FTTx network architectureThe core technology of optical chips in the FTTx transceiversThe core technology of optical transceiver in FTTxThe trend of Next-generation optical transceiver Technology for FTTx
This application note provides step-by-step instructions on how to recreate a Tri-Mode Ethernet(TEMAC) performance testing system using the ML405 board and MontaVista Linux 4.0. Thisapplication note shows how to set up a simple EDK Base System Builder system on the ML405Evaluation Platform and run performance tests. The network architecture for the test isdescribed. A system is built and downloaded into the FPGA. A MontaVista Linux kernel isconfigured, built, and downloaded into the ML405 Evaluation Platform. The instructions forobtaining and setting up the software used to perform the measurements, netperf, are given.
The LPC2292/2294 microcontrollers are based on a 16/32-bit ARM7TDMI-S CPU with real-time emulation and embedded trace support, together with 256 kB of embedded high-speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at the maximum clock rate. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 pct with minimal performance penalty.
With their 144-pin package, low power consumption, various 32-bit timers, 8-channel 10-bit ADC, 2/4 (LPC2294) advanced CAN channels, PWM channels and up to nine external interrupt pins these microcontrollers are particularly suitable for automotive and industrial control applications as well as medical systems and fault-tolerant maintenance buses. The number of available fast GPIOs ranges from 76 (with external memory) through 112 (single-chip). With a wide range of additional serial communications interfaces, they are also suited for communication gateways and protocol converters as well as many other general-purpose applications.
Remark: Throughout the data sheet, the term LPC2292/2294 will apply to devices with and without the /00 or /01 suffix. The suffixes /00 and /01 will be used to differentiate from other devices only when necessary.
Abstract: This application note discusses a design for a phantom antenna power-supply system compatible with theDigital Satellite Equipment Control (DiSEqC) communication standard, using the MAX16948 automotive dual, highvoltageLDO/switch. The presented application circuit provides a remote antenna power supply and also enables onewaycommunication from the radio head unit to the remote antenna. This system architecture offers flexibility inDiSEqC tone-burst frequency choice (100Hz to 30kHz), enabling users the ability to select the best frequency for theirapplication.
Abstract: While many questions still surround the creation and deployment of the smart grid, the need for a reliablecommunications infrastructure is indisputable. Developers of the IEEE 1901.2 standard identified difficult channel conditionscharacteristic of low-frequency powerline communications and implemented an orthogonal frequency division multiplexing (OFDM)architecture using advanced modulation and channel-coding techniques. This strategy helped to ensure a robust communicationsnetwork for the smart grid.
為了能夠滿足基站易于選址、優質快速的建站要求和易維護、低成本、高可靠的運行要求，本文對以方艙來實現一體化結構基站做出一番探討。從系統設計的觀點闡述了移動通信高性能基站天線設計的幾個關鍵問題，介紹了智能天線技術在基站中的應用，并且用HFSS軟件仿真了一種新型的對稱陣子天線，該天線駐波比小于2的帶寬可以達到60%，具有良好的寬頻帶特性。
Abstract:
In order to meet the station construction requirement of easy site selection and fast base station， and meet the operational requirement of easy maintenance， low cost and high reliability， this paper discussed the unified architecture base station using shelter. Several key problems of high performance mobile communication base station antenna were illustrated from the view of system design， the application of smart antenna in base station was also introduced. And a novel dipole antenna was simulated by using HFSS， the VSWR of the antenna is less than 2， and the bandwidth was reach to 60%. So it has good broadband properties.
The LPC1850/30/20/10 are ARM Cortex-M3 based microcontrollers for embeddedapplications. The ARM Cortex-M3 is a next generation core that offers systemenhancements such as low power consumption, enhanced debug features, and a highlevel of support block integration.The LPC1850/30/20/10 operate at CPU frequencies of up to 150 MHz. The ARMCortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture withseparate local instruction and data buses as well as a third bus for peripherals. The ARMCortex-M3 CPU also includes an internal prefetch unit that supports speculativebranching.The LPC1850/30/20/10 include up to 200 kB of on-chip SRAM data memory, a quad SPIFlash Interface (SPIFI), a State Configuration Timer (SCT) subsystem, two High-speedUSB controllers, Ethernet, LCD, an external memory controller, and multiple digital andanalog peripherals.
The LPC4350/30/20/10 are ARM Cortex-M4 based microcontrollers for embeddedapplications. The ARM Cortex-M4 is a next generation core that offers systemenhancements such as low power consumption, enhanced debug features, and a highlevel of support block integration.The LPC4350/30/20/10 operate at CPU frequencies of up to 150 MHz. The ARMCortex-M4 CPU incorporates a 3-stage pipeline, uses a Harvard architecture withseparate local instruction and data buses as well as a third bus for peripherals, andincludes an internal prefetch unit that supports speculative branching. The ARMCortex-M4 supports single-cycle digital signal processing and SIMD instructions. Ahardware floating-point processor is integrated in the core.The LPC4350/30/20/10 include an ARM Cortex-M0 coprocessor, up to 264 kB of datamemory, advanced configurable peripherals such as the State Configurable Timer (SCT)and the Serial General Purpose I/O (SGPIO) interface, two High-speed USB controllers,Ethernet, LCD, an external memory controller, and multiple digital and analog peripherals
中文版詳情瀏覽：http://www.elecfans.com/emb/fpga/20130715324029.html
Xilinx UltraScale:The Next-Generation architecture for Your Next-Generation architecture
The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications.
The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation.
Some of the UltraScale architecture breakthroughs include:
• Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50%
• Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability
• Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization
• 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard
• Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets
• Greatly enhanced DSP and packet handling
The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
