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Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
標(biāo)簽：
封裝
器件
用戶
賽靈思
上傳時(shí)間：
2013-10-22
上傳用戶：ztj182002
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The C8051F020/1/2/3 devices are fully integrated mixed-signal System-on-a-Chip MCUs with 64 digital I/O pins (C8051F020/2) or 32 digital I/O pins (C8051F021/3). Highlighted features are listed below; refer to Table 1.1 for specific product feature selection.
標(biāo)簽：
C8051F020
數(shù)據(jù)手冊(cè)
上傳時(shí)間：
2013-11-08
上傳用戶：lwq11
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With the Altera Nios II embedded processor, you as the system designercan accelerate time-critical software algorithms by adding custominstructions to the Nios II processor instruction set. Using custominstructions, you can reduce a complex sequence of standard instructionsto a single instruction implemented in hardware. You can use this featurefor a variety of applications, for example, to optimize software innerloops for digital signal processing (DSP), packet header processing, andcomputation-intensive applications. The Nios II configuration wizard,part of the Quartus® II software’s SOPC Builder, provides a graphicaluser interface (GUI) used to add up to 256 custom instructions to theNios II processor
標(biāo)簽：
NIOSII
用戶
定制
指令
上傳時(shí)間：
2013-11-07
上傳用戶：swing
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We offer a broad line of high performance low dropout (LDO) linear regulators with fasttransient response, excellent line and load regulation, and very wide input voltage rangefrom 0.9V to 100V. Output currents range from 20mA to 10A, with positive, negative andmultiple output versions available. Many devices offer output voltage operation <0.8V andsome feature operation as low as 0V, even with a single supply. Most are stable with ceramicoutput capacitors. LDO regulators can be applied in virtually any application.
標(biāo)簽：
LDO
線性
低壓差
穩(wěn)壓器
上傳時(shí)間：
2013-11-15
上傳用戶：努力努力再努力
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Abstract: This application note helps system designers choose the correct external components for use with the MAX16948 dualremote antenna LDO/switch, thus ensuring that automobile-regulated phantom antenna supply and output-current-monitoring circuitrymeet performance objectives. An electronic calculator is provided that helps specify the critical external components for theMAX16948, thus reducing design time. The calculator also determines the device's analog output voltage, output current-limitthreshold, and output current-sensing accuracies. The calculator includes new automatic Step By Step feature that assists designerswith component choice. To use the new automatic feature, click on the Step By Step button relative to the desired section.
標(biāo)簽：
16948
MAX
LDO
遙控天線
上傳時(shí)間：
2013-11-04
上傳用戶：lhll918
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本軟件是關(guān)于MAX338, MAX339的英文數(shù)據(jù)手冊(cè)：MAX338, MAX339 8通道/雙4通道、低泄漏、CMOS模擬多路復(fù)用器
The MAX338/MAX339 are monolithic, CMOS analog multiplexers (muxes). The 8-channel MAX338 is designed to connect one of eight inputs to a common output by control of a 3-bit binary address. The dual, 4-channel MAX339 is designed to connect one of four inputs to a common output by control of a 2-bit binary address. Both devices can be used as either a mux or a demux. On-resistance is 400Ω max, and the devices conduct current equally well in both directions.
These muxes feature extremely low off leakages (less than 20pA at +25°C), and extremely low on-channel leakages (less than 50pA at +25°C). The new design offers guaranteed low charge injection (1.5pC typ) and electrostatic discharge (ESD) protection greater than 2000V, per method 3015.7. These improved muxes are pin-compatible upgrades for the industry-standard DG508A and DG509A. For similar Maxim devices with lower leakage and charge injection but higher on-resistance, see the MAX328 and MAX329.
標(biāo)簽：
MAX
338
339
英文
上傳時(shí)間：
2013-11-12
上傳用戶：18711024007
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Nios II定制指令用戶指南：With the Altera Nios II embedded processor, you as the system designer can accelerate time-critical software algorithms by adding custom instructions to the Nios II processor instruction set. Using custom
instructions, you can reduce a complex sequence of standard instructions to a single instruction implemented in hardware. You can use this feature for a variety of applications, for example, to optimize software inner
loops for digital signal processing (DSP), packet header processing, and computation-intensive applications. The Nios II configuration wizard,part of the Quartus® II software’s SOPC Builder, provides a graphical user interface (GUI) used to add up to 256 custom instructions to the Nios II processor.
