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Placement

  • BGA CHIP Placement AND ROUTING RUL

    BGA CHIP Placement AND ROUTING RUL

    標(biāo)簽: Placement ROUTING CHIP BGA

    上傳時間: 2015-11-05

    上傳用戶:asdfasdfd

  • An Efficient and Effective Detailed Placement Algorithm Global Swap  To identify a pair

    An Efficient and Effective Detailed Placement Algorithm Global Swap  To identify a pair of cells that can be swapped to reduce wirelength (others are fixed). 2. Vertical Swap  Swap a cell with a nearby cell in the segment above or below. 3. Local Re-ordering  Re-order consecutive cells locally to reduce wirelength. 4. Single-Segment Clustering  Place cells optimally within a segment.

    標(biāo)簽: Algorithm Efficient Effective Placement

    上傳時間: 2013-12-18

    上傳用戶:ukuk

  • Sudoku is a logic-based number Placement puzzle. A deceptively simple game of logic, Sudoku is puzzl

    Sudoku is a logic-based number Placement puzzle. A deceptively simple game of logic, Sudoku is puzzling players all over world.

    標(biāo)簽: Sudoku deceptively logic-based Placement

    上傳時間: 2017-07-04

    上傳用戶:dragonhaixm

  • BGA布線指南

    BGA布線指南 BGA CHIP Placement AND ROUTING RULE BGA是PCB上常用的組件,通常CPU、NORTH BRIDGE、SOUTH BRIDGE、AGP CHIP、CARD BUS CHIP…等,大多是以bga的型式包裝,簡言之,80﹪的高頻信號及特殊信號將會由這類型的package內(nèi)拉出。因此,如何處理BGA package的走線,對重要信號會有很大的影響。 通常環(huán)繞在BGA附近的小零件,依重要性為優(yōu)先級可分為幾類: 1. by pass。 2. clock終端RC電路。 3. damping(以串接電阻、排組型式出現(xiàn);例如memory BUS信號) 4. EMI RC電路(以dampin、C、pull height型式出現(xiàn);例如USB信號)。 5. 其它特殊電路(依不同的CHIP所加的特殊電路;例如CPU的感溫電路)。 6. 40mil以下小電源電路組(以C、L、R等型式出現(xiàn);此種電路常出現(xiàn)在AGP CHIP or含AGP功能之CHIP附近,透過R、L分隔出不同的電源組)。 7. pull low R、C。 8. 一般小電路組(以R、C、Q、U等型式出現(xiàn);無走線要求)。 9. pull height R、RP。 中文DOC,共5頁,圖文并茂

    標(biāo)簽: BGA 布線

    上傳時間: 2013-04-24

    上傳用戶:cxy9698

  • Many CAD users dismiss schematic capture as a necessary evil in the process of creating

    Many CAD users dismiss schematic capture as a necessary evil in the process of creating\r\nPCB layout but we have always disputed this point of view. With PCB layout now offering\r\nautomation of both component Placement and track routing, getting the des

    標(biāo)簽: schematic necessary creating dismiss

    上傳時間: 2013-09-25

    上傳用戶:baiom

  • pcb layout規(guī)則

    LAYOUT REPORT .............. 1   目錄.................. 1     1. PCB LAYOUT 術(shù)語解釋(TERMS)......... 2     2. Test Point : ATE 測試點(diǎn)供工廠ICT 測試治具使用............ 2     3. 基準(zhǔn)點(diǎn) (光學(xué)點(diǎn)) -for SMD:........... 4     4. 標(biāo)記 (LABEL ING)......... 5     5. VIA HOLE PAD................. 5     6. PCB Layer 排列方式...... 5     7.零件佈置注意事項(xiàng) (Placement NOTES)............... 5     8. PCB LAYOUT 設(shè)計(jì)............ 6     9. Transmission Line ( 傳輸線 )..... 8     10.General Guidelines – 跨Plane.. 8     11. General Guidelines – 繞線....... 9     12. General Guidelines – Damping Resistor. 10     13. General Guidelines - RJ45 to Transformer................. 10     14. Clock Routing Guideline........... 12     15. OSC & CRYSTAL Guideline........... 12     16. CPU

