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  • 使用凌陽(yáng)單片機(jī)的多命令語(yǔ)音識(shí)別范例

    ·詳細(xì)說(shuō)明:使用凌陽(yáng)單片機(jī)的多命令語(yǔ)音識(shí)別范例- The use insults the positive monolithic integrated circuit the multi- orders speech recognition model 文件列表:   Recognise_SD   ............\bsrSD.h   ............\

    標(biāo)簽: 凌陽(yáng)單片機(jī) 命令 語(yǔ)音識(shí)別 范例

    上傳時(shí)間: 2013-04-24

    上傳用戶:moshushi0009

  • pcb layout design(臺(tái)灣硬件工程師15年經(jīng)驗(yàn)

    PCB LAYOUT 術(shù)語(yǔ)解釋(TERMS)1. COMPONENT SIDE(零件面、正面)︰大多數(shù)零件放置之面。2. SOLDER SIDE(焊錫面、反面)。3. SOLDER MASK(止焊膜面)︰通常指Solder Mask Open 之意。4. TOP PAD︰在零件面上所設(shè)計(jì)之零件腳PAD,不管是否鑽孔、電鍍。5. BOTTOM PAD:在銲錫面上所設(shè)計(jì)之零件腳PAD,不管是否鑽孔、電鍍。6. positive LAYER:?jiǎn)巍㈦p層板之各層線路;多層板之上、下兩層線路及內(nèi)層走線皆屬之。7. NEGATIVE LAYER:通常指多層板之電源層。8. INNER PAD:多層板之positive LAYER 內(nèi)層PAD。9. ANTI-PAD:多層板之NEGATIVE LAYER 上所使用之絕緣範(fàn)圍,不與零件腳相接。10. THERMAL PAD:多層板內(nèi)NEGATIVE LAYER 上必須零件腳時(shí)所使用之PAD,一般稱為散熱孔或?qū)住?1. PAD (銲墊):除了SMD PAD 外,其他PAD 之TOP PAD、BOTTOM PAD 及INNER PAD 之形狀大小皆應(yīng)相同。12. Moat : 不同信號(hào)的 Power& GND plane 之間的分隔線13. Grid : 佈線時(shí)的走線格點(diǎn)2. Test Point : ATE 測(cè)試點(diǎn)供工廠ICT 測(cè)試治具使用ICT 測(cè)試點(diǎn) LAYOUT 注意事項(xiàng):PCB 的每條TRACE 都要有一個(gè)作為測(cè)試用之TEST PAD(測(cè)試點(diǎn)),其原則如下:1. 一般測(cè)試點(diǎn)大小均為30-35mil,元件分布較密時(shí),測(cè)試點(diǎn)最小可至30mil.測(cè)試點(diǎn)與元件PAD 的距離最小為40mil。2. 測(cè)試點(diǎn)與測(cè)試點(diǎn)間的間距最小為50-75mil,一般使用75mil。密度高時(shí)可使用50mil,3. 測(cè)試點(diǎn)必須均勻分佈於PCB 上,避免測(cè)試時(shí)造成板面受力不均。4. 多層板必須透過(guò)貫穿孔(VIA)將測(cè)試點(diǎn)留於錫爐著錫面上(Solder Side)。5. 測(cè)試點(diǎn)必需放至於Bottom Layer6. 輸出test point report(.asc 檔案powerpcb v3.5)供廠商分析可測(cè)率7. 測(cè)試點(diǎn)設(shè)置處:Setup􀃆pads􀃆stacks

