在綜合分析諧波勵磁無刷同步發電機勵磁控制系統的基礎上,對其勵磁控制策略進行了研究,開發了一套基于DSP( TMS320F2812) 控制的新型柴油發電機勵磁控制系統,該系統采用參數自適應模糊PID 控制勵磁,選用交流采樣方式實時檢測各信號的瞬時特性,系統仿真結果以及在1 臺25 kW 工頻柴油發電機上的試驗結果證明了該控制器具有較好的電壓調節特性,系統穩態和暫態性能完全滿足發電機對勵磁系統的要求。關鍵詞:勵磁調節;模糊PID 控制;數字信號處理器;交流采樣
Abstract :According to the general analysis of the excitation cont rol system of the harmonious wave excitation brushless synchronous generator and it s characteristics ,a new type of diesel generator excitation cont rol system based on DSP( TMS320F2812) was designed. An adaptive fuzzy PID cont rol of excitation is used in this system. To detect the t ransient characteristics of the signals in a timely manner ,AC sampling was applied.The system simulation result s and the testing result s f rom a 25 kW diesel generator (50 Hz) can prove that the voltage regulation characteristics of the excitation cont rol system are very well ,and both the steadyOstate performance and the t ransient performance of the generator are also good.Key words :excitation cont rol ;fuzzy PID cont rol ;digital signal processor (DSP) ;AC sampling
設計一種應用于某全地形ATV車載武器裝置中的中控系統，該系統設計是以TMS320F2812型DSP為核心，采用模塊化設計思想，對其硬件部分進行系統設計，能夠完成對武器裝置高低、回轉方向的運動控制，實現靜止或行進狀態中對目標物的測距，自動瞄準以及按既定發射模式發射彈丸和各項安全性能檢測等功能。通過編制相應的軟件，對其進行系統調試，驗證了該設計運行穩定。
Abstract:
A central control system applied to an ATV vehicle weapons is designed. The system design is based on TMS320F2812 DSP as the core， uses modular design for its hardware parts. The central control system can complete the motion control of the level of weapons and equipment， rotation direction， to achieve a state of static or moving objects on the target ranging， auto-targeting and according to the established target and the projectile and the launch of the security performance testing and other functions. Through the development of appropriate software and to carry out system testing to verify the stability of this design and operation.
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Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture
The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications.
The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation.
Some of the UltraScale architecture breakthroughs include:
• Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50%
• Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability
• Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization
• 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard
• Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets
• Greatly enhanced DSP and packet handling
The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
This application note describes how to implement the Bus LVDS (BLVDS) interface in the supported Altera ® device families for high-performance multipoint applications. This application note also shows the performance analysis of a multipoint application with the Cyclone III BLVDS example.
Design techniques for electronic systems areconstantly changing. In industries at the heart of thedigital revolution, this change is especially acute.Functional integration, dramatic increases incomplexity, new standards and protocols, costconstraints, and increased time-to-market pressureshave bolstered both the design challenges and theopportunities to develop modern electronic systems.One trend driving these changes is the increasedintegration of core logic with previously discretefunctions to achieve higher performance and morecompact board designs.
Xilinx Next Generation 28 nm FPGA Technology Overview
Xilinx has chosen 28 nm high-κ metal gate (HKMG) highperformance,low-power process technology and combined it with a new unified ASMBL™ architecture to create a new generation of FPGAs that offer lower power and higher performance. These devices enable unprecedented levels of integration and bandwidth and provide system architects and designers a fully programmable alternative to ASSPs and ASICs.
WP369可擴展式處理平臺-各種嵌入式系統的理想解決方案 ：Delivering unrivaled levels of system performance,flexibility, scalability, and integration to developers,Xilinx's architecture for a new Extensible Processing Platform is optimized for system power, cost, and size. Based on ARM's dual-core Cortex™-A9 MPCore processors and Xilinx’s 28 nm programmable logic,the Extensible Processing Platform takes a processor-centric approach by defining a comprehensive processor system implemented with standard design methods. This approach provides Software Developers a familiar programming environment within an optimized, full featured,powerful, yet low-cost, low-power processing platform.
This application note covers the design considerations of a system using the performance
features of the LogiCORE™ IP Advanced eXtensible Interface (AXI) Interconnect core. The
design focuses on high system throughput through the AXI Interconnect core with F
MAX
and
area optimizations in certain portions of the design.
The design uses five AXI video direct memory access (VDMA) engines to simultaneously move
10 streams (five transmit video streams and five receive video streams), each in 1920 x 1080p
format, 60 Hz refresh rate, and up to 32 data bits per pixel. Each VDMA is driven from a video
test pattern generator (TPG) with a video timing controller (VTC) block to set up the necessary
video timing signals. Data read by each AXI VDMA is sent to a common on-screen display
(OSD) core capable of multiplexing or overlaying multiple video streams to a single output video
stream. The output of the OSD core drives the DVI video display interface on the board.
Performance monitor blocks are added to capture performance data. All 10 video streams
moved by the AXI VDMA blocks are buffered through a shared DDR3 SDRAM memory and are
controlled by a MicroBlaze™ processor.
The reference system is targeted for the Virtex-6 XC6VLX240TFF1156-1 FPGA on the
Xilinx® ML605 Rev D evaluation board
XAPP520將符合2.5V和3.3V I/O標準的7系列FPGA高性能I/O Bank進行連接
The I/Os in Xilinx® 7 series FPGAs are classified as either high range (HR) or high performance (HP) banks. HR I/O banks can be operated from 1.2V to 3.3V, whereas HP I/O banks are optimized for operation between 1.2V and 1.8V. In circumstances that require an HP 1.8V I/O bank to interface with 2.5V or 3.3V logic, a range of options can be deployed. This application note describes methodologies for interfacing 7 series HP I/O banks with 2.5V and 3.3V systems