The custom instruction logic connects directly to the Nios II arithmetic logic unit (ALU) as shown in Figure 1–1.
標(biāo)簽：
Nios
定制
指令
用戶
上傳時(shí)間：
2013-10-12
上傳用戶：kang1923
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Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
標(biāo)簽：
封裝
器件
用戶
賽靈思
上傳時(shí)間：
2013-11-21
上傳用戶：不懂夜的黑
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Most designers wish to utilize as much of a device as possible in order to enhance the overallproduct performance, or extend a feature set. As a design grows, inevitably it will exceed thearchitectural limitations of the device. Exactly why a design does not fit can sometimes bedifficult to determine. Programmable logic devices can be configured in almost an infinitenumber of ways. The same design may fit when you use certain implementation switches, andfail to fit when using other switches. This application note attempts to clarify the CPLD softwareimplementation (CPLDFit) options, as well as discuss implementation tips in CoolRunnerTM-IIdesigns in order to maximize CPLD utilization.
標(biāo)簽：
XAPP
CPLD
444
配件
上傳時(shí)間：
2014-01-11
上傳用戶：a471778
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這個(gè)軟件需要你的本機(jī)操作的。其他機(jī)器是算不出來(lái)的！
就是說(shuō) 一臺(tái)電腦只有一個(gè)注冊(cè)碼對(duì)應(yīng)！
這里有個(gè)辦法：
MULTISIM2001安裝方法：
一：運(yùn)行SETUP.EXE安裝。在安裝時(shí)，要重新啟動(dòng)計(jì)算機(jī)一次。
二：?jiǎn)?dòng)后在“開始>程序”中找到STARTUP項(xiàng)，運(yùn)行后，繼續(xù)進(jìn)行安裝，安裝過(guò)程中，第一次要求輸入“CODE"碼時(shí)，
輸入“PP-0411-48015-7464-32084"輸入后，會(huì)提示"VALID SERIAL NUMBER FOR MULTISIM 2001 POWER-PRO."
按確定，又會(huì)出現(xiàn)一個(gè)“feature code”框，輸入“FC-6424-04180-0044-13881”后，
在彈出的對(duì)話框中選擇“取消”，一路確定即可完成安裝。
三：1.運(yùn)行VERILOG目錄內(nèi)的SETUP安裝
2.運(yùn)行FPGA目錄內(nèi)的SETUP安裝
3.將CRACK目錄內(nèi)的LICMGR.DLL拷貝到WINDOWS系統(tǒng)的SYSTEM 目錄內(nèi)
4.并將VERILOG安裝目錄內(nèi)的同名文件刪除
5.將SILOS.LIC文件拷到VERILOG安裝目錄內(nèi)覆蓋原文件，并作如下編輯：
6.將“COMPUTER_NAME”替換為你的機(jī)器名
7.將“D:\MULTISIM\VERILOG\PATH_TO_SIMUCAD.EXE”替換為你的
實(shí)際安裝路徑。如此你便可以使用VERILOG了。
四：安裝之后，運(yùn)行MULTISIM2001,會(huì)要求輸入“RELEASE CODE",不用著急，
記下“SERIAL NUMBER"和“SIGNATURE NUMBER",
使用CRACK目錄內(nèi)的注冊(cè)器“MULTISIM KEYGEN.EXE"
將剛才記下的兩個(gè)號(hào)碼分別填入后，
即可得到"RELEASE CODE", 以后就可以正常使用了。
五：接下來(lái)運(yùn)行 database update目錄中的幾個(gè)文件，
進(jìn)行數(shù)據(jù)庫(kù)合并即可。祝你成功！！
六：?jiǎn)?dòng)MULTISIM2001時(shí)候的注冊(cè)碼
1：
PP-0411-48015-7464-32084
2：
37506-86380
3:的三個(gè)空格
1975 2711 4842
里面包含了：Multisim2001漢化破解版、Multisim.V10.0.1.漢化破解版圖解
解壓密碼：www.pp51.com
標(biāo)簽：
Multisim
2001
漢化破解版
免費(fèi)下載
上傳時(shí)間：
2013-11-16
上傳用戶：天空說(shuō)我在