    標(biāo)簽: layout design pcb 硬件工程師

    上傳時(shí)間: 2013-10-22

    上傳用戶:pei5

  • 用NTC熱敏電阻做溫度采集

    用NTC熱敏電阻做溫度采集:本應(yīng)用例實(shí)現(xiàn)NTC熱敏電阻器對(duì)溫度的測(cè)量。熱敏電阻器把溫度的變化轉(zhuǎn)換為電阻阻值的變化,再應(yīng)用相應(yīng)的測(cè)量電路把阻值的變化轉(zhuǎn)換為電壓的變化;SPMC75F2413A內(nèi)建8路ADC可以把模擬的電壓值轉(zhuǎn)換為數(shù)字信號(hào),對(duì)數(shù)值信號(hào)進(jìn)行處理可以得到相應(yīng)的溫度值。1.2 熱敏電阻器熱敏電阻有電阻值隨溫度升高而升高的正溫度系數(shù)(positive Temperature Coefficient簡(jiǎn)稱PTC)熱敏電阻和電阻值隨溫度升高而降低的負(fù)溫度系數(shù)(Negative Temperature Coefficient簡(jiǎn)稱NTC)熱敏電阻。NTC熱敏電阻器,是一種以過(guò)渡金屬氧化物為主要原材料,采用電子陶瓷工藝制成的熱敏半導(dǎo)體陶瓷組件。這種組件的電阻值隨溫度升高而降低,利用這一特性可制成測(cè)溫、溫度補(bǔ)償和控溫組件,又可以制成功率型組件,抑制電路的浪涌電流。

    標(biāo)簽: NTC 熱敏電阻 做溫度采集

    上傳時(shí)間: 2013-11-16

    上傳用戶:sssnaxie

  • 線性低壓差 (LDO) 穩(wěn)壓器解決方案

    We offer a broad line of high performance low dropout (LDO) linear regulators with fasttransient response, excellent line and load regulation, and very wide input voltage rangefrom 0.9V to 100V. Output currents range from 20mA to 10A, with positive, negative andmultiple output versions available. Many devices offer output voltage operation <0.8V andsome feature operation as low as 0V, even with a single supply. Most are stable with ceramicoutput capacitors. LDO regulators can be applied in virtually any application.

    標(biāo)簽: LDO 線性 低壓差 穩(wěn)壓器

    上傳時(shí)間: 2013-11-15

    上傳用戶:努力努力再努力

  • RT9018,RT9018AB-05 datasheet pdf

    The RT9018A/B is a high performance positive voltage regulator designed for use in applications requining very low Input voltage and very low dropout voltage at up to 3A(peak).

    標(biāo)簽: 9018 datasheet RT

    上傳時(shí)間: 2013-10-10

    上傳用戶:geshaowei

  • pcb layout design(臺(tái)灣硬件工程師15年經(jīng)驗(yàn)

    PCB LAYOUT 術(shù)語(yǔ)解釋(TERMS)1. COMPONENT SIDE(零件面、正面)︰大多數(shù)零件放置之面。2. SOLDER SIDE(焊錫面、反面)。3. SOLDER MASK(止焊膜面)︰通常指Solder Mask Open 之意。4. TOP PAD︰在零件面上所設(shè)計(jì)之零件腳PAD,不管是否鑽孔、電鍍。5. BOTTOM PAD:在銲錫面上所設(shè)計(jì)之零件腳PAD,不管是否鑽孔、電鍍。6. positive LAYER:?jiǎn)巍㈦p層板之各層線路;多層板之上、下兩層線路及內(nèi)層走線皆屬之。7. NEGATIVE LAYER:通常指多層板之電源層。8. INNER PAD:多層板之positive LAYER 內(nèi)層PAD。9. ANTI-PAD:多層板之NEGATIVE LAYER 上所使用之絕緣範(fàn)圍,不與零件腳相接。10. THERMAL PAD:多層板內(nèi)NEGATIVE LAYER 上必須零件腳時(shí)所使用之PAD,一般稱為散熱孔或?qū)住?1. PAD (銲墊):除了SMD PAD 外,其他PAD 之TOP PAD、BOTTOM PAD 及INNER PAD 之形狀大小皆應(yīng)相同。12. Moat : 不同信號(hào)的 Power& GND plane 之間的分隔線13. Grid : 佈線時(shí)的走線格點(diǎn)2. Test Point : ATE 測(cè)試點(diǎn)供工廠ICT 測(cè)試治具使用ICT 測(cè)試點(diǎn) LAYOUT 注意事項(xiàng):PCB 的每條TRACE 都要有一個(gè)作為測(cè)試用之TEST PAD(測(cè)試點(diǎn)),其原則如下:1. 一般測(cè)試點(diǎn)大小均為30-35mil,元件分布較密時(shí),測(cè)試點(diǎn)最小可至30mil.測(cè)試點(diǎn)與元件PAD 的距離最小為40mil。2. 測(cè)試點(diǎn)與測(cè)試點(diǎn)間的間距最小為50-75mil,一般使用75mil。密度高時(shí)可使用50mil,3. 測(cè)試點(diǎn)必須均勻分佈於PCB 上,避免測(cè)試時(shí)造成板面受力不均。4. 多層板必須透過(guò)貫穿孔(VIA)將測(cè)試點(diǎn)留於錫爐著錫面上(Solder Side)。5. 測(cè)試點(diǎn)必需放至於Bottom Layer6. 輸出test point report(.asc 檔案powerpcb v3.5)供廠商分析可測(cè)率7. 測(cè)試點(diǎn)設(shè)置處:Setup􀃆pads􀃆stacks

