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inTERFACES

  • Advances in Human Factors and System Interactions

    Human Factors and Systems Interaction aims to address the main issues of concern within systems interface with a particular emphasis on the system lifecycle development and implementation of inTERFACES and the general implications of virtual, augmented and mixed reality with respect to human and technology interaction. Human Factors and Systems Interaction is, in the first instance, affected by the forces shaping the nature offuture computing and systems development

    標簽: Interactions Advances Factors System Human and in

    上傳時間: 2020-06-10

    上傳用戶:shancjb

  • LoRaWAN Backend inTERFACES 1.0 Specification 規范

    LoraWAN后臺架構,網絡協議和設計規范

    標簽: LoRaWAN

    上傳時間: 2021-11-28

    上傳用戶:kingwide

  • 高通(Qualcomm)藍牙芯片QCC5151_硬件設計詳細指導書(官方內部培訓手冊)

    高通(Qualcomm)藍牙芯片QCC5151_硬件設計詳細指導書(官方內部培訓手冊)共52頁其內容是針對硬件設計、部分重要元器件選擇(ESD,Filter)及走線注意事項的詳細說明。2 Power management 2.1 SMPS 2.1.1 Components specification 2.1.2 Input power supply selection 2.1.3 Minimize SMPS EMI emissions 2.1.4 Internal LDOs and digital core decoupling 2.1.5 Powering external components 2.2 Charger 2.2.1 Charger connections.2.2.2 General charger operation2.2.3 Temperature measurement during charging 2.3 SYS_CTRL 3 Bluetooth radio3.1 RF PSU component choice 3.2 RF band-pass filter3.3 Layout (天線 走線的注意事項)4 Audio4.1 Audio bypass capacitors 4.2 Earphone speaker output4.3 Line/Mic input 4.4 Headphone output optimizition5 LED pads 5.1 LED driver 5.2 Digital/Button input 5.3 Analog input5.4 Disabled 6 Reset pin (Reset#)7 QSPIinterface 8 USB inTERFACES 8.1 USB device port8.1.1 USB connections8.1.2 Layout notes8.1.3 USB charger detection

    標簽: qualcomm 藍牙芯片 qcc5151

    上傳時間: 2022-01-24

    上傳用戶:XuVshu

  • 電流檢測電路中運算放大器與ADC的設計

    電學中的測量技術涉及范圍非常廣,電流測量在電學計量中占有非常重要的位置。如何精確地進行電流測量是精密測量的一大難題。傳統的電流檢測電路多采用運算放大芯片與片外電流檢測電路相結合的方式,電路集成度很低,需要較多的接口和資源才能完成對電路的檢測。本文把所有電路部分都集成在一塊芯片上,包括檢測電阻,運算放大器電路及模擬轉數字轉換電路,從而在電路內部可以進行電流檢測,使電路更好的集成化。前置電路使用二級共源共柵結構的運算放大器,減小溝道長度調制效應造成的電流誤差。10位SAR ADC中采用電容驅動能力強的傳輸門保證了模數轉化器的有效精度。比較器模塊采用再生鎖存器與遲滯比較器作為基礎單元組合解決精密測量的問題。本設計可以作為嵌入芯片內的一小部分而檢測芯片中的微小電流1mA~100mA,工作電壓在1.8v左右,電流檢測精度預期達到10uA的需求。The measurement technology in electricity involves a wide range,and current measurement plays a very important position in electrical measurement.How to accurately measure current is a big problem in precision measurement. The traditional current detecting circuit adopts the combination of the operational amplifier chip and theoff-chip current detecting circuit, The circuit integration is very low, and more inTERFACES and resources are needed tocomplete the circuit detection.This topic integrates all the circuit parts into one chip, including detection resistance, operational amplifier circuit andanalog to digital conversion circuit. Highly integrated circuit makes the external resources on the chip more intensive,so that current detection can be carried out inside the circuit, so that the circuit can be better integrated. Thefront-end circuit of this project uses two-stage cascade operational amplifier and cascade tube to reduce the currenterror caused by channel length modulation effect. In 10-bit SAR ADC, the transmission gate with strong capacitivedriving ability ensures the effective accuracy of the analog-to-digital converter. Comparator module uses regenerativelatch and hysteresis comparator as basic unit to solve the difficult problem of precision measurement. This topic can beused as a small part of the embedded chip to detect the micro-current in the chip 1 mA~100 mA, the working voltageis about 1.8v, and the current detection accuracy is expected to reach the requirement of 10 uA.

