Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
This application note describes how to implement the Bus LVDS (BLVDS) interface in the supported Altera ® device families for high-performance multipoint applications. This application note also shows the performance analysis of a multipoint application with the Cyclone III BLVDS example.
Most designers wish to utilize as much of a device as possible in order to enhance the overallproduct performance, or extend a feature set. As a design grows, inevitably it will exceed thearchitectural limitations of the device. Exactly why a design does not fit can sometimes bedifficult to determine. Programmable logic devices can be configured in almost an infinitenumber of ways. The same design may fit when you use certain implementation switches, andfail to fit when using other switches. This application note attempts to clarify the CPLD softwareimplementation (CPLDFit) options, as well as discuss implementation tips in CoolRunnerTM-IIdesigns in order to maximize CPLD utilization.
Design techniques for electronic systems areconstantly changing. In industries at the heart of thedigital revolution, this change is especially acute.Functional integration, dramatic increases incomplexity, new standards and protocols, costconstraints, and increased time-to-market pressureshave bolstered both the design challenges and theopportunities to develop modern electronic systems.One trend driving these changes is the increasedintegration of core logic with previously discretefunctions to achieve higher performance and morecompact board designs.
This introduction covers the fundamentals of VHDL as applied to Complex ProgrammableLogic Devices (CPLDs). Specifically included are those design practices that translate soundlyto CPLDs, permitting designers to use the best features of this powerful language to extractoptimum performance for CPLD designs.
This application note covers the design considerations of a system using the performance
features of the LogiCORE™ IP Advanced eXtensible Interface (AXI) Interconnect core. The
design focuses on high system throughput through the AXI Interconnect core with F
MAX
and
area optimizations in certain portions of the design.
The design uses five AXI video direct memory access (VDMA) engines to simultaneously move
10 streams (five transmit video streams and five receive video streams), each in 1920 x 1080p
format, 60 Hz refresh rate, and up to 32 data bits per pixel. Each VDMA is driven from a video
test pattern generator (TPG) with a video timing controller (VTC) block to set up the necessary
video timing signals. Data read by each AXI VDMA is sent to a common on-screen display
(OSD) core capable of multiplexing or overlaying multiple video streams to a single output video
stream. The output of the OSD core drives the DVI video display interface on the board.
Performance monitor blocks are added to capture performance data. All 10 video streams
moved by the AXI VDMA blocks are buffered through a shared DDR3 SDRAM memory and are
controlled by a MicroBlaze™ processor.
The reference system is targeted for the Virtex-6 XC6VLX240TFF1156-1 FPGA on the
Xilinx® ML605 Rev D evaluation board
XAPP520將符合2.5V和3.3V I/O標準的7系列FPGA高性能I/O Bank進行連接
The I/Os in Xilinx® 7 series FPGAs are classified as either high range (HR) or high performance (HP) banks. HR I/O banks can be operated from 1.2V to 3.3V, whereas HP I/O banks are optimized for operation between 1.2V and 1.8V. In circumstances that require an HP 1.8V I/O bank to interface with 2.5V or 3.3V logic, a range of options can be deployed. This application note describes methodologies for interfacing 7 series HP I/O banks with 2.5V and 3.3V systems
Xilinx Next Generation 28 nm FPGA Technology Overview
Xilinx has chosen 28 nm high-κ metal gate (HKMG) highperformance,low-power process technology and combined it with a new unified ASMBL™ architecture to create a new generation of FPGAs that offer lower power and higher performance. These devices enable unprecedented levels of integration and bandwidth and provide system architects and designers a fully programmable alternative to ASSPs and ASICs.
WP369可擴展式處理平臺-各種嵌入式系統的理想解決方案 ：Delivering unrivaled levels of system performance,flexibility, scalability, and integration to developers,Xilinx's architecture for a new Extensible Processing Platform is optimized for system power, cost, and size. Based on ARM's dual-core Cortex™-A9 MPCore processors and Xilinx’s 28 nm programmable logic,the Extensible Processing Platform takes a processor-centric approach by defining a comprehensive processor system implemented with standard design methods. This approach provides Software Developers a familiar programming environment within an optimized, full featured,powerful, yet low-cost, low-power processing platform.
Prakash Rashinkar has over 15 years experience in system design and verificationof embedded systems for communication satellites, launch vehicles and spacecraftground systems, high-performance computing, switching, multimedia, and wirelessapplications. Prakash graduated with an MSEE from Regional Engineering College,Warangal, in India. He lead the team that was responsible for delivering themethodologies for SOC verification at Cadence Design Systems. Prakash is anactive member of the VSIA Functional Verification DWG. He is currently Architectin the Vertical Markets and Design Environments Group at Cadence.
