·詳細說明：使用凌陽單片機的多命令語音識別范例- The use insults the positive monolithic integrated circuit the multi- orders speech recognition model 文件列表: Recognise_SD ............\bsrSD.h ............\
上傳時間： 2013-04-24
上傳用戶：moshushi0009
PCB LAYOUT 術語解釋(TERMS)1. COMPONENT SIDE(零件面、正面)︰大多數零件放置之面。2. SOLDER SIDE(焊錫面、反面)。3. SOLDER MASK(止焊膜面)︰通常指Solder Mask Open 之意。4. TOP PAD︰在零件面上所設計之零件腳PAD，不管是否鑽孔、電鍍。5. BOTTOM PAD：在銲錫面上所設計之零件腳PAD，不管是否鑽孔、電鍍。6. positive LAYER：單、雙層板之各層線路；多層板之上、下兩層線路及內層走線皆屬之。7. NEGATIVE LAYER：通常指多層板之電源層。8. INNER PAD：多層板之positive LAYER 內層PAD。9. ANTI-PAD：多層板之NEGATIVE LAYER 上所使用之絕緣範圍，不與零件腳相接。10. THERMAL PAD：多層板內NEGATIVE LAYER 上必須零件腳時所使用之PAD，一般稱為散熱孔或導通孔。11. PAD (銲墊)：除了SMD PAD 外，其他PAD 之TOP PAD、BOTTOM PAD 及INNER PAD 之形狀大小皆應相同。12. Moat : 不同信號的 Power& GND plane 之間的分隔線13. Grid : 佈線時的走線格點2. Test Point : ATE 測試點供工廠ICT 測試治具使用ICT 測試點 LAYOUT 注意事項:PCB 的每條TRACE 都要有一個作為測試用之TEST PAD(測試點)，其原則如下：1. 一般測試點大小均為30-35mil，元件分布較密時，測試點最小可至30mil.測試點與元件PAD 的距離最小為40mil。2. 測試點與測試點間的間距最小為50-75mil，一般使用75mil。密度高時可使用50mil,3. 測試點必須均勻分佈於PCB 上，避免測試時造成板面受力不均。4. 多層板必須透過貫穿孔(VIA)將測試點留於錫爐著錫面上(Solder Side)。5. 測試點必需放至於Bottom Layer6. 輸出test point report(.asc 檔案powerpcb v3.5)供廠商分析可測率7. 測試點設置處:Setuppadsstacks
上傳時間： 2013-10-22
上傳用戶：pei5
用NTC熱敏電阻做溫度采集:本應用例實現NTC熱敏電阻器對溫度的測量。熱敏電阻器把溫度的變化轉換為電阻阻值的變化，再應用相應的測量電路把阻值的變化轉換為電壓的變化；SPMC75F2413A內建8路ADC可以把模擬的電壓值轉換為數字信號，對數值信號進行處理可以得到相應的溫度值。1.2 熱敏電阻器熱敏電阻有電阻值隨溫度升高而升高的正溫度系數（positive Temperature Coefficient簡稱PTC）熱敏電阻和電阻值隨溫度升高而降低的負溫度系數（Negative Temperature Coefficient簡稱NTC）熱敏電阻。NTC熱敏電阻器，是一種以過渡金屬氧化物為主要原材料，采用電子陶瓷工藝制成的熱敏半導體陶瓷組件。這種組件的電阻值隨溫度升高而降低，利用這一特性可制成測溫、溫度補償和控溫組件，又可以制成功率型組件，抑制電路的浪涌電流。
上傳時間： 2013-11-16
上傳用戶：sssnaxie
We offer a broad line of high performance low dropout (LDO) linear regulators with fasttransient response, excellent line and load regulation, and very wide input voltage rangefrom 0.9V to 100V. Output currents range from 20mA to 10A, with positive, negative andmultiple output versions available. Many devices offer output voltage operation <0.8V andsome feature operation as low as 0V, even with a single supply. Most are stable with ceramicoutput capacitors. LDO regulators can be applied in virtually any application.
上傳時間： 2013-11-15
上傳用戶：努力努力再努力
The RT9018A/B is a high performance positive voltage regulator designed for use in applications requining very low Input voltage and very low dropout voltage at up to 3A(peak).