    標簽: 電流檢測 電路 運算放大器 adc

    上傳時間: 2022-04-03

    上傳用戶:

  • 高通藍牙芯片QCC5144_硬件設計指導書

    高通(Qualcomm)藍牙芯片QCC5144_硬件設計詳細指導書(官方內部培訓手冊)其內容是針對硬件設計、部分重要元器件選擇(ESD,Filter)及走線注意事項的詳細說明。2 Power management 2.1 SMPS 2.1.1 Components specification 2.1.2 Input power supply selection 92.1.3 Minimize SMPS EMI emissions 2.1.4 Internal LDOs and digital core decoupling 2.1.5 Powering external components 2.2 Charger 2.2.1 Charger connections.2.2.2 General charger operation2.2.3 Temperature measurement during charging 2.3 SYS_CTRL 3 Bluetooth radio3.1 RF PSU component choice 3.2 RF band-pass filter3.3 Layout (天線 走線的注意事項)4 Audio4.1 Audio bypass capacitors 4.2 Earphone speaker output4.3 Line/Mic input 4.4 Headphone output optimizition5 LED pads 5.1 LED driver 5.2 Digital/Button input 5.3 Analog input5.4 Disabled 6 Reset pin (Reset#)7 USB inTERFACES7.1 USB device port7.1.1 USB device port7.1.2 Layout notes 7.1.3 USB charger detectionA QCC5144 VFBGA example schematic and BOM B Recommended SMPS components specificationB.1 Inductor specifition B.2 Recommended inductors B.3 SMPS capacitor specifition

    標簽: 藍牙芯片 qcc5144

    上傳時間: 2022-04-07

    上傳用戶:默默

  • 藍牙芯片QCC5144 詳細規格書

    高通藍牙芯片QCC5144 詳細規格手冊datasheet (共99頁)含各個接口說明,應用原理圖等信息。 QualcommTrueWireless? stereo earbuds  (無線雙耳) Features(特點) ■ Qualifiedto Bluetooth v5.2 specification  (藍牙協議標準5.2) ■ 120 MHz Qualcomm ? Kalimba ? audio DSP  (120MHz 的音頻DSP處理器) ■ 32 MHz/80MHz Developer Processor for applications   ■ Firmware Processor for system ■ Flexible QSPI flash programmable platform   (可編程的QSPI外掛存儲器) ■ High-performance 24?bit audio interface       (高性能的24位音頻接口) ■ Digital and analog microphone inTERFACES      (含 數字 及模擬 MIC接口) ■ Flexible PIO controller and LED pins with PWM support ■ Serial inTERFACES: UART, Bit Serializer (I2C/SPI), USB 2.0   (支持串口,I2C, SPI,USB 接口) ■ Advanced audio algorithms   (高級的音頻算法) ■ ActiveNoise Cancellation:        (支持ANC 主動降噪功能) Hybrid, Feedforward, and Feedback modes, using Digital or Analog Mics, enabled using license keys available from Qualcomm? ■ Qualcomm ? aptX ? and aptX HD Audio  (支持獨特的aptx 功能)

    標簽: 藍牙芯片 qcc5144

    上傳時間: 2022-04-07

    上傳用戶:

