超聲波傳感器適用于對大幅的平面進(jìn)行靜止測距。普通的超聲波傳感器測距范圍大概是 2cm~450cm，分辨率3mm（淘寶賣家說的，筆者測試環(huán)境沒那么好，個(gè)人實(shí)測比較穩(wěn)定的 距離10cm~2m 左右，超過此距離就經(jīng)常有偶然不準(zhǔn)確的情況發(fā)生了，當(dāng)然不排除筆者技術(shù) 問題。） 測試對象是淘寶上面最便宜的SRF-04 超聲波傳感器，有四個(gè)腳：5v 電源腳（Vcc），觸發(fā)控制端（Trig），接收端（Echo），地端（GND） 附:SRF 系列超聲波傳感器參數(shù)比較 模塊工作原理： 采用IO 觸發(fā)測距，給至少10us 的高電平信號； 模塊自動(dòng)發(fā)送8個(gè)40KHz 的方波，自動(dòng)檢測是否有信號返回； 有信號返回，通過IO 輸出一高電平，高電平持續(xù)的時(shí)間就是超聲波從發(fā)射到返回的時(shí)間．測試距離=(高電平時(shí)間*聲速(340m/s))/2; 電路連接方法 Arduino 程序例子： constintTrigPin = 2; constintEchoPin = 3; floatcm; voidsetup() { Serial.begin(9600); pinMode(TrigPin, OUTPUT); pinMode(EchoPin, INPUT); } voidloop() { digitalWrite(TrigPin, LOW); //低高低電平發(fā)一個(gè)短時(shí)間脈沖去TrigPin delayMicroseconds(2); digitalWrite(TrigPin, HIGH); delayMicroseconds(10); digitalWrite(TrigPin, LOW); cm = pulseIn(EchoPin, HIGH) / 58.0; //將回波時(shí)間換算成cm cm = (int(cm * 100.0)) / 100.0; //保留兩位小數(shù) Serial.print(cm); Serial.print("cm"); Serial.println(); delay(1000); }
上傳時(shí)間： 2013-10-18
上傳用戶：星仔
中文版詳情瀏覽：http://www.elecfans.com/emb/fpga/20130715324029.html Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications. The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation. Some of the UltraScale architecture breakthroughs include: • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50% • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets • Greatly enhanced DSP and packet handling The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
標(biāo)簽： UltraScale Xilinx 架構(gòu)
上傳時(shí)間： 2013-11-21
上傳用戶：wxqman
介紹高速電路的設(shè)計(jì)
標(biāo)簽： High-speed Digital Design 高速數(shù)字
上傳時(shí)間： 2013-12-02
上傳用戶：wentianyou
Abstract: Designers who must interface 1-Wire temperature sensors with Xilinx field-programmable gate arrays(FPGAs) can use this reference design to drive a DS28EA00 1-Wire slave device. The downloadable softwarementioned in this document can also be used as a starting point to connect other 1-Wire slave devices. The systemimplements a 1-Wire master connected to a UART and outputs temperature to a PC from the DS28EA00 temperaturesensor. In addition, high/low alarm outputs are displayed from the DS28EA00 PIO pins using LEDs.
標(biāo)簽： PicoBlaze Create Master Xilinx
上傳時(shí)間： 2013-11-12
上傳用戶：大三三
HDB3(High Density Bipolar三階高密度雙極性)碼是在AMI碼的基礎(chǔ)上改進(jìn)的一種雙極性歸零碼，它除具有AMI碼功率譜中無直流分量，可進(jìn)行差錯(cuò)自檢等優(yōu)點(diǎn)外，還克服了AMI碼當(dāng)信息中出現(xiàn)連“0”碼時(shí)定時(shí)提取困難的缺點(diǎn)，而且HDB3碼頻譜能量主要集中在基波頻率以下，占用頻帶較窄，是ITU-TG.703推薦的PCM基群、二次群和三次群的數(shù)字傳輸接口碼型,因此HDB3碼的編解碼就顯得極為重要了[1]。目前，HDB3碼主要由專用集成電路及相應(yīng)匹配的外圍中小規(guī)模集成芯片來實(shí)現(xiàn)，但集成程度不高，特別是位同步提取非常復(fù)雜，不易實(shí)現(xiàn)。隨著可編程器件的發(fā)展，這一難題得到了很好地解決。
上傳時(shí)間： 2013-11-01
上傳用戶：lindor
protel 99se 使用技巧以及常見問題解決方法：里面有一些protel 99se 特別技巧，還有我們經(jīng)常遇到的一些問題！如何使一條走線至兩個(gè)不同位置零件的距離相同? 您可先在Design/Rule/High Speed/Matched Net Lengths的規(guī)則中來新增規(guī)則設(shè)定,最后再用Tools/EqualizeNet Lengths 來等長化即可。 Q02、在SCHLIB中造一零件其PIN的屬性，如何決定是Passive, Input, I/O, Hi- Z,Power,…..？在HELP中能找到說明嗎？市面有關(guān) SIM？PLD？的書嗎？或貴公司有講義？ 你可在零件庫自制零件時(shí)點(diǎn)選零件Pin腳,并在Electrical Type里,可以自行設(shè)定PIN的 屬性,您可參考臺科大的Protel sch 99se 里面有介紹關(guān)于SIM的內(nèi)容。 Q03、請問各位業(yè)界前輩,如何能順利讀取pcad8.6版的線路圖,煩請告知 Protel 99SE只能讀取P-CAD 2000的ASCII檔案格式,所以你必須先將P-CAD8.6版的格式轉(zhuǎn)為P-CAD 2000的檔案格式,才能讓Protel讀取。 Q04、請問我該如何標(biāo)示線徑大小的那個(gè)平方呢 你可以將格點(diǎn)大小設(shè)小,還有將字形大小縮小,再放置數(shù)字的平方位置即可。 Q05、請問我一次如何更改所有組件的字型 您可以點(diǎn)選其中一個(gè)組件字型,再用Global的方法就可以達(dá)成你的要求。
上傳時(shí)間： 2015-01-01
上傳用戶：yxgi5
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時(shí)間： 2013-11-21
上傳用戶：不懂夜的黑
This application note describes how to implement the Bus LVDS (BLVDS) interface in the supported Altera ® device families for high-performance multipoint applications. This application note also shows the performance analysis of a multipoint application with the Cyclone III BLVDS example.
標(biāo)簽： Implementing LVDS 522 Bus
上傳時(shí)間： 2013-10-26
上傳用戶：蘇蘇蘇蘇
Designing withProgrammable Logicin an Analog WorldProgrammable logic devices revolutionizeddigital design over 25 years ago,promising designers a blank chip todesign literally any function and programit in the field. PLDs can be low-logicdensity devices that use nonvolatilesea-of-gates cells called complexprogrammable logic devices (CPLDs)or they can be high-density devicesbased on SRAM look-up tables (LUTs)
標(biāo)簽： Solutions Analog Altera FPGAs
上傳時(shí)間： 2013-10-27
上傳用戶：fredguo
Designing withProgrammable Logicin an Analog WorldProgrammable logic devicesrevolutionized digital design over 25years ago, promising designers a blankchip to design literally any functionand program it in the field. PLDs canbe low-logic density devices that usenonvolatile sea-of-gates cells calledcomplex programmable logic devices(CPLDs) or they can be high-densitydevices based on SRAM look-up tables
標(biāo)簽： Solutions Analog Xilinx FPGAs
上傳時(shí)間： 2013-11-07
上傳用戶：suicone
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