Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
The introduction of Spartan-3™ devices has createdmultiple changes in the evolution of embedded controldesigns and pushed processing capabilities to the “almostfreestage.” With these new FPGAs falling under $20, involume, with over 1 million system gates, and under $5for 100K gate-level units, any design with programmablelogic has a readily available 8- or 16-bit processor costingless than 75 cents and 32-bit processor for less than $1.50.
FPGAs have changed dramatically since Xilinx first introduced them just 15 years ago. In thepast, FPGA were primarily used for prototyping and lower volume applications; custom ASICswere used for high volume, cost sensitive designs. FPGAs had also been too expensive and tooslow for many applications, let alone for System Level Integration (SLI). Plus, the development
UART 4 UART參考設計，Xilinx提供VHDL代碼 uart_vhdl
This zip file contains the following folders:
\vhdl_source -- Source VHDL files:
uart.vhd - top level file
txmit.vhd - transmit portion of uart
rcvr.vhd - - receive portion of uart
\vhdl_testfixture -- VHDL Testbench files. This files only include the testbench behavior, they
do not instantiate the DUT. This can easily be done in a top-level VHDL
file or a schematic. This folder contains the following files:
txmit_tb.vhd -- Test bench for txmit.vhd.
rcvr_tf.vhd -- Test bench for rcvr.vhd.
Abstract: This reference design provides design ideas for a cost-effective, low-power liquid-level measurement dataacquisition system (DAS) using a compensated silicon pressure sensor and a high-precision delta-sigma ADC. Thisdocument discusses how to select the compensated silicon pressure sensor, suggest system algorithms, and providenoise analyses. It also describes calibration ideas to improve system performance while also reducing complexity andcost.
Abstract: This application note describes system-level characterization and modeling techniques for radio frequency (RF) and microwavesubsystem components. It illustrates their use in a mixed-signal, mixed-mode system-level simulation. The simulation uses an RF transmitterwith digital predistortion (DPD) as an example system. Details of this complex system and performance data are presented.
