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  • UHF讀寫器設(shè)計(jì)中的FM0解碼技術(shù)

       針對(duì)UHF讀寫器設(shè)計(jì)中,在符合EPC Gen2標(biāo)準(zhǔn)的情況下,對(duì)標(biāo)簽返回的高速數(shù)據(jù)進(jìn)行正確解碼以達(dá)到正確讀取標(biāo)簽的要求,提出了一種新的在ARM平臺(tái)下采用邊沿捕獲統(tǒng)計(jì)定時(shí)器數(shù)判斷數(shù)據(jù)的方法,并對(duì)FM0編碼進(jìn)行解碼。與傳統(tǒng)的使用定時(shí)器定時(shí)采樣高低電平的FM0解碼方法相比,該解碼方法可以減少定時(shí)器定時(shí)誤差累積的影響;可以將捕獲定時(shí)器數(shù)中斷與數(shù)據(jù)判斷解碼相對(duì)分隔開(kāi),使得中斷對(duì)解碼影響很小,實(shí)現(xiàn)捕獲與解碼的同步。通過(guò)實(shí)驗(yàn)表明,這種方法提高了解碼的效率,在160 Kb/s的接收速度下,讀取一張標(biāo)簽的時(shí)間約為30次/s。 Abstract:  Aiming at the requirement of receiving correctly decoded data from the tag under high-speed communication which complied with EPC Gen2 standard in the design of UHF interrogator, the article introduced a new technology for FM0 decoding which counted the timer counter to judge data by using the edge interval of signal capture based on the ARM7 platform. Compared with the traditional FM0 decoding method which used the timer timed to sample the high and low level, the method could reduce the accumulation of timing error and could relatively separate capture timer interrupt and the data judgment for decoding, so that the disruption effect on the decoding was small and realizd synchronization of capture and decoding. Testing result shows that the method improves the efficiency of decoding, at 160 Kb/s receiving speed, the time of the interrogator to read a tag is about 30 times/s.

    標(biāo)簽: UHF FM0 讀寫器 解碼技術(shù)

    上傳時(shí)間: 2013-11-10

    上傳用戶:liufei

  • LPC1850 Cortex-M3內(nèi)核微控制器數(shù)據(jù)手冊(cè)

    The LPC1850/30/20/10 are ARM Cortex-M3 based microcontrollers for embeddedapplications. The ARM Cortex-M3 is a next generation core that offers systemenhancements such as low power consumption, enhanced debug features, and a highlevel of support block integration.The LPC1850/30/20/10 operate at CPU frequencies of up to 150 MHz. The ARMCortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture withseparate local instruction and data buses as well as a third bus for peripherals. The ARMCortex-M3 CPU also includes an internal prefetch unit that supports speculativebranching.The LPC1850/30/20/10 include up to 200 kB of on-chip SRAM data memory, a quad SPIFlash Interface (SPIFI), a State Configuration Timer (SCT) subsystem, two High-speedUSB controllers, Ethernet, LCD, an external memory controller, and multiple digital andanalog peripherals.

    標(biāo)簽: Cortex-M 1850 LPC 內(nèi)核微控制器

    上傳時(shí)間: 2014-12-31

    上傳用戶:zhuoying119

  • LPC4300系列ARM雙核微控制器產(chǎn)品數(shù)據(jù)手冊(cè)

    The LPC4350/30/20/10 are ARM Cortex-M4 based microcontrollers for embeddedapplications. The ARM Cortex-M4 is a next generation core that offers systemenhancements such as low power consumption, enhanced debug features, and a highlevel of support block integration.The LPC4350/30/20/10 operate at CPU frequencies of up to 150 MHz. The ARMCortex-M4 CPU incorporates a 3-stage pipeline, uses a Harvard architecture withseparate local instruction and data buses as well as a third bus for peripherals, andincludes an internal prefetch unit that supports speculative branching. The ARMCortex-M4 supports single-cycle digital signal processing and SIMD instructions. Ahardware floating-point processor is integrated in the core.The LPC4350/30/20/10 include an ARM Cortex-M0 coprocessor, up to 264 kB of datamemory, advanced configurable peripherals such as the State Configurable Timer (SCT)and the Serial General Purpose I/O (SGPIO) interface, two High-speed USB controllers,Ethernet, LCD, an external memory controller, and multiple digital and analog peripherals

