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test-driven

  • 半導體制造技術_英文教程

    The correct answer for each test bank question is highlighted in bold. Test bank questions are based on the end-of-chapter questions. If a student studies the end-of-chapter questions (which are linked to the italicized words in each chapter), then they will be successful on the test bank questions.

    標簽: 半導體制造技術 英文 教程

    上傳時間: 2014-12-31

    上傳用戶:旗魚旗魚

  • SMT常用術語之中英文對比

      AI :Auto-Insertion 自動插件   AQL :acceptable quality level 允收水準   ATE :automatic test equipment 自動測試   ATM :atmosphere 氣壓   BGA :ball grid array 球形矩陣

    標簽: SMT 術語 中英文 對比

    上傳時間: 2013-11-20

    上傳用戶:haoxiyizhong

  • 電腦主板生產工藝及流程

    隨著科學技術的不斷發展,人們的生活水平的不斷提高,通信技術的不斷擴延,計算機已經涉及到各個不同的行業,成為人們生活、工作、學習、娛樂不可缺少的工具。而計算機主板作為計算機中非常重要的核心部件,其品質的好壞直接影響計算機整體品質的高低。因此在生產主板的過程中每一步都是要嚴格把關的,不能有絲毫的懈怠,這樣才能使其品質得到保證。 基于此,本文主要介紹電腦主板的SMT生產工藝流程和F/T(Function Test)功能測試步驟(F/T測試步驟以惠普H310機種為例)。讓大家了解一下完整的計算機主板是如何制成的,都要經過哪些工序以及如何檢測產品質量的。 本文首先簡單介紹了PCB板的發展歷史,分類,功能及發展趨勢,SMT及SMT產品制造系統,然后重點介紹了SMT生產工藝流程和F/T測試步驟。

    標簽: 電腦主板 生產工藝 流程

    上傳時間: 2013-11-02

    上傳用戶:c12228

  • 擴頻通信芯片STEL-2000A的FPGA實現

    針對傳統集成電路(ASIC)功能固定、升級困難等缺點,利用FPGA實現了擴頻通信芯片STEL-2000A的核心功能。使用ISE提供的DDS IP核實現NCO模塊,在下變頻模塊調用了硬核乘法器并引入CIC濾波器進行低通濾波,給出了DQPSK解調的原理和實現方法,推導出一種簡便的引入?仔/4固定相移的實現方法。采用模塊化的設計方法使用VHDL語言編寫出源程序,在Virtex-II Pro 開發板上成功實現了整個系統。測試結果表明該系統正確實現了STEL-2000A的核心功能。 Abstract:  To overcome drawbacks of ASIC such as fixed functionality and upgrade difficulty, FPGA was used to realize the core functions of STEL-2000A. This paper used the DDS IP core provided by ISE to realize the NCO module, called hard core multiplier and implemented CIC filter in the down converter, described the principle and implementation detail of the demodulation of DQPSK, and derived a simple method to introduce a fixed phase shift of ?仔/4. The VHDL source code was designed by modularity method , and the complete system was successfully implemented on Virtex-II Pro development board. Test results indicate that this system successfully realize the core function of the STEL-2000A.

    標簽: STEL 2000 FPGA 擴頻通信

    上傳時間: 2013-11-19

    上傳用戶:neu_liyan

  • 基于CPLD的QDPSK調制解調電路設計

    為了在CDMA系統中更好地應用QDPSK數字調制方式,在分析四相相對移相(QDPSK)信號調制解調原理的基礎上,設計了一種QDPSK調制解調電路,它包括串并轉換、差分編碼、四相載波產生和選相、相干解調、差分譯碼和并串轉換電路。在MAX+PLUSⅡ軟件平臺上,進行了編譯和波形仿真。綜合后下載到復雜可編程邏輯器件EPM7128SLC84-15中,測試結果表明,調制電路能正確選相,解調電路輸出數據與QDPSK調制輸入數據完全一致,達到了預期的設計要求。 Abstract:  In order to realize the better application of digital modulation mode QDPSK in the CDMA system, a sort of QDPSK modulation-demodulation circuit was designed based on the analysis of QDPSK signal modulation-demodulation principles. It included serial/parallel conversion circuit, differential encoding circuit, four-phase carrier wave produced and phase chosen circuit, coherent demodulation circuit, difference decoding circuit and parallel/serial conversion circuit. And it was compiled and simulated on the MAX+PLUSⅡ software platform,and downloaded into the CPLD of EPM7128SLC84-15.The test result shows that the modulation circuit can exactly choose the phase,and the output data of the demodulator circuit is the same as the input data of the QDPSK modulate. The circuit achieves the prospective requirement of the design.

    標簽: QDPSK CPLD 調制解調 電路設計

    上傳時間: 2013-10-28

    上傳用戶:jyycc

  • Virtex-5 GTP Transceiver Wizar

    The LogiCORE™ GTP Wizard automates the task of creating HDL wrappers to configure the high-speed serial GTP transceivers in Virtex™-5 LXT and SXT devices. The menu-driven interface allows one or more GTP transceivers to be configured using pre-definedtemplates for popular industry standards, or from scratch, to support a wide variety of custom protocols.The Wizard produces a wrapper, an example design, and a testbench for rapid integration and verification of the serial interface with your custom function Features• Creates customized HDL wrappers to configureVirtex-5 RocketIO™ GTP transceivers• Users can configure Virtex-5 GTP transceivers toconform to industry standard protocols usingpredefined templates, or tailor the templates forcustom protocols• Included protocol templates provide support for thefollowing specifications: Aurora, CPRI, FibreChannel 1x, Gigabit Ethernet, HD-SDI, OBSAI,OC3, OC12, OC48, PCI Express® (PCIe®), SATA,SATA II, and XAUI• Automatically configures analog settings• Each custom wrapper includes example design, testbench; and both implementation and simulation scripts

