討論、研究高性能覆銅板對它所用的環(huán)氧樹脂的性能要求，應(yīng)是立足整個產(chǎn)業(yè)鏈的角度去觀察、分析。特別應(yīng)從HDI多層板發(fā)展對高性能CCL有哪些主要性能需求上著手研究。HDI多層板有哪些發(fā)展特點，它的發(fā)展趨勢如何——這都是我們所要研究的高性能CCL發(fā)展趨勢和重點的基本依據(jù)。而HDI多層板的技術(shù)發(fā)展，又是由它的應(yīng)用市場——終端電子產(chǎn)品的發(fā)展所驅(qū)動（見圖1）。 圖1 在HDI多層板產(chǎn)業(yè)鏈中各類產(chǎn)品對下游產(chǎn)品的性能需求關(guān)系圖 1．HDI多層板發(fā)展特點對高性能覆銅板技術(shù)進步的影響1.1 HDI多層板的問世，對傳統(tǒng)PCB技術(shù)及其基板材料技術(shù)是一個嚴峻挑戰(zhàn)20世紀90年代初，出現(xiàn)新一代高密度互連（High Density Interconnection，簡稱為 HDI）印制電路板——積層法多層板（Build—Up Multiplayer printed board，簡稱為 BUM）的最早開發(fā)成果。它的問世是全世界幾十年的印制電路板技術(shù)發(fā)展歷程中的重大事件。積層法多層板即HDI多層板，至今仍是發(fā)展HDI的PCB的最好、最普遍的產(chǎn)品形式。在HDI多層板之上，將最新PCB尖端技術(shù)體現(xiàn)得淋漓盡致。HDI多層板產(chǎn)品結(jié)構(gòu)具有三大突出的特征：“微孔、細線、薄層化”。其中“微孔”是它的結(jié)構(gòu)特點中核心與靈魂。因此，現(xiàn)又將這類HDI多層板稱作為“微孔板”。HDI多層板已經(jīng)歷了十幾年的發(fā)展歷程，但它在技術(shù)上仍充滿著朝氣蓬勃的活力，在市場上仍有著前程廣闊的空間。
標簽： 性能 發(fā)展趨勢 覆銅板 環(huán)氧樹脂
上傳時間： 2013-11-19
上傳用戶：zczc
The LogiCORE™ GTP Wizard automates the task of creating HDL wrappers to configure the high-speed serial GTP transceivers in Virtex™-5 LXT and SXT devices. The menu-driven interface allows one or more GTP transceivers to be configured using pre-definedtemplates for popular industry standards, or from scratch, to support a wide variety of custom protocols.The Wizard produces a wrapper, an example design, and a testbench for rapid integration and verification of the serial interface with your custom function Features• Creates customized HDL wrappers to configureVirtex-5 RocketIO™ GTP transceivers• Users can configure Virtex-5 GTP transceivers toconform to industry standard protocols usingpredefined templates, or tailor the templates forcustom protocols• Included protocol templates provide support for thefollowing specifications: Aurora, CPRI, FibreChannel 1x, Gigabit Ethernet, HD-SDI, OBSAI,OC3, OC12, OC48, PCI Express® (PCIe®), SATA,SATA II, and XAUI• Automatically configures analog settings• Each custom wrapper includes example design, testbench; and both implementation and simulation scripts
標簽： Transceiver Virtex Wizar GTP
上傳時間： 2013-10-20
上傳用戶：dave520l
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
標簽： pci PCB 設(shè)計規(guī)范
上傳時間： 2014-01-24
上傳用戶：s363994250
Q01、如何使一條走線至兩個不同位置零件的距離相同? 您可先在Design/Rule/High Speed/Matched Net Lengths的規(guī)則中來新增規(guī)則設(shè)定,最 后再用Tools/EqualizeNet Lengths 來等長化即可。 Q02、在SCHLIB中造一零件其PIN的屬性，如何決定是Passive, Input, I/O, Hi- Z,Power,…..？在HELP中能找到說明嗎？市面有關(guān) SIM？PLD？的書嗎？或貴公司有講義？ 你可在零件庫自制零件時點選零件Pin腳,并在Electrical Type里,可以自行設(shè)定PIN的 屬性,您可參考臺科大的Protel sch 99se 里 面有介紹關(guān)于SIM的內(nèi)容。 Q03、請問各位業(yè)界前輩,如何能順利讀取pcad8.6版的線路圖,煩請告知 Protel 99SE只能讀取P-CAD 2000的ASCII檔案格式,所以你必須先將P-CAD8.6版的格式 轉(zhuǎn)為P-CAD 2000的檔案格式,才能讓Protel讀取。
標簽： Protel
上傳時間： 2013-11-07
上傳用戶：tangsiyun
The power of programmability gives industrial automation designers a highly efficient， cost-effective alternative to traditional motor control units （MCUs）。 The parallel-processing power， fast computational speeds， and connectivity versatility of Xilinx® FPGAs can accelerate the implementation of advanced motor control algorithms such as Field Oriented Control （FOC）。 Additionally， Xilinx devices lower costs with greater on-chip integration of system components and shorten latencies with high-performance digital signal processing （DSP） that can tackle compute-intensive functions such as PID Controller， Clark/Park transforms， and Space Vector PWM. The Xilinx Spartan®-6 FPGA Motor Control Development Kit gives designers an ideal starting point for evaluating time-saving， proven， motor-control reference designs. The kit also shortens the process of developing custom control capabilities， with integrated peripheral functions （Ethernet， PowerLink， and PCI® Express）， a motor-control FPGA mezzanine card （FMC） with built-in Texas Instruments motor drivers and high-precision Delta-Sigma modulators， and prototyping support for evaluating alternative front-end circuitry.
