The need to develop reliable microelectronic devices capable of operating at high
speeds with complex functionality requires a better understanding of the factors
that govern the thermal performance of electronics. With an increased demand
on system reliability and performance combined with miniaturization of the
devices, thermal consideration has become a crucial factor in the design of elec-
tronic packages, from chip to system levels.
Abstract: Class D amplifiers are typically very efficient, making them ideal candidates for portable applications that require longbattery life and low thermal dissipation. However, electromagnetic interference (EMI) is an issue that commonly accompanies theClass D switching topology. Active-emissions limiting reduces radiated emissions and enables "filterless" operation, allowingdesigners to create small, efficient portable applications with low EMI.
Many thermal metrics exist for integrated circuit (IC) packages ranging from θja to Ψjt.Often, these thermal metrics are misapplied by customers who try to use them to estimate junction temperatures in their systems.
Integrated EMI/thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of
Integrated EMI/thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. thermal models are built for the components. thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
Abstract: It is critically important that lithium-ion battery stacks have a good battery-management system for monitoring many cellvoltages and cell temperatures. Without that monitoring, thermal runaway can lead to a battery explosion. This design idea presentsa low-power circuit that measures the temperature of up to 12 thermistors. It powers and configures the multiplexers, and also putsthe muxes into shutdown to save power when not measuring temperatures.
As the performance of many handheld devices approachesthat of laptop computers, design complexity also increases.Chief among them is thermal management—how doyou meet increasing performance demands while keepinga compact and small product cool in the user’s hand?For instance, as battery capacities inevitably increase,charge currents will also increase to maintain or improvetheir charge times. Traditional linear regulator-based batterychargers will not be able to meet the charge currentand effi ciency demands necessary to allow a product torun cool. What is needed is a switching-based chargerthat takes just about the same amount of space as a linearsolution—but without the heat.
Designers spend much time combating thermal effects incircuitry. The close relationship between temperature andelectronic devices is the source of more design headachesthan any other consideration.
AN22 details the theoretical and application aspects of the LT1088 thermal RMS/DC converter. The basic theory behind thermal RMS/DC conversion is discussed and design details of the LT1088 are presented. Circuitry for RMS/DC converters, wideband input buffers and heater protection is shown.