    標(biāo)簽: layout pcb

    上傳時間: 2013-12-20

    上傳用戶:康郎

  • DCDC穩(wěn)壓器印刷電路板設(shè)計(jì)

      The LTM8020, LTM8021, LTM8022 and LTM8023 μModule®regulators are complete easy-to-use encapsulated stepdownDC/DC regulators intended to take the pain and aggravationout of implementing a switching power supplyonto a system board. With a μModule regulator, you onlyneed an input cap, output cap and one or two resistorsto complete the design. As one might imagine, this highlevel of integration greatly simplifi es the task of printedcircuit board design, reducing the effort to four categories:component footprint generation, component Placement,routing the nets, and thermal vias.

    標(biāo)簽: DCDC 穩(wěn)壓器 印刷電路板

    上傳時間: 2014-01-18

    上傳用戶:laomv123

  • Xilinx UltraScale:新一代架構(gòu)滿足您的新一代架構(gòu)需求(EN)

      中文版詳情瀏覽:http://www.elecfans.com/emb/fpga/20130715324029.html   Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture    The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications.   The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation.   Some of the UltraScale architecture breakthroughs include:   • Strategic Placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50%    • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability   • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization   • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard    • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets   • Greatly enhanced DSP and packet handling   The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.

    標(biāo)簽: UltraScale Xilinx 架構(gòu)

    上傳時間: 2013-11-13

    上傳用戶:瓦力瓦力hong

  • 多遠(yuǎn)程二極管溫度傳感器 (Design Considerat

    多遠(yuǎn)程二極管溫度傳感器-Design Considerations for pc thermal management Multiple RDTS (remote diode temperature sensing) provides the most accurate method of sensing an IC’s junction temperature. It overcomes thermal gradient and Placement issues encountered when trying to place external sensors. PCB component count decreases when using a device that provides multiple inputs.Better temperature sensing improves product performance and reliability. Disk drive data integrity suffers at elevated temperatures. IBM published an article stating that a 5°C rise in operating temperature causes a 15% increase in the drive’s failure rate. The overall performance of a system can be improved by providing a more accurate temperature measurement of the most critical devices allowing them to run just a few degrees hotter.The LM83 directly senses its own temperature and the temperature of three external PN junctions. One is dedicated to the CPU of choice, the other two go to other parts of your system that need thermal monitoring such as the disk drive or graphics chip. The SMBus-compatible LM83 supports SMBus timeout and logic levels. The LM83 has two interrupt outputs; one for user-programmable limits and WATCHDOG capability (INT), the other is a Critical Temperature Alarm output (T_CRIT_A) for system power supply shutdown.

    標(biāo)簽: Considerat Design 遠(yuǎn)程 二極管

    上傳時間: 2014-12-21

    上傳用戶:ljd123456

  • Allegro FPGA System Planner中文介紹

      完整性高的FPGA-PCB系統(tǒng)化協(xié)同設(shè)計(jì)工具   Cadence OrCAD and Allegro FPGA System Planner便可滿足較復(fù)雜的設(shè)計(jì)及在設(shè)計(jì)初級產(chǎn)生最佳的I/O引腳規(guī)劃,并可透過FSP做系統(tǒng)化的設(shè)計(jì)規(guī)劃,同時整合logic、schematic、PCB同步規(guī)劃單個或多個FPGA pin的最佳化及l(fā)ayout Placement,借由整合式的界面以減少重復(fù)在design及PCB Layout的測試及修正的過程及溝通時間,甚至透過最佳化的pin mapping、Placement后可節(jié)省更多的走線空間或疊構(gòu)。   Specifying Design Intent   在FSP整合工具內(nèi)可直接由零件庫選取要擺放的零件,而這些零件可直接使用PCB內(nèi)的包裝,預(yù)先讓我們同步規(guī)劃FPGA設(shè)計(jì)及在PCB的Placement。  

    標(biāo)簽: Allegro Planner System FPGA

    上傳時間: 2013-11-06

    上傳用戶:wwwe

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