The future satellite communication systems are re-
quired to support the higher transmission data rate
for providing the multimedia services by employing
the e鏗僣ient modulation method such as multi-Level
QAM.
The planarization technology of Chemical-Mechanical-Polishing (CMP), used for the manufacturing of multi-
level metal interconnects for high-density Integrated Circuits (IC), is also readily adaptable as an enabling technology
in MicroElectroMechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining. CMP not
only eases the design and manufacturability of MEMS devices by eliminating several photolithographic and film
issues generated by severe topography, but also enables far greater flexibility with process complexity and associated
designs. T
基于OFDM的無線寬帶系統(tǒng)仿真It contains mainly two parts, i.e. link-level simulator and system-level simulator.
Link-level simulator focus on a single-cell single-user scenario, where signal is transmitted from tx, and estimated at rx. Comparing the difference in tx/rx signal, the error rate can be found out. The output of the link-level simulator is the BLER/BER vs. SNR mapping table, that can be used for the system-level simulation.
System-level simulator focus on a multi-cell multi-user scenario. For the sake of simplicity, it takes the mapping table aquired in the link-level simulation, measure the actural SNR, and finds the corresponding error rate.
The PCA9517 is a CMOS integrated circuit that provides level shifting between lowvoltage (down to 0.9 V) and higher voltage (2.7 V to 5.5 V) I2C-bus or SMBus applications.While retaining all the operating modes and features of the I2C-bus system during thelevel shifts, it also permits extension of the I2C-bus by providing bidirectional buffering forboth the data (SDA) and the clock (SCL) lines, thus enabling two buses of 400 pF. Usingthe PCA9517 enables the system designer to isolate two halves of a bus for both voltageand capacitance. The SDA and SCL pins are over voltage tolerant and arehigh-impedance when the PCA9517 is unpowered.
The PCA9519 is a 4-channel level translating I2C-bus/SMBus repeater that enables theprocessor low voltage 2-wire serial bus to interface with standard I2C-bus or SMBus I/O.While retaining all the operating modes and features of the I2C-bus system during thelevel shifts, it also permits extension of the I2C-bus by providing bidirectional buffering forboth the data (SDA) and the clock (SCL) lines, thus enabling the I2C-bus or SMBusmaximum capacitance of 400 pF on the higher voltage side. The SDA and SCL pins areover-voltage tolerant and are high-impedance when the PCA9519 is unpowered.
中文版詳情瀏覽：http://www.elecfans.com/emb/fpga/20130715324029.html
Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture
The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications.
The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation.
Some of the UltraScale architecture breakthroughs include:
• Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50%
• Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability
• Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization
• 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard
• Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets
• Greatly enhanced DSP and packet handling
The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
中文版詳情瀏覽：http://www.elecfans.com/emb/fpga/20130715324029.html
Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture
The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications.
The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation.
Some of the UltraScale architecture breakthroughs include:
• Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50%
• Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability
• Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization
• 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard
• Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets
• Greatly enhanced DSP and packet handling
The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
