本軟件是關(guān)于MAX338, MAX339的英文數(shù)據(jù)手冊(cè)：MAX338, MAX339 8通道/雙4通道、低泄漏、CMOS模擬多路復(fù)用器 The MAX338/MAX339 are monolithic, CMOS analog multiplexers (muxes). The 8-channel MAX338 is designed to connect one of eight inputs to a common output by control of a 3-bit binary address. The dual, 4-channel MAX339 is designed to connect one of four inputs to a common output by control of a 2-bit binary address. Both devices can be used as either a mux or a demux. On-resistance is 400Ω max, and the devices conduct current equally well in both directions. These muxes feature extremely low off leakages (less than 20pA at +25°C), and extremely low on-channel leakages (less than 50pA at +25°C). The new design offers guaranteed low charge injection (1.5pC typ) and electrostatic discharge (ESD) protection greater than 2000V, per method 3015.7. These improved muxes are pin-compatible upgrades for the industry-standard DG508A and DG509A. For similar Maxim devices with lower leakage and charge injection but higher on-resistance, see the MAX328 and MAX329.
上傳時(shí)間： 2013-11-12
上傳用戶：18711024007
It would not be an exaggeration to say that semiconductor devices have transformed humanlife. From computers to communications to internet and video games these devices and the technologies they have enabled have expanded human experience in a way that is unique in history. Semiconductor devices have exploited materials, physics and imaginative applications to spawn new lifestyles. Of course for the device engineer, in spite of the advances, the challenges of reaching higher frequency, lower power consumption, higher power generation etc.
標(biāo)簽： 半導(dǎo)體器件 物理
上傳時(shí)間： 2013-10-28
上傳用戶：songnanhua
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時(shí)間： 2013-11-21
上傳用戶：不懂夜的黑
Most designers wish to utilize as much of a device as possible in order to enhance the overallproduct performance, or extend a feature set. As a design grows, inevitably it will exceed thearchitectural limitations of the device. Exactly why a design does not fit can sometimes bedifficult to determine. Programmable logic devices can be configured in almost an infinitenumber of ways. The same design may fit when you use certain implementation switches, andfail to fit when using other switches. This application note attempts to clarify the CPLD softwareimplementation (CPLDFit) options, as well as discuss implementation tips in CoolRunnerTM-IIdesigns in order to maximize CPLD utilization.
上傳時(shí)間： 2014-01-11
上傳用戶：a471778
Design techniques for electronic systems areconstantly changing. In industries at the heart of thedigital revolution, this change is especially acute.Functional integration, dramatic increases incomplexity, new standards and protocols, costconstraints, and increased time-to-market pressureshave bolstered both the design challenges and theopportunities to develop modern electronic systems.One trend driving these changes is the increasedintegration of core logic with previously discretefunctions to achieve higher performance and morecompact board designs.
標(biāo)簽： System Xilinx FPGA 151
上傳時(shí)間： 2013-11-23
上傳用戶：kangqiaoyibie
This application note provides a functional description of VHDL source code for a N x N DigitalCrosspoint Switch. The code is designed with eight inputs and eight outputs in order to targetthe 128-macrocell CoolRunner™-II CPLD device but can be easily expanded to target higherdensity devices. To obtain the VHDL source code described in this document, go to sectionVHDL Code, page 5 for instructions.
標(biāo)簽： CoolRunner-II XAPP CPLD 380
上傳時(shí)間： 2013-10-26
上傳用戶：kiklkook
This application note describes the implementation of a two-dimensional Rank Order filter. Thereference design includes the RTL VHDL implementation of an efficient sorting algorithm. Thedesign is parameterizable for input/output precision, color standards, filter kernel size,maximum horizontal resolution, and implementation options. The rank to be selected can bemodified dynamically, and the actual horizontal resolution is picked up automatically from theinput synchronization signals. The design has a fully synchronous interface through the ce, clk,and rst ports.
上傳時(shí)間： 2013-12-14
上傳用戶：逗逗666
Xilinx Next Generation 28 nm FPGA Technology Overview Xilinx has chosen 28 nm high-κ metal gate (HKMG) highperformance,low-power process technology and combined it with a new unified ASMBL™ architecture to create a new generation of FPGAs that offer lower power and higher performance. These devices enable unprecedented levels of integration and bandwidth and provide system architects and designers a fully programmable alternative to ASSPs and ASICs.
上傳時(shí)間： 2013-12-07
上傳用戶：bruce
為了在CDMA系統(tǒng)中更好地應(yīng)用QDPSK數(shù)字調(diào)制方式，在分析四相相對(duì)移相（QDPSK)信號(hào)調(diào)制解調(diào)原理的基礎(chǔ)上，設(shè)計(jì)了一種QDPSK調(diào)制解調(diào)電路，它包括串并轉(zhuǎn)換、差分編碼、四相載波產(chǎn)生和選相、相干解調(diào)、差分譯碼和并串轉(zhuǎn)換電路。在MAX+PLUSⅡ軟件平臺(tái)上，進(jìn)行了編譯和波形仿真。綜合后下載到復(fù)雜可編程邏輯器件EPM7128SLC84-15中，測(cè)試結(jié)果表明，調(diào)制電路能正確選相，解調(diào)電路輸出數(shù)據(jù)與QDPSK調(diào)制輸入數(shù)據(jù)完全一致，達(dá)到了預(yù)期的設(shè)計(jì)要求。 Abstract: In order to realize the better application of digital modulation mode QDPSK in the CDMA system， a sort of QDPSK modulation-demodulation circuit was designed based on the analysis of QDPSK signal modulation-demodulation principles. It included serial/parallel conversion circuit, differential encoding circuit, four-phase carrier wave produced and phase chosen circuit, coherent demodulation circuit, difference decoding circuit and parallel/serial conversion circuit. And it was compiled and simulated on the MAX+PLUSⅡ software platform,and downloaded into the CPLD of EPM7128SLC84-15.The test result shows that the modulation circuit can exactly choose the phase，and the output data of the demodulator circuit is the same as the input data of the QDPSK modulate. The circuit achieves the prospective requirement of the design.
標(biāo)簽： QDPSK CPLD 調(diào)制解調(diào) 電路設(shè)計(jì)
上傳時(shí)間： 2013-10-28
上傳用戶：jyycc
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
標(biāo)簽： pci PCB 設(shè)計(jì)規(guī)范
上傳時(shí)間： 2014-01-24
上傳用戶：s363994250
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