    標簽: Transceiver Virtex Wizar GTP

    上傳時間: 2013-10-20

    上傳用戶:dave520l

  • UART 4 UART參考設計,Xilinx提供VHDL代碼

    UART 4 UART參考設計,Xilinx提供VHDL代碼 uart_vhdl This zip file contains the following folders:  \vhdl_source  -- Source VHDL files:      uart.vhd  - top level file      txmit.vhd - transmit portion of uart      rcvr.vhd -  - receive portion of uart \vhdl_testfixture  -- VHDL Testbench files. This files only include the testbench behavior, they         do not instantiate the DUT. This can easily be done in a top-level VHDL          file or a schematic. This folder contains the following files:      txmit_tb.vhd  -- Test bench for txmit.vhd.      rcvr_tf.vhd  -- Test bench for rcvr.vhd.

    標簽: UART Xilinx VHDL 參考設計

    上傳時間: 2013-11-02

    上傳用戶:18862121743

  • pcb layout design(臺灣硬件工程師15年經驗

    PCB LAYOUT 術語解釋(TERMS)1. COMPONENT SIDE(零件面、正面)︰大多數零件放置之面。2. SOLDER SIDE(焊錫面、反面)。3. SOLDER MASK(止焊膜面)︰通常指Solder Mask Open 之意。4. TOP PAD︰在零件面上所設計之零件腳PAD,不管是否鑽孔、電鍍。5. BOTTOM PAD:在銲錫面上所設計之零件腳PAD,不管是否鑽孔、電鍍。6. POSITIVE LAYER:單、雙層板之各層線路;多層板之上、下兩層線路及內層走線皆屬之。7. NEGATIVE LAYER:通常指多層板之電源層。8. INNER PAD:多層板之POSITIVE LAYER 內層PAD。9. ANTI-PAD:多層板之NEGATIVE LAYER 上所使用之絕緣範圍,不與零件腳相接。10. THERMAL PAD:多層板內NEGATIVE LAYER 上必須零件腳時所使用之PAD,一般稱為散熱孔或導通孔。11. PAD (銲墊):除了SMD PAD 外,其他PAD 之TOP PAD、BOTTOM PAD 及INNER PAD 之形狀大小皆應相同。12. Moat : 不同信號的 Power& GND plane 之間的分隔線13. Grid : 佈線時的走線格點2. Test Point : ATE 測試點供工廠ICT 測試治具使用ICT 測試點 LAYOUT 注意事項:PCB 的每條TRACE 都要有一個作為測試用之TEST PAD(測試點),其原則如下:1. 一般測試點大小均為30-35mil,元件分布較密時,測試點最小可至30mil.測試點與元件PAD 的距離最小為40mil。2. 測試點與測試點間的間距最小為50-75mil,一般使用75mil。密度高時可使用50mil,3. 測試點必須均勻分佈於PCB 上,避免測試時造成板面受力不均。4. 多層板必須透過貫穿孔(VIA)將測試點留於錫爐著錫面上(Solder Side)。5. 測試點必需放至於Bottom Layer6. 輸出test point report(.asc 檔案powerpcb v3.5)供廠商分析可測率7. 測試點設置處:Setup􀃆pads􀃆stacks

    標簽: layout design pcb 硬件工程師

    上傳時間: 2013-11-17

    上傳用戶:cjf0304

  • pcb layout規則

    LAYOUT REPORT .............. 1   目錄.................. 1     1. PCB LAYOUT 術語解釋(TERMS)......... 2     2. Test Point : ATE 測試點供工廠ICT 測試治具使用............ 2     3. 基準點 (光學點) -for SMD:........... 4     4. 標記 (LABEL ING)......... 5     5. VIA HOLE PAD................. 5     6. PCB Layer 排列方式...... 5     7.零件佈置注意事項 (PLACEMENT NOTES)............... 5     8. PCB LAYOUT 設計............ 6     9. Transmission Line ( 傳輸線 )..... 8     10.General Guidelines – 跨Plane.. 8     11. General Guidelines – 繞線....... 9     12. General Guidelines – Damping Resistor. 10     13. General Guidelines - RJ45 to Transformer................. 10     14. Clock Routing Guideline........... 12     15. OSC & CRYSTAL Guideline........... 12     16. CPU

    標簽: layout pcb

    上傳時間: 2013-10-29

    上傳用戶:1234xhb

  • HDMI一致性測試

      The high defi nition multimedia interface (HDMI) is fastbecoming the de facto standard for passing digitalaudio and video data in home entertainment systems.This standard includes an I2C type bus called a displaydata channel (DDC) that is used to pass extended digitalinterface data (EDID) from the sinkdevice (such as adigital TV) to the source device (such as a digital A/Vreceiver). EDID includes vital information on the digitaldata formats that the sink device can accept. The HDMIspecifi cation requires that devices have less than 50pFof input capacitance on their DDC bus lines, which canbe very diffi cult to meet. The LTC®4300A’s capacitancebuffering feature allows devices to pass the HDMI DDCinput capacitance compliance test with ease.

    標簽: HDMI 測試

    上傳時間: 2013-11-21

    上傳用戶:tian126vip

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