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The ISO7220 and ISO7221 are dual-channel digital isolators. To facilitate PCB layout, the channels are orientedin the same direction in the ISO7220 and in opposite directions in the ISO7221. These devices have a logic inputand output buffer separated by TI’s silicon-dioxide (SiO2) isolation barrier, providing galvanic isolation of up to4000 V. Used in conjunction with isolated power supplies, these devices block high voltage, isolate grounds, andprevent noise currents on a data bus or other circuits from entering the local ground and interfering with ordamaging sensitive circuitry.
標簽：
ISOLATORS
DIGITAL
DUAL
上傳時間：
2013-10-24
上傳用戶：hbsunhui
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光盤內容1.1例 程 “例程”文件夾中為各章節的程序代碼，均在作者的目標板上（自行開發）調試通過，以確保程序正確。n Keil C對中文文件、目錄以及空格等可能無法編譯連接，所以若要正確調試，須確保所有文件、目錄為連續英文名或數字。n 這些程序應用到其他C8051Fxxx系列單片機時，要確保各個操作寄存器的名稱、地址與各個控制位相一致，否則需要修改。很多寄存器位的位置并不相同，所以移植程序時，使用者要參考F040寄存器和移植對象單片機的寄存器，以確保正確操作。1.2 原理圖及pcb封裝“原理圖及pcb封裝”文件夾里包含作者制作的C8051F040PCB封裝和原理圖引腳定義文件c8051f040.ddb。其中PCB封裝與silicon Laboratories公司（原Cygnal公司）提供的TQ100封裝稍有不同（在cygnalpcb文件中）： 作者所做引腳長為2.5 mm，而cygnalpcb文件中的引腳長為1.3 mm。加長引腳焊盤是為了方便手工焊芯片。用戶可根據需要和習慣選擇封裝。
標簽：
C8051F040
單片機開發
C語言編程
上傳時間：
2013-11-19
上傳用戶：
-
PK51是為8051系列單片機所設計的開發工具，支持所有8051系列衍生產品，，支持帶擴展存儲器和擴展指令集（例如Dallas390/5240/400,Philips 51MX,Analog Devices MicroConverters）的新設備,以及支持很多公司的一流的設備和IP內核,比如Analog Devices, Atmel, Cypress Semiconductor, Dallas Semiconductor, Goal, Hynix, Infineon, Intel, NXP(founded by Philips), OKI, silicon Labs,SMSC, STMicroeleectronics,Synopsis, TDK, Temic, Texas Instruments,Winbond等。通過PK51專業級開發工具，可以輕松地了解8051的On-chip peripherals與及其它關鍵特性。
標簽：
8051
pk
51
上傳時間：
2013-10-09
上傳用戶：1109003457
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Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
標簽：
封裝
器件
用戶
賽靈思
上傳時間：
2013-10-22
上傳用戶：ztj182002
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The field of microelectromechanical systems (MEMS), particularly micromachinedmechanical transducers, has been expanding over recent years, and the productioncosts of these devices continue to fall. Using materials, fabrication processes, anddesign tools originally developed for the microelectronic circuits industry, newtypes of microengineered device are evolving all the time—many offering numerousadvantages over their traditional counterparts. The electrical properties of siliconhave been well understood for many years, but it is the mechanical properties thathave been exploited in many examples of MEMS. This book may seem slightlyunusual in that it has four editors. However, since we all work together in this fieldwithin the School of Electronics and Computer Science at the University of Southampton,it seemed natural to work together on a project like this. MEMS are nowappearing as part of the syllabus for both undergraduate and postgraduate coursesat many universities, and we hope that this book will complement the teaching thatis taking place in this area.
標簽：
MEMS
教材
上傳時間：
2013-10-16
上傳用戶：朗朗乾坤
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Abstract: This reference design provides design ideas for a cost-effective, low-power liquid-level measurement dataacquisition system (DAS) using a compensated silicon pressure sensor and a high-precision delta-sigma ADC. Thisdocument discusses how to select the compensated silicon pressure sensor, suggest system algorithms, and providenoise analyses. It also describes calibration ideas to improve system performance while also reducing complexity andcost.
標簽：
如何選擇
補償
硅壓力傳感器
上傳時間：
2013-10-08
上傳用戶：sjy1991
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Keil C51 V8 專業開發工具（PK51）
PK51是為8051系列單片機所設計的開發工具，支持所有8051系列衍生產品，，支持帶擴展存儲器和擴展指令集（例如Dallas390/5240/400,Philips 51MX,Analog Devices MicroConverters）的新設備,以及支持很多公司的一流的設備和IP內核,比如Analog Devices, Atmel, Cypress Semiconductor, Dallas Semiconductor, Goal, Hynix, Infineon, Intel, NXP(founded by Philips), OKI, silicon Labs,SMSC, STMicroeleectronics,Synopsis, TDK, Temic, Texas Instruments,Winbond等。
通過PK51專業級開發工具，可以輕松地了解8051的On-chip peripherals與及其它關鍵特性。
The PK51專業級開發工具包括…
l μVision
Ø 集成開發環境
Ø 調試器
Ø 軟件模擬器
l Keil 8051擴展編譯工具
Ø AX51宏匯編程序
Ø ANSI C編譯工具
Ø LX51 連接器
Ø OHX51 Object-HEX 轉換器
l Keil 8051編譯工具
Ø A51宏匯編程序
Ø C51 ANSI C編譯工具
Ø BL51 代碼庫連接器
Ø OHX51 Object-HEX 轉換器
Ø OC51 集合目標轉換器
l 目標調試器
Ø FlashMON51 目標監控器
Ø MON51目標監控器
Ø MON390 (Dallas 390)目標監控器
Ø MONADI (Analog Devices 812)目標監控器
Ø ISD51 在系統調試
l RTX51微實時內核
你應該考慮PK51開發工具包,如果你…
l 需要用8051系列單片機來開發
l 需要開發 Dallas 390 或者 Philips 51MX代碼
l 需要用C編寫代碼
l 需要一個軟件模擬器或是沒有硬件仿真器
l 需要在單芯片上基于小實時內核創建復雜的應用
標簽：
C51
V8
開發工具
上傳時間：
2013-10-30
上傳用戶：yy_cn
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The super-junction structure, which has P-type pillar layers as shown left,
realizes high withstand voltage and ON-resistance lower than the conventional
theoretical limit of silicon.
標簽：
場效應管
產品指南
上傳時間：
2014-12-31
上傳用戶：qwer0574
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Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
標簽：
封裝
器件
用戶
賽靈思
上傳時間：
2013-11-21
上傳用戶：不懂夜的黑
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silicon Motion, Inc. has made best efforts to ensure that the information contained in this document is accurate andreliable. However, the information is subject to change without notice. No responsibility is assumed by siliconMotion, Inc. for the use of this information, nor for infringements of patents or other rights of third parties.Copyright NoticeCopyright 2002, silicon Motion, Inc. All rights reserved. No part of this publication may be reproduced, photocopied,or transmitted in any form, without the prior written consent of silicon Motion, Inc. silicon Motion, Inc. reserves theright to make changes to the product specification without reservation and without notice to our users
標簽：
GUIDELINES
LAYOUT
320
PCB
上傳時間：
2013-10-10
上傳用戶：manga135
