Xilinx FPGAs require at least two power supplies: VCCINTfor core circuitry and VCCO for I/O interface. For the latestXilinx FPGAs, including Virtex-II Pro, Virtex-II and Spartan-3, a third auxiliary supply, VCCAUX may be needed. Inmost cases, VCCAUX can share a power supply with VCCO.The core voltages, VCCINT, for most Xilinx FPGAs, rangefrom 1.2V to 2.5V. Some mature products have 3V, 3.3Vor 5V core voltages. Table 1 shows the core voltagerequirement for most of the FPGA device families. TypicalI/O voltages (VCCO) vary from 1.2V to 3.3V. The auxiliaryvoltage VCCAUX is 2.5V for Virtex-II Pro and Spartan-3, andis 3.3V for Virtex-II.
上傳時間： 2013-10-22
上傳用戶：aeiouetla
This document was developed under the Standard Hardware and Reliability Program (SHARP) TechnologyIndependent Representation of Electronic Products (TIREP) project. It is intended for use by VHSIC HardwareDescription Language (VHDL) design engineers and is offered as guidance for the development of VHDL modelswhich are compliant with the VHDL Data Item Description (DID DI-EGDS-80811) and which can be providedto manufacturing engineering personnel for the development of production data and the subsequent productionof hardware. Most VHDL modeling performed to date has been concentrated at either the component level orat the conceptual system level. The assembly and sub-assembly levels have been largely disregarded. Under theSHARP TIREP project, an attempt has been made to help close this gap. The TIREP models are based upon lowcomplexity Standard Electronic Modules (SEM) of the format A configuration. Although these modules are quitesimple, it is felt that the lessons learned offer guidance which can readily be applied to a wide range of assemblytypes and complexities.
上傳時間： 2013-11-20
上傳用戶：pzw421125
The fundamental problem of communication is that of reproducing at one point either exactly or approximately a message selected at another point. Frequently the messages have meaning; that is they refer to or are correlated according to some system with certain physical or conceptual entities.
標簽： 通信
上傳時間： 2013-11-11
上傳用戶：xy@1314
Xilinx is disclosing this user guide, manual, release note, and/or specification (the “Documentation”) to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the Documentation in any form or by any means including, but not limited to, electronic, mechanical, photocopying, recording, or otherwise, without the prior written consent of Xilinx. Xilinx expressly disclaims any liability arising out of your use of the Documentation. Xilinx reserves the right, at its sole discretion, to change the Documentation without notice at any time. Xilinx assumes no obligation to correct any errors contained in the Documentation, or to advise you of any corrections or updates. Xilinx expressly disclaims any liability in connection with technical support or assistance that may be provided to you in connection with the Information.
標簽： CPLD
上傳時間： 2014-12-05
上傳用戶：qazxsw
針對嵌入式機器視覺系統向獨立化、智能化發展的要求，介紹了一種嵌入式視覺系統--智能相機。基于對智能相機體系結構、組成模塊和圖像采集、傳輸和處理技術的分析，對國內外的幾款智能相機進行比較。綜合技術發展現狀，提出基于FPGA+DSP模式的硬件平臺，并提出智能相機的發展方向。分析結果表明，該系統設計可以實現脫離PC運行，完成圖像獲取與分析，并作出相應輸出。 Abstract: This paper introduced an embedded vision system-intelligent camera ，which was for embedded machine vision systems to an independent and intelligent development requirements. Intelligent camera architecture， component modules and image acquisition， transmission and processing technology were analyzed. After comparing integrated technology development of several intelligent cameras at home and abroad， the paper proposed the hardware platform based on FPGA+DSP models and made clear direction of development of intelligent cameras. On the analysis of the design， the results indicate that the system can run from the PC independently to complete the image acquisition and analysis and give a corresponding output.
上傳時間： 2013-11-14
上傳用戶：無聊來刷下
Prakash Rashinkar has over 15 years experience in system design and verificationof embedded systems for communication satellites, launch vehicles and spacecraftground systems, high-performance computing, switching, multimedia, and wirelessapplications. Prakash graduated with an MSEE from Regional Engineering College,Warangal, in India. He lead the team that was responsible for delivering themethodologies for SOC verification at Cadence Design Systems. Prakash is anactive member of the VSIA Functional Verification DWG. He is currently Architectin the Vertical Markets and Design Environments Group at Cadence.
上傳時間： 2013-11-19
上傳用戶：m62383408
USB接口控制器參考設計,xilinx提供VHDL代碼 usb xilinx vhdl ; This program is free software; you can redistribute it and/or modify ; it under the terms of the GNU General Public License as published by ; the Free Software Foundation; either version 2 of the License, or ; (at your option) any later version. ; ; This program is distributed in the hope that it will be useful, ; but WITHOUT ANY WARRANTY; without even the implied warranty of ; MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the ; GNU General Public License for more details. ; ; You should have received a copy of the GNU General Public License ; along with this program; if not, write to the Free Software ; Foundation, Inc., 675 Mass Ave, Cambridge, MA 02139, USA.
上傳時間： 2013-10-29
上傳用戶：zhouchang199
ref-sdr-sdram-vhdl代碼 SDR SDRAM Controller v1.1 readme.txt This readme file for the SDR SDRAM Controller includes information that was not incorporated into the SDR SDRAM Controller White Paper v1.1. The PLL is targeted at APEX(TM) devices. Please regenerate for your chosen architecture. Last updated September, 2002 Copyright ?2002 Altera Corporation. All rights reserved.
上傳時間： 2013-10-23
上傳用戶：半熟1994
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
上傳時間： 2013-11-16
上傳用戶：萍水相逢
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上傳時間： 2014-01-24
上傳用戶：s363994250