上傳時間： 2013-10-28
上傳用戶：wujijunshi
The revolution of automation on factory floors is a key driver for the seemingly insatiable demand for higher productivity， lower total cost of ownership，and high safety. As a result， industrial applications drive an insatiable demand of higher data bandwidth and higher system-level performance. This white paper describes the trends and challenges seen by designers and how FPGAs enable solutions to meet their stringent design goals.
標簽： xilinx FPGAs 工業(yè) 中的應(yīng)用
上傳時間： 2013-11-08
上傳用戶：yan2267246
主機高壓油泵說明書。
上傳時間： 2013-10-28
上傳用戶：sardinescn
自回歸功率譜密度（AR-PSD）方法的基礎(chǔ)是生物組織的離散散射體模型〔超聲體模〕理論，該模型認為生物組織為半規(guī)則的散射體分布的，這種方法是基于溫度和頻移的相關(guān)特性。本文介紹超聲回波信號對HIFU（High Intensity Focused Ultrasound）治療的測溫技術(shù)，從測溫模型和算法，實驗儀器的設(shè)計和構(gòu)建，仿真和離體實驗中獲取了一套有效的測溫方法，利用Matlab7.1和VC++6.0作為工具對超聲回波信號進行計算機仿真，并從實驗獲得的超聲回波信號中分析出具體的溫度變化，驗證了算法的可行性。
上傳時間： 2013-11-13
上傳用戶：eastimage
微電腦型RS-485顯示電表（24*48mm/48*96mm） 特點： 5位數(shù)RS-485顯示電表 顯示范圍-19999-99999位數(shù) 通訊協(xié)議Modbus RTU模式 寬范圍交直流兩用電源設(shè)計 尺寸小,穩(wěn)定性高 主要規(guī)格： 顯示范圍:-19999~99999 digit RS-485傳輸速度: 19200/9600/4800/2400 selective RS-485通訊位址: "01"-"FF" RS-485通訊協(xié)議: Modbus RTU mode 顯示幕: Red high efficiency LEDs high 10.16 mm (0.4") (MMX-RS-11X) Red high efficiency LEDs high 20.32 mm (0.8") (MMX-RS-12X) Red high efficiency LEDs high 10.16 mm (0.4")x2 (MMX-RS-22X) 參數(shù)設(shè)定方式: Touch switches 記憶方式: Non-volatile E²PROM memory 絕緣耐壓能力: 2KVac/1 min. (input/power) 使用環(huán)境條件: 0-50℃(20 to 90% RH non-condensed) 存放環(huán)境條件: 0-70℃(20 to 90% RH non-condensed) CE認證: EN 55022:1998/A1:2000 Class A EN 61000-3-2:2000 EN 61000-3-3:1995/A1:2001 EN 55024:1998/A1:2001
上傳時間： 2015-01-03
上傳用戶：feitian920
微電腦型單相交流集合式電表（單相二線系統(tǒng)） 特點： 精確度0.25%滿刻度±1位數(shù) 可同時量測與顯示交流電壓,電流,頻率,瓦特,(功率因數(shù)/視在功率) 交流電壓,電流,瓦特皆為真正有效值(TRMS) 交流電流,瓦特之小數(shù)點可任意設(shè)定 瓦特單位W或KW可任意設(shè)定 CT比可任意設(shè)定(1至999) 輸入與輸出絕緣耐壓 2仟伏特/1分鐘( 突波測試強度4仟伏特(1.2x50us) 數(shù)位RS-485界面 (Optional) 主要規(guī)格： 精確度: 0.1% F.S.±1 digit (Frequency) 0.25% F.S.±1 digit(ACA,ACV,Watt,VA) 0.25% F.S. ±0.25o(Power Factor) (-.300~+.300) 輸入負載: <0.2VA (Voltage) <0.2VA (Current) 最大過載能力: Current related input: 3 x rated continuous 10 x rated 30 sec. 25 x rated 3sec. 50 x rated 1sec. Voltage related input: maximum 2 x rated continuous 過載顯示: "doFL" 顯示值范圍: 0~600.0V(Voltage) 0~999.9Hz(Frequency)(<20% for voltage input) 0~19999 digit adjustable(Current,Watt,VA) 取樣時間: 2 cycles/sec. RS-485通訊位址: "01"-"FF" RS-485傳輸速度: 19200/9600/4800/2400 selective RS-485通信協(xié)議: Modbus RTU mode 溫度系數(shù): 100ppm/℃ (0-50℃) 顯示幕: Red high efficiency LEDs high 10.16 mm(0.4") 參數(shù)設(shè)定方式: Touch switches 記憶型式: Non-volatile E²PROM memory 絕緣抗阻: >100Mohm with 500V DC 絕緣耐壓能力: 2KVac/1 min. (input/output/power) 1600 Vdc (input/output) 突波測試: ANSI c37.90a/1974,DIN-IEC 255-4 impulse voltage 4KV(1.2x50us) 使用環(huán)境條件: 0-50℃(20 to 90% RH non-condensed) 存放環(huán)境條件: 0-70℃(20 to 90% RH non-condensed) CE認證: EN 55022:1998/A1:2000 Class A EN 61000-3-2:2000 EN 61000-3-3:1995/A1:2001 EN 55024:1998/A1:2001
上傳時間： 2015-01-03
上傳用戶：幾何公差
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