    標(biāo)簽: layout design pcb 硬件工程師

    上傳時(shí)間: 2013-11-17

    上傳用戶:cjf0304

  • ICA can be used in brain activation studies to reduce the number of dimension and filter out indepen

    ICA can be used in brain activation studies to reduce the number of dimension and filter out independent and interesting activations. This demonstration shows two studies. One provided by Hvidovre Universitets Hospital, Denmark, that consists of fMRI scannings of humans. Another provided by the EU sponsored MAPAWAMO project from fMRI scannings of monkeys. In the demo comparison between icaMS, icaML, icaMF, icaMF (positive sources) and PCA can be made. More detailes can found in [2].

    標(biāo)簽: activation dimension studies indepen

    上傳時(shí)間: 2015-04-19

    上傳用戶:zukfu

  • 數(shù)字運(yùn)算

    數(shù)字運(yùn)算,判斷一個(gè)數(shù)是否接近素?cái)?shù) A Niven number is a number such that the sum of its digits divides itself. For example, 111 is a Niven number because the sum of its digits is 3, which divides 111. We can also specify a number in another base b, and a number in base b is a Niven number if the sum of its digits divides its value. Given b (2 <= b <= 10) and a number in base b, determine whether it is a Niven number or not. Input Each line of input contains the base b, followed by a string of digits representing a positive integer in that base. There are no leading zeroes. The input is terminated by a line consisting of 0 alone. Output For each case, print "yes" on a line if the given number is a Niven number, and "no" otherwise. Sample Input 10 111 2 110 10 123 6 1000 8 2314 0 Sample Output yes yes no yes no

    標(biāo)簽: 數(shù)字 運(yùn)算

    上傳時(shí)間: 2015-05-21

    上傳用戶:daguda

  • 2^x mod n = 1 acm競(jìng)賽題 Give a number n, find the minimum x that satisfies 2^x mod n = 1. Input

    2^x mod n = 1 acm競(jìng)賽題 Give a number n, find the minimum x that satisfies 2^x mod n = 1. Input One positive integer on each line, the value of n. Output If the minimum x exists, print a line with 2^x mod n = 1. Print 2^? mod n = 1 otherwise. You should replace x and n with specific numbers. Sample Input 2 5 Sample Output 2^? mod 2 = 1 2^4 mod 5 = 1

    標(biāo)簽: mod satisfies minimum number

    上傳時(shí)間: 2015-06-02

    上傳用戶:qlpqlq

  • 平均因子分解法

    平均因子分解法,適用于正定矩陣First, let s recall the definition of the Cholesky decomposition: Given a symmetric positive definite square matrix X, the Cholesky decomposition of X is the factorization X=U U, where U is the square root matrix of X, and satisfies: (1) U U = X (2) U is upper triangular (that is, it has all zeros below the diagonal). It seems that the assumption of positive definiteness is necessary. Actually, it is "positive definite" which guarantees the existence of such kind of decomposition.

    標(biāo)簽: 分解

    上傳時(shí)間: 2013-12-24

    上傳用戶:啊颯颯大師的

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