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kalman C程序，應(yīng)用于GPS+IMU
上傳時(shí)間： 2016-11-25
上傳用戶：guanliya
本文設(shè)計(jì)一種基于表面微機(jī)械 MEMS加工工藝的微型傳感器，具有體積小，靈敏度高，穩(wěn)定性強(qiáng)等優(yōu)點(diǎn)。
上傳時(shí)間： 2015-12-03
上傳用戶：LC18
對(duì)微機(jī)電系統(tǒng)(Micro electro mechanical systems，MEMS)組裝與封裝工藝的特點(diǎn)進(jìn)行了總結(jié)分析，給出了MEMS組裝與封裝設(shè)備的研究現(xiàn)狀。針對(duì)MEMS產(chǎn)業(yè)發(fā)展的特點(diǎn)，分析了面向MEMS組裝與封裝的微操作設(shè)備中的工藝參數(shù)優(yōu)化數(shù)據(jù)庫(kù)、快速精密定位、模塊化作業(yè)工具、快速顯微視覺、柔性裝夾和自動(dòng)化物流等關(guān)鍵技術(shù)。在此基礎(chǔ)上，詳細(xì)介紹了研制的MEMS傳感器陽(yáng)極化鍵合設(shè)備和引線鍵合設(shè)備的組成結(jié)構(gòu)，工作原理，并給出了組裝和封裝試驗(yàn)結(jié)果。最后，指出了MEMS組裝與封裝技術(shù)及設(shè)備研制的發(fā)展趨勢(shì)。
標(biāo)簽： 微機(jī)電系統(tǒng) 封裝 關(guān)鍵技術(shù) 操作
上傳時(shí)間： 2016-07-26
上傳用戶：leishenzhichui
無(wú)跡卡爾曼濾波UKF在組合導(dǎo)航中應(yīng)用的MATLAB仿真代碼
上傳時(shí)間： 2017-12-29
上傳用戶：007amw
MPU-6500是全球首例9軸運(yùn)動(dòng)處理傳感器。它集成了3軸MEMS陀螺儀，3軸MEMS加速度計(jì)，
上傳時(shí)間： 2019-12-07
上傳用戶：finezwl
As a student I did my best to avoid text books – a strange statement for a Professor to make and one that I should clarify before you put this book down; I did my best to avoid text books that did not help me.
標(biāo)簽： Microdevices Ceramic Thick Films MEMS for and
上傳時(shí)間： 2020-06-06
上傳用戶：shancjb
The planarization technology of Chemical-Mechanical-Polishing (CMP), used for the manufacturing of multi- level metal interconnects for high-density Integrated Circuits (IC), is also readily adaptable as an enabling technology in MicroElectroMechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining. CMP not only eases the design and manufacturability of MEMS devices by eliminating several photolithographic and film issues generated by severe topography, but also enables far greater flexibility with process complexity and associated designs. T
標(biāo)簽： mechanical polishing Chemical
上傳時(shí)間： 2020-06-06
上傳用戶：shancjb
The mature CMOS fabrication processes are available in many IC foundries. It is cost-effective to leverage the existing CMOS fabrication technologies to implement MEMS devices. On the other hand, the MEMS devices could also add values to the IC industry as the Moore’s law reaching its limit. The CMOS MEMS could play a key role to bridge the gap between the CMOS and MEMS technologies. The CMOS MEMS also offers the advantage of monolithic integration of ICs and micro mechanical components.
標(biāo)簽： TECHNOLOGY CMOS MEMS KEY
上傳時(shí)間： 2020-06-06
上傳用戶：shancjb
Five years have passed since the first edition of this book was published.Over the five years,the world has witnessed a technological revolution headlined by an array of exciting consumer and industrial products such as the Nintendo Wii, Apple iPod/iPad, sensor-rich smart phones, phones with cameras,new operating systems for mobile phones and apps,e-books,WiFi,voice- over-IP calls, social networking, 3D animated movies, and cloud computing, to name the major ones that affect everyday living
標(biāo)簽： Foundations MEMS of
上傳時(shí)間： 2020-06-06
上傳用戶：shancjb
Nowadays sensors are part of everyday life in a wide variety of fields: scientific applications, medical instrumentation, industrial field, ...and, last but not least, popular mass production and low-cost goods, like smartphones and other mobile devices. Markets and business behind the field of sensors are quite impressive. A common trend for consumer applications is miniaturization which requires, on one side, a lot of research, development efforts, and resources but, on the other hand, allows costs and final application size reduction. In this scenario scientific community and industries are very active to drive innovation.
標(biāo)簽： Magnetometers Lorentz Force MEMS
上傳時(shí)間： 2020-06-06
上傳用戶：shancjb
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