上傳時間： 2013-10-10
上傳用戶：geshaowei
PCB LAYOUT 術語解釋(TERMS)1. COMPONENT SIDE(零件面、正面)︰大多數零件放置之面。2. SOLDER SIDE(焊錫面、反面)。3. SOLDER MASK(止焊膜面)︰通常指Solder Mask Open 之意。4. TOP PAD︰在零件面上所設計之零件腳PAD，不管是否鑽孔、電鍍。5. BOTTOM PAD：在銲錫面上所設計之零件腳PAD，不管是否鑽孔、電鍍。6. positive LAYER：單、雙層板之各層線路；多層板之上、下兩層線路及內層走線皆屬之。7. NEGATIVE LAYER：通常指多層板之電源層。8. INNER PAD：多層板之positive LAYER 內層PAD。9. ANTI-PAD：多層板之NEGATIVE LAYER 上所使用之絕緣範圍，不與零件腳相接。10. THERMAL PAD：多層板內NEGATIVE LAYER 上必須零件腳時所使用之PAD，一般稱為散熱孔或導通孔。11. PAD (銲墊)：除了SMD PAD 外，其他PAD 之TOP PAD、BOTTOM PAD 及INNER PAD 之形狀大小皆應相同。12. Moat : 不同信號的 Power& GND plane 之間的分隔線13. Grid : 佈線時的走線格點2. Test Point : ATE 測試點供工廠ICT 測試治具使用ICT 測試點 LAYOUT 注意事項:PCB 的每條TRACE 都要有一個作為測試用之TEST PAD(測試點)，其原則如下：1. 一般測試點大小均為30-35mil，元件分布較密時，測試點最小可至30mil.測試點與元件PAD 的距離最小為40mil。2. 測試點與測試點間的間距最小為50-75mil，一般使用75mil。密度高時可使用50mil,3. 測試點必須均勻分佈於PCB 上，避免測試時造成板面受力不均。4. 多層板必須透過貫穿孔(VIA)將測試點留於錫爐著錫面上(Solder Side)。5. 測試點必需放至於Bottom Layer6. 輸出test point report(.asc 檔案powerpcb v3.5)供廠商分析可測率7. 測試點設置處:Setuppadsstacks
上傳時間： 2013-11-17
上傳用戶：cjf0304
ICA can be used in brain activation studies to reduce the number of dimension and filter out independent and interesting activations. This demonstration shows two studies. One provided by Hvidovre Universitets Hospital, Denmark, that consists of fMRI scannings of humans. Another provided by the EU sponsored MAPAWAMO project from fMRI scannings of monkeys. In the demo comparison between icaMS, icaML, icaMF, icaMF (positive sources) and PCA can be made. More detailes can found in [2].
標簽： activation dimension studies indepen
上傳時間： 2015-04-19
上傳用戶：zukfu
數字運算，判斷一個數是否接近素數 A Niven number is a number such that the sum of its digits divides itself. For example, 111 is a Niven number because the sum of its digits is 3, which divides 111. We can also specify a number in another base b, and a number in base b is a Niven number if the sum of its digits divides its value. Given b (2 <= b <= 10) and a number in base b, determine whether it is a Niven number or not. Input Each line of input contains the base b, followed by a string of digits representing a positive integer in that base. There are no leading zeroes. The input is terminated by a line consisting of 0 alone. Output For each case, print "yes" on a line if the given number is a Niven number, and "no" otherwise. Sample Input 10 111 2 110 10 123 6 1000 8 2314 0 Sample Output yes yes no yes no
上傳時間： 2015-05-21
上傳用戶：daguda
2^x mod n = 1 acm競賽題 Give a number n, find the minimum x that satisfies 2^x mod n = 1. Input One positive integer on each line, the value of n. Output If the minimum x exists, print a line with 2^x mod n = 1. Print 2^? mod n = 1 otherwise. You should replace x and n with specific numbers. Sample Input 2 5 Sample Output 2^? mod 2 = 1 2^4 mod 5 = 1
標簽： mod satisfies minimum number
上傳時間： 2015-06-02
上傳用戶：qlpqlq
平均因子分解法，適用于正定矩陣First, let s recall the definition of the Cholesky decomposition: Given a symmetric positive definite square matrix X, the Cholesky decomposition of X is the factorization X=U U, where U is the square root matrix of X, and satisfies: (1) U U = X (2) U is upper triangular (that is, it has all zeros below the diagonal). It seems that the assumption of positive definiteness is necessary. Actually, it is "positive definite" which guarantees the existence of such kind of decomposition.
標簽： 分解
上傳時間： 2013-12-24
上傳用戶：啊颯颯大師的
