MEMS中的封裝工藝與半導(dǎo)體工藝中的封裝具有一定的相似性!因此!早期MEMS的封裝 大多借用半導(dǎo)體中現(xiàn)成的工藝%本文首先介紹了封裝的主要形式!然后著重闡述了晶圓級(jí)封裝與芯片級(jí)封裝&!’%最后給出了一些商業(yè)化的實(shí)例%
上傳時(shí)間： 2016-07-26
上傳用戶：leishenzhichui
MEMS真空封裝是提高M(jìn)EMS慣性器件性能的主要手段。本文應(yīng)用實(shí)驗(yàn)方法，在真空熔焊工藝設(shè)備上研究了MEMS器件金屬外殼真空封裝工藝。對(duì)不同鍍層結(jié)構(gòu)的外殼進(jìn)行了封裝實(shí)驗(yàn)比較和氣密性測(cè)試，結(jié)果發(fā)現(xiàn)，金屬外殼表面鍍Ni和鍍Au或管座表面鍍Ni和Au、管帽表面鍍Ni可有效的提高真空封裝的氣密性和可靠性，其氣密性優(yōu)于5×10-9 Pa·m3／s。封裝樣品的高低溫循環(huán)實(shí)驗(yàn)和真空保持特性的測(cè)量結(jié)果說(shuō)明，金屬外殼真空熔焊工藝可基本滿足MEMS器件真空封裝工藝的要求，并測(cè)得真空度為5 Pa—15 Pa左右。MEMS陀螺儀的封裝應(yīng)用也說(shuō)明了工藝的可行性。
上傳時(shí)間： 2016-07-26
上傳用戶：leishenzhichui
MEMS陀螺在紅外成像系統(tǒng)中的研究應(yīng)用_韓穎
標(biāo)簽： MEMS 陀螺 紅外成像系統(tǒng)
上傳時(shí)間： 2017-01-17
上傳用戶：llw_qingquan
基于MEMS陀螺儀的實(shí)時(shí)電子穩(wěn)像技術(shù)_范永杰
上傳時(shí)間： 2017-01-17
上傳用戶：llw_qingquan
A major societal challenge for the decades to come will be the delivery of effective medical services while at the same time curbing the growing cost of healthcare. It is expected that new concepts-particularly electronically assisted healthcare will provide an answer. This will include new devices, new medical services as well as networking. On the device side, impressive innovation has been made possible by micro- and nanoelectronics or CMOS Integrated Circuits. Even higher accuracy and smaller form factor combined with reduced cost and increased convenience of use are enabled by incorporation of CMOS IC design in the realization of biomedical systems. The compact hearing aid devices and current pacemakers are good examples of how CMOS ICs bring about these new functionalities and services in the medical field. Apart from these existing applications, many researchers are trying to develop new bio-medical solutions such as Artificial Retina, Deep Brain Stimulation, and Wearable Healthcare Systems. These are possible by combining the recent advances of bio-medical technology with low power CMOS IC technology.
上傳時(shí)間： 2017-02-06
上傳用戶：linyj
For more than three decades, Micro Electro Mechanical Systems (MEMS) have steadily transitioned out of research labs and into production forming a more than $10 billion market [1]. MEMS devices such as accelerometers, pressure sensors and microphones, to name a few, have seen immense utilization, particularly in the consumer electronics market, because of their compact sizes and minute power consumptions. In addition, these devices benefit from batch fabrication, which has enabled year-over-year reductions in cost [2]. In recent years,
標(biāo)簽： Frequency Tunable MEMS
上傳時(shí)間： 2020-06-06
上傳用戶：shancjb
Micro-Electro-Mechanical Systems (MEMS) are miniature systems composed ofintegratedelectricalandmechanicalpartstosenseand/orcontrolthingsonaμmscale. The concept of MEMS is attributed to Richard Feynman’s famous talk on December 29th, 1959 [2,3]. Dr. Feynman foresaw many aspects of future MEMS development with his insight in microphysics. In particular, material properties in the μm scale are differentfrombulkpropertiesandthescalingdownofintegratedcircuits(IC)fabrication technology has been a major driving force of MEMS development.
標(biāo)簽： Performance High MEMS RF
上傳時(shí)間： 2020-06-06
上傳用戶：shancjb
A few years ago I stood before an audience at a customer’s facility explaining the merits of micromachining technology. The small conference room was packed, and all ears were attentive. Everyone was eager to learn about thismysteriousbuzzword, “MEMS.”Although many in the audience were nodding in a sign of comprehension, the glazed lookson their facesbetrayed them. Thisexperience isnot unique, but one that isrepeated frequently in auditoriumsaround the world.
上傳時(shí)間： 2020-06-06
上傳用戶：shancjb
Recent advancements in nanotechnology (NT) materials and growth of micro/ nanotechnology have opened the door for potential applications of microelectro- mechanical systems (MEMS)- and NT-based sensors and devices. Such sensors and devices are best suited for communications, medical diagnosis, commercial, military, aerospace, and satellite applications. This book comes at a time when the future and well-being of Western industrial nations in the twenty-first century’s global eco- nomy increasingly depend on the quality and depth of the technological innovations they can commercialize at a rapid pace.
標(biāo)簽： MEMS
上傳時(shí)間： 2020-06-06
上傳用戶：shancjb
Over many years, RF-MEMS have been a hot topic in research at the technology and device level. In particular, various kinds of mechanical Si-MEMS resonators and piezoelectric BAW (bulk acoustic wave) resonators have been developed. The BAW technology has made its way to commercial products for passive RF filters, in particular for duplexers in RF transceiver front ends for cellular communica- tions. Beyond their use in filters, micromachined resonators can also be used in conjunction with active devices in innovative circuits and architectures.
標(biāo)簽： MEMS-based Circuits Systems and
上傳時(shí)間： 2020-06-06
上傳用戶：shancjb
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