in Xilinx® 7 series FPGAs are classified as either high range (HR) or high performance (HP) banks. HR I/O banks can be operated from 1.2V to 3.3V, whereas HP I/O banks are optimized for operation between 1.2V and 1.8V. In circumstances that require an HP 1.8V I/O bank to interface with 2.5V or 3.3V logic, a range of options can be deployed. This application note describes methodologies for interfacing 7 series HP I/O banks with 2.5V and 3.3V systems
Calculation of the Differential Impedance of Tracks on FR4 substrates
There is a discrepancy between calculated and measured values of impedance for differential transmission lineson FR4. This is especially noticeable in the case of surface microstrip configurations. The anomaly is shown tobe due to the nature of the substrate material. This needs to be considered as a layered structure of epoxy resinand glass fibre. Calculations, using Boundary Element field methods, show that the distribution of the electricfield within this layered structure determines the apparent dielectric constant and therefore affects theimpedance. Thus FR4 cannot be considered to be uniform dielectric when calculating differential impedance.
解壓密碼：www.elecfans.com 隨著微電子技術的迅速發展以及集成電路規模不斷提高，對電路性能的設計
要求越來越嚴格，這勢必對用于大規模集成電路設計的EDA 工具提出越來越高的
要求。自1972 年美國加利福尼亞大學柏克萊分校電機工程和計算機科學系開發
的用于集成電路性能分析的電路模擬程序SPICE（Simulation Program with IC
Emphasis）誕生以來，為適應現代微電子工業的發展，各種用于集成電路設計的
電路模擬分析工具不斷涌現。HSPICE 是Meta-Software 公司為集成電路設計中
的穩態分析，瞬態分析和頻域分析等電路性能的模擬分析而開發的一個商業化通
用電路模擬程序，它在柏克萊的SPICE（1972 年推出），MicroSim公司的PSPICE
（1984 年推出）以及其它電路分析軟件的基礎上，又加入了一些新的功能，經
過不斷的改進，目前已被許多公司、大學和研究開發機構廣泛應用。HSPICE 可
與許多主要的EDA 設計工具，諸如Candence,Workview 等兼容，能提供許多重要
的針對集成電路性能的電路仿真和設計結果。采用HSPICE 軟件可以在直流到高
于100MHz 的微波頻率范圍內對電路作精確的仿真、分析和優化。在實際應用中，
HSPICE能提供關鍵性的電路模擬和設計方案，并且應用HSPICE進行電路模擬時，
其電路規模僅取決于用戶計算機的實際存儲器容量。
The HSPICE Integrator Program enables qualified EDA vendors to integrate their products with the de facto standard HSPICE simulator, HSPICE RF simulator, and WaveView Analyzer™. In addition, qualified HSPICE Integrator Program members have access to HSPICE integrator application programming interfaces (APIs). Collaboration between HSPICE Integrator Program members will enable customers to achieve more thorough design verification in a shorter period of time from the improvements offered by inter-company EDA design solutions.
This document provides practical, common guidelines for incorporating PCI Express interconnect
layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10-
layer or more server baseboard designs. Guidelines and constraints in this document are intended
for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI
Express devices located on the same baseboard (chip-to-chip routing) and interconnects between
a PCI Express device located “down” on the baseboard and a device located “up” on an add-in
card attached through a connector.
This document is intended to cover all major components of the physical interconnect including
design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card
edge-finger and connector considerations. The intent of the guidelines and examples is to help
ensure that good high-speed signal design practices are used and that the timing/jitter and
loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect.
However, while general physical guidelines and suggestions are given, they may not necessarily
guarantee adequate performance of the interconnect for all layouts and implementations.
Therefore, designers should consider modeling and simulation of the interconnect in order to
ensure compliance to all applicable specifications.
The document is composed of two main sections. The first section provides an overview of
general topology and interconnect guidelines. The second section concentrates on physical layout
constraints where bulleted items at the beginning of a topic highlight important constraints, while
the narrative that follows offers additional insight.
Abstract: How can an interface change a happy face to a sad face? Engineers have happy faces when an interface works properly.Sad faces indicate failure somewhere. Because interfaces between microprocessors and ICs are simple—even easy—they are oftenignored until interface failure causes sad faces all around. In this article, we discuss a common SPI error that can be almostimpossible to find in a large system. Links to interface tutorial information are provided for complete information. Noise as a systemissue and ICs to minimize its effects are also described.
A collection of interface applications between various microprocessors/ controllers and the LTC1090 family of data acquisition systems. The note is divided into sections specific to each interface.
利用EZ-USB接口芯片AN2131Q實現了基于TMS320C5409的水聲信號采集及混沌特性研究系統中的高速數據通信，提出了一種采用FIFO緩存芯片實現AN2131Q與TMS320C5409的連接方法，深入研究了EZ-USB序列接口芯片的固件、設備驅動和用戶程序開發過程。關鍵詞：AN2131Q; TMS320C5409; IDT72V02；數據通信ABSTRACT: Using AN2131Q as the control chip, the communication between DSP and PC in the underwater acoustic signal acquisition and chaotic characteristics study system is realized. The method is proposed that using FIFO to realize the connectivity between AN2131Q and TMS320C5409. The development of programming Firmware、device driver and user application are thoroughly researched.Key words: AN2131Q; TMS320C5409; IDT72V02; data communication
Tug of War(A tug of war is to be arranged at the local office picnic. For the tug of war, the picnickers must be divided into two teams. Each person must be on one team or the other the number of people on the two teams must not differ by more than 1 the total weight of the people on each team should be as nearly equal as possible. The first line of input contains n the number of people at the picnic. n lines follow. The first line gives the weight of person 1 the second the weight of person 2 and so on. Each weight is an integer between 1 and 450. There are at most 100 people at the picnic. Your output will be a single line containing 2 numbers: the total weight of the people on one team, and the total weight of the people on the other team. If these numbers differ, give the lesser first. )