  • 高通藍牙芯片QCC3040 詳細規格手冊datasheet

    高通藍牙芯片QCC3040 詳細規格手冊datasheet (共96頁)QualcommTrueWireless? stereo earbuds  (無線雙耳)Features(特點)■ Qualifiedto Bluetooth v5.2 specification  (藍牙協議標準5.2)■ 120 MHz Qualcomm ? Kalimba ? audio DSP  (120MHz 的音頻DSP處理器)■ 32 MHz Developer Processor for applications   (32MH的 應用處理器)■ Firmware Processor for system■ Flexible QSPI flash programmable platform   (可編程的QSPI外掛存儲器)■ High-performance 24?bit audio interface       (高性能的24位音頻接口)■ Digital and analog microphone inTERFACES      (含 數字 及模擬 MIC接口)■ Flexible PIO controller and LED pins with PWM support■ Serial inTERFACES: UART, Bit Serializer (I2C/SPI), USB 2.0   (支持串口,I2C, SPI,USB 接口)■ Advanced audio algorithms   (高級的音頻算法)■ ActiveNoise Cancellation:        (支持ANC 主動降噪功能)Hybrid, Feedforward, and Feedback modes, using Digitalor Analog Mics, enabled using license keys available from Qualcomm?■ Qualcomm ? aptX ? and aptX HD Audio  (支持獨特的aptx 功能)

    標簽: 藍牙芯片 qcc3040

    上傳時間: 2022-04-09

    上傳用戶:slq1234567890

  • GL823K 原理圖

    The GL823K integrates a high speed 8051 microprocessor and a high efficiency hardware engine for the best data transfer performance between USB and flash card inTERFACES. Its pin assignment design fits to card sockets to provide easier PCB layout. Inside the chip, it integrates 5V to 3.3V regulator, 3.3V to 1.8V regulator and power MOSFETs and it enables the function of on-chip clock source (OCCS) which means no external 12MHz XTAL is needed and that effectively reduces the total BOM cost.

    標簽: GL823K SCH

    上傳時間: 2022-04-27

    上傳用戶:qdxqdxqdxqdx

  • 高通藍牙芯片qcc5127詳細規格書datasheet.pdf

    高通藍牙芯片qcc5127詳細規格書datasheet.pdf英文版,共97頁  詳細說明:1   Package information(pin allocations, pios terminal functions)2   Bluetooth subsystem 3   Cystal oscillator4   System powerstates (Idel,Active,Sleep, Off)5   Host Interface subsystem6   Applications subsystem ( QSPI Flash controller)7   Audio subsystem(Dual core Kalimba, ROM, RAM and caches, Data, engine)8   Audio inTERFACES ( Analog, Digital, Simultaneous audio routing)9   Peripheral inTERFACES (PIOs, LED, USB, SPI, UART)10 Boot manager11 System manager12 example application schematic13 Electrical characteristics14 Audio performance15 Bluetooth performance16 Power consumption

    標簽: 藍牙 qcc5127

    上傳時間: 2022-06-12

    上傳用戶:

  • COMSOL聲學模塊介紹

    Mathematical modeling has become an important part of the research and devclopment work in engineering and scicnce. Retaining a competitive edge requiresa fast path between ideas and prototypes, and in this regard mathematical modeling and simulation provide a valuable shortcut for understanding both qualitative and quantitative aspects of scientific and engineering design. To assist you in gaining this edge, COMSOL Multiphysics offers state-of-the art performance, being built from the ground up with a Java3D interface and C/C++ solvers.The Acoustics Module is an optional package that extends the COMSOL Multiphysicsmodcling cnvironment with customized user inTERFACES and functionality optimizcd for the analysis of acoustics. Like all modules in the COMSOL family, it provides a brary of prewritten ready-to-run models that make it quicker and casier to analyze disciplinc-specific problcms.

    標簽: comsol 聲學模塊

    上傳時間: 2022-06-19

    上傳用戶:

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