    標(biāo)簽: 4300 LPC ARM 雙核微控制器

    上傳時(shí)間: 2013-10-28

    上傳用戶:15501536189

  • Cadence PCB 設(shè)計(jì)與制板

    §1、安裝:    SPB15.2 CD1~3,安裝1、2,第3為庫(kù),不安裝    License安裝:         設(shè)置環(huán)境變量lm_license_file   D:\Cadence\license.dat         修改license中SERVER yyh ANY 5280為SERVER zeng ANY 5280 §2、用Design Entry CIS(Capture)設(shè)計(jì)原理圖   進(jìn)入Design Entry CIS Studio     設(shè)置操作環(huán)境\Options\Preferencses:       顏色:colors/Print       格子:Grid Display       雜項(xiàng):Miscellaneous       .........常取默認(rèn)值

    標(biāo)簽: Cadence PCB

    上傳時(shí)間: 2013-11-13

    上傳用戶:wangchong

  • SMT常用術(shù)語(yǔ)之中英文對(duì)比

      AI :Auto-Insertion 自動(dòng)插件   AQL :acceptable quality level 允收水準(zhǔn)   ATE :automatic test equipment 自動(dòng)測(cè)試   ATM :atmosphere 氣壓   BGA :ball grid array 球形矩陣

    標(biāo)簽: SMT 術(shù)語(yǔ) 中英文 對(duì)比

    上傳時(shí)間: 2013-11-20

    上傳用戶:haoxiyizhong

  • SWIFT設(shè)計(jì)軟件工具

    SWIFT 提供的服務(wù)   1、接入服務(wù)   SWIFT的接入服務(wù)通過(guò)SWIFTAlliance的系列產(chǎn)品完成,包括:   (1) SWIFTAlliance Access and Entry:傳送FIN信息的接口軟件;   (2) SWIFTAlliance Gateway:接入SWIFTNet的窗口軟件;   (3) SWIFTAlliance Webstation:接入SWIFTNet的桌面接入軟件;   (4) File Transfer Interface:文件傳輸接口軟件,通過(guò)SWIFTNet FileAct是用戶方便的訪問(wèn)其后臺(tái)辦公系統(tǒng)。   SWIFTNET Link軟件內(nèi)嵌在SWIFTAlliance Gateway和SWIFTAlliance Webstation中,提供傳輸、標(biāo)準(zhǔn)化、安全和管理服務(wù)。連接后,它確保用戶可以用同一窗口多次訪問(wèn)SWIFTNet,獲得不同服務(wù)。

    標(biāo)簽: SWIFT 設(shè)計(jì)軟件

    上傳時(shí)間: 2014-12-03

    上傳用戶:huyiming139

  • Xilinx UltraScale:新一代架構(gòu)滿足您的新一代架構(gòu)需求(EN)

      中文版詳情瀏覽:http://www.elecfans.com/emb/fpga/20130715324029.html   Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture    The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications.   The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation.   Some of the UltraScale architecture breakthroughs include:   • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50%    • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability   • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization   • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard    • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets   • Greatly enhanced DSP and packet handling   The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.

    標(biāo)簽: UltraScale Xilinx 架構(gòu)

    上傳時(shí)間: 2013-11-21

    上傳用戶:wxqman

  • PCB Design Considerations and Guidelines for 0.4mm and 0.5mm WLPs

    Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsiderations and general recommendations for choosing a 0.4mm- or 0.5mm-pitch WLP for yourapplication.

    標(biāo)簽: Considerations Guidelines and Design

    上傳時(shí)間: 2013-11-09

    上傳用戶:ls530720646

  • Verilog_HDL的基本語(yǔ)法詳解(夏宇聞版)

            Verilog_HDL的基本語(yǔ)法詳解(夏宇聞版):Verilog HDL是一種用于數(shù)字邏輯電路設(shè)計(jì)的語(yǔ)言。用Verilog HDL描述的電路設(shè)計(jì)就是該電路的Verilog HDL模型。Verilog HDL既是一種行為描述的語(yǔ)言也是一種結(jié)構(gòu)描述的語(yǔ)言。這也就是說(shuō),既可以用電路的功能描述也可以用元器件和它們之間的連接來(lái)建立所設(shè)計(jì)電路的Verilog HDL模型。Verilog模型可以是實(shí)際電路的不同級(jí)別的抽象。這些抽象的級(jí)別和它們對(duì)應(yīng)的模型類型共有以下五種:   系統(tǒng)級(jí)(system):用高級(jí)語(yǔ)言結(jié)構(gòu)實(shí)現(xiàn)設(shè)計(jì)模塊的外部性能的模型。   算法級(jí)(algorithm):用高級(jí)語(yǔ)言結(jié)構(gòu)實(shí)現(xiàn)設(shè)計(jì)算法的模型。   RTL級(jí)(Register Transfer Level):描述數(shù)據(jù)在寄存器之間流動(dòng)和如何處理這些數(shù)據(jù)的模型。   門級(jí)(gate-level):描述邏輯門以及邏輯門之間的連接的模型。   開(kāi)關(guān)級(jí)(switch-level):描述器件中三極管和儲(chǔ)存節(jié)點(diǎn)以及它們之間連接的模型。   一個(gè)復(fù)雜電路系統(tǒng)的完整Verilog HDL模型是由若干個(gè)Verilog HDL模塊構(gòu)成的,每一個(gè)模塊又可以由若干個(gè)子模塊構(gòu)成。其中有些模塊需要綜合成具體電路,而有些模塊只是與用戶所設(shè)計(jì)的模塊交互的現(xiàn)存電路或激勵(lì)信號(hào)源。利用Verilog HDL語(yǔ)言結(jié)構(gòu)所提供的這種功能就可以構(gòu)造一個(gè)模塊間的清晰層次結(jié)構(gòu)來(lái)描述極其復(fù)雜的大型設(shè)計(jì),并對(duì)所作設(shè)計(jì)的邏輯電路進(jìn)行嚴(yán)格的驗(yàn)證。   Verilog HDL行為描述語(yǔ)言作為一種結(jié)構(gòu)化和過(guò)程性的語(yǔ)言,其語(yǔ)法結(jié)構(gòu)非常適合于算法級(jí)和RTL級(jí)的模型設(shè)計(jì)。這種行為描述語(yǔ)言具有以下功能:   · 可描述順序執(zhí)行或并行執(zhí)行的程序結(jié)構(gòu)。   · 用延遲表達(dá)式或事件表達(dá)式來(lái)明確地控制過(guò)程的啟動(dòng)時(shí)間。   · 通過(guò)命名的事件來(lái)觸發(fā)其它過(guò)程里的激活行為或停止行為。   · 提供了條件、if-else、case、循環(huán)程序結(jié)構(gòu)。   · 提供了可帶參數(shù)且非零延續(xù)時(shí)間的任務(wù)(task)程序結(jié)構(gòu)。   · 提供了可定義新的操作符的函數(shù)結(jié)構(gòu)(function)。   · 提供了用于建立表達(dá)式的算術(shù)運(yùn)算符、邏輯運(yùn)算符、位運(yùn)算符。   · Verilog HDL語(yǔ)言作為一種結(jié)構(gòu)化的語(yǔ)言也非常適合于門級(jí)和開(kāi)關(guān)級(jí)的模型設(shè)計(jì)。因其結(jié)構(gòu)化的特點(diǎn)又使它具有以下功能:   - 提供了完整的一套組合型原語(yǔ)(primitive);   - 提供了雙向通路和電阻器件的原語(yǔ);   - 可建立MOS器件的電荷分享和電荷衰減動(dòng)態(tài)模型。   Verilog HDL的構(gòu)造性語(yǔ)句可以精確地建立信號(hào)的模型。這是因?yàn)樵赩erilog HDL中,提供了延遲和輸出強(qiáng)度的原語(yǔ)來(lái)建立精確程度很高的信號(hào)模型。信號(hào)值可以有不同的的強(qiáng)度,可以通過(guò)設(shè)定寬范圍的模糊值來(lái)降低不確定條件的影響。   Verilog HDL作為一種高級(jí)的硬件描述編程語(yǔ)言,有著類似C語(yǔ)言的風(fēng)格。其中有許多語(yǔ)句如:if語(yǔ)句、case語(yǔ)句等和C語(yǔ)言中的對(duì)應(yīng)語(yǔ)句十分相似。如果讀者已經(jīng)掌握C語(yǔ)言編程的基礎(chǔ),那么學(xué)習(xí)Verilog HDL并不困難,我們只要對(duì)Verilog HDL某些語(yǔ)句的特殊方面著重理解,并加強(qiáng)上機(jī)練習(xí)就能很好地掌握它,利用它的強(qiáng)大功能來(lái)設(shè)計(jì)復(fù)雜的數(shù)字邏輯電路。下面我們將對(duì)Verilog HDL中的基本語(yǔ)法逐一加以介紹。

    標(biāo)簽: Verilog_HDL

    上傳時(shí)間: 2014-12-04

    上傳用戶:cppersonal

  • 《器件封裝用戶向?qū)А焚愳`思產(chǎn)品封裝資料

    Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.

    標(biāo)簽: 封裝 器件 用戶 賽靈思

    上傳時(shí)間: 2013-11-21

    上傳用戶:不懂夜的